CN-121988894-A - Substrate processing apparatus and substrate processing method

Abstract

The application provides a substrate processing apparatus and a substrate processing method. The substrate processing apparatus includes an encoder configured to measure a substrate transfer speed and a substrate transfer position of a substrate being transferred, a scanner configured to scan one surface of the substrate at predetermined time intervals using light, and a scanner control unit configured to control a scan trajectory based on the substrate transfer speed and the substrate transfer position, wherein the scanner control unit keeps the scan trajectory constant regardless of a change in the substrate transfer speed by changing the scan speed of the scanner in real time.

Inventors

• GAO TAIYONG

Assignees

• 三星SDI株式会社

Dates

Publication Date

20260508

Application Date

20251013

Priority Date

20241108

Claims (20)

1. 1. A substrate processing apparatus comprising: an encoder configured to measure a substrate transfer speed and a substrate transfer position of a substrate being transferred; a scanner configured to scan one surface of the substrate at predetermined time intervals using light, and A scanner control unit configured to control a scanning trajectory based on the substrate transfer speed and the substrate transfer position, Wherein the scanner control unit keeps the scanning trajectory constant irrespective of the change in the substrate conveyance speed by changing the scanning speed of the scanner in real time.
2. 2. The substrate processing apparatus according to claim 1, wherein the substrate processing trajectory of the scanner control unit comprises: a first processing track for processing in a direction from one side of the substrate toward the inside of the substrate; a second processing track for processing the substrate in the length direction of the substrate, and A third processing track for processing in a direction from the interior of the substrate toward the one side of the substrate, Wherein the substrate is processed in the order of the first processing track, the second processing track, and the third processing track, and the substrate is repeatedly processed according to the substrate processing track.
3. 3. The substrate processing apparatus according to claim 2, wherein: The scanner control unit is configured to keep the scanning trajectory and the substrate processing trajectory constant irrespective of a change in the substrate transfer speed by controlling the scanning speed to allow a relative speed, which is a ratio between the substrate transfer speed and the scanning speed, and The scanning speed is a scanning speed of the light corresponding to the first processing track or the third processing track.
4. 4. The substrate processing apparatus of claim 2, wherein the substrate is cut along the substrate processing track to form an electrode plate.
5. 5. The substrate processing apparatus according to claim 2, wherein the scanning speed of the scanner corresponding to the second processing track is zero.
6. 6. The substrate processing apparatus according to claim 2, wherein the first processing track and the third processing track are each parallel to a width direction of the substrate.
7. 7. The substrate processing apparatus according to claim 2, wherein: The substrate includes a composite portion having a portion of one surface coated with a composite material and an uncoated portion located outside the one surface, The first processing track starts from one side of the uncoated portion, and The third processing trajectory ends at the one side of the uncoated portion.
8. 8. The substrate processing apparatus of claim 7, wherein the second processing track is located within the composite portion.
9. 9. The substrate processing apparatus according to claim 1, wherein: a pattern holder having a through hole corresponding to the scanning trace of the light is located at the bottom of the substrate, and The light passes through the through hole of the pattern jig.
10. 10. The substrate processing apparatus according to claim 9, further comprising: And a suction part configured to suck processing chips of the substrate through the through hole of the pattern jig, wherein the suction part is located at a lower side of the pattern jig.
11. 11. The substrate processing apparatus according to claim 9, further comprising: a beam dump configured to attenuate an intensity of the light passing through the through hole of the pattern clamp, wherein the beam dump is located on an underside of the pattern clamp.
12. 12. The substrate processing apparatus according to claim 1, further comprising: a light control device, wherein the light control device controls an output or pulse repetition rate of the light in real time according to a change of the scanning speed of the light.
13. 13. A method for processing a substrate, the method comprising: measuring a substrate transfer speed and a substrate transfer position of the substrate by an encoder; scanning one surface of the substrate with light at predetermined time intervals by a scanner, and A scanning trajectory is controlled by a scanner control unit based on the substrate transfer speed and the substrate transfer position, Wherein the scanner control unit keeps the scanning trajectory constant irrespective of the change in the substrate conveyance speed by changing the scanning speed of the scanner in real time.
14. 14. The method of claim 13, wherein controlling the scan trajectory comprises: inputting a processing track length and a relative speed of the substrate, and Generating a scanning track corresponding to the length of the processing track, Wherein generating the scan trajectory includes controlling the scan speed of the scanner to allow a relative speed, which is a ratio between the substrate transfer speed and the scan speed of the scanner, to remain constant.
15. 15. The method of claim 14, wherein, in generating the scan trajectory corresponding to the processing trajectory length, a substrate processing trajectory comprises: a first processing track for processing in a direction from one side of the substrate toward the inside of the substrate; a second processing track for processing the substrate in the length direction of the substrate, and A third processing track for processing in a direction from the interior of the substrate toward the one side of the substrate, Wherein the substrate is processed in the order of the first processing track, the second processing track, and the third processing track, and the substrate is repeatedly processed in accordance with the substrate processing track.
16. 16. The method according to claim 13, wherein: a pattern holder having a through hole corresponding to the scanning trace of the light is located at the bottom of the substrate, and The light passes through the through hole of the pattern jig.
17. 17. The method according to claim 15, wherein: the substrate is cut along the substrate processing track to form an electrode plate.
18. 18. The method of claim 15, wherein the scan speed of the scanner corresponding to the second processing track is zero when generating the scan track corresponding to the processing track length.
19. 19. The method according to claim 15, wherein: The substrate includes a composite portion having a portion of one surface coated with a composite material and an uncoated portion located outside the one surface, The first processing track starts from one side of the uncoated portion, and The third processing trajectory ends at the one side of the uncoated portion.
20. 20. The method of claim 19, wherein the second processing trajectory is within the composite portion.

Description

Substrate processing apparatus and substrate processing method Technical Field The present disclosure relates to a substrate processing apparatus and a substrate processing method. Background The secondary battery may be completed by manufacturing an electrode by coating an electrode mixture including an electrode active material, a conductive material, and a binder on an electrode current collector, laminating the electrode with a separator, and then embedding and sealing the electrode together with an electrolyte in a battery case. During the electrode manufacturing process, the composite material may be coated on an electrode current collector in the form of a long sheet, and the resulting substrate may be grooved to process an electrode tab and then cut to a desired size to make an electrode plate. The above information disclosed in this background section is for enhancement of understanding of the background of the disclosure and, therefore, it may contain information that does not form a related (or prior) art. Disclosure of Invention Embodiments include a substrate processing apparatus including an encoder configured to measure a substrate transfer speed and a substrate transfer position of a substrate being transferred, a scanner configured to scan one surface of the substrate at predetermined time intervals using light, and a scanner control unit configured to control a scan trajectory based on the substrate transfer speed and the substrate transfer position, wherein the scanner control unit keeps the scan trajectory constant regardless of a change in the substrate transfer speed by changing the scan speed of the scanner in real time. The substrate processing track of the scanner control unit may include a first processing track that processes in a direction from one side of the substrate toward the inside of the substrate, a second processing track that processes in a length direction of the substrate within the substrate, and a third processing track that processes in a direction from the inside of the substrate toward the one side of the substrate, wherein the substrate processes in the order of the first processing track, the second processing track, and the third processing track, and the substrate repeatedly processes according to the substrate processing track. The scanner control unit may be configured to maintain the scanning trajectory and the substrate processing trajectory constant irrespective of a change in the substrate transfer speed by controlling the scanning speed to allow the relative speed, which is a ratio between the substrate transfer speed and the scanning speed, to be constant, and the scanning speed may be a scanning speed of light corresponding to the first processing trajectory or the third processing trajectory. The substrate may be cut along a substrate processing track to form electrode plates. The scan speed of the scanner corresponding to the second processing track may be zero. The first processing track and the third processing track may each be parallel to the width direction of the substrate. The substrate may include a composite portion of which a portion of one surface is coated with the composite material and an uncoated portion located outside the one surface, the first processing trace may start from a side of the uncoated portion, and the third processing trace may end at the side of the uncoated portion. The second processing trajectory may be located within the composite portion. A pattern jig having a through hole corresponding to the scanning trace of the light may be located at the bottom of the substrate, and the light may pass through the through hole of the pattern jig. The substrate processing apparatus may further include a suction part configured to suck processing chips of the substrate through the through-hole of the pattern jig, wherein the suction part is located at the lower side of the pattern jig. The substrate processing apparatus may further include a beam dump configured to attenuate intensity of light passing through the through hole of the pattern holder, wherein the beam dump is located at an underside of the pattern holder. The substrate processing apparatus may further include a light control device, wherein the light control device controls the output of the light or the pulse repetition rate in real time according to a change in the scanning speed of the light. Embodiments include a method for processing a substrate, the method including measuring a substrate transfer speed and a substrate transfer position of the substrate by an encoder, scanning one surface of the substrate with light at predetermined time intervals by a scanner, and controlling a scanning trajectory based on the substrate transfer speed and the substrate transfer position by a scanner control unit, wherein the scanner control unit keeps the scanning trajectory constant regardless of a change in the substrate transfer speed by changing the scanning speed of t