CN-121988916-A - Substrate processing apparatus and substrate processing method

CN121988916ACN 121988916 ACN121988916 ACN 121988916ACN-121988916-A

Abstract

The application provides a substrate processing apparatus and a substrate processing method. The substrate processing device comprises a fixing module and a processing module. The holding module comprises a plurality of guard plate assemblies, a plurality of adhesive objects and a plurality of clamping assemblies. The plurality of shield assemblies are configured to clamp a substrate to be processed having a pre-processing position. The plurality of stickers are arranged on the plurality of guard plate assemblies and are configured to be used for adhering a substrate to be processed. The plurality of clamping assemblies are configured to clamp the plurality of shield assemblies to the substrate to be processed. A machining module corresponds to one of the shield assemblies, the machining module being configured to generate a focused laser beam and project toward the pre-machining location. Therefore, the substrate processing device and the substrate processing method can improve the processing quality and the yield of the hole structure.

Inventors

LIN SHISHENG
YOU ZHIWEI

Assignees

聚嵘科技股份有限公司

Dates

Publication Date: 20260508
Application Date: 20241108

Claims (11)

1. A substrate processing apparatus, characterized by comprising: a retention module, comprising: A plurality of shield assemblies configured to clamp at least one substrate to be processed, the at least one substrate to be processed having at least one pre-processing location; A plurality of stickers disposed on the plurality of shield assemblies, the plurality of stickers configured to adhere the at least one substrate to be processed, and A plurality of clamping assemblies configured to clamp the plurality of shield assemblies with the at least one substrate to be processed, and A machining module corresponding to one of the shield assemblies, the machining module configured to generate a focused laser beam and project toward the at least one pre-machining location; Wherein each adhesive is adjacent to the outer side of the corresponding guard plate assembly or the outer side of the at least one substrate to be processed, or each adhesive is positioned at the at least one pre-processing position, or each adhesive surrounds the at least one pre-processing position.
2. The substrate processing apparatus of claim 1, wherein each of the shield assemblies is a transparent sheet material and the plurality of shield assemblies and the at least one substrate to be processed are of a homogeneous material, wherein each of the stickers is a water or polymeric sticker, and wherein the processing module comprises: The laser emission component is used for providing at least one pulse laser beam, wherein the pulse width of the at least one pulse laser beam is 50-500 fs, the repetition frequency of the at least one pulse laser beam is 0.5-10 GHz, and the pulse energy of the at least one pulse laser beam is 100-1000 mu J; A beam adjustment assembly corresponding to the laser emitting assembly, the beam adjustment assembly configured to receive the at least one pulsed laser beam and to convert the at least one pulsed laser beam into a modulated laser beam; A scanning assembly corresponding to the beam adjustment assembly, the scanning assembly configured to receive the modulated laser beam and to selectively project the modulated laser beam in at least one projection direction, and A focusing assembly, responsive to the beam adjustment assembly, the focusing assembly configured to receive and focus the modulated laser beam to produce the focused laser beam having a predetermined aspect ratio and project the focused laser beam toward the at least one pre-machining location.
3. The substrate processing apparatus according to claim 1, further comprising: a control module connecting the clamping assembly and the processing module, and An image acquisition module coupled to the control module, the image acquisition module configured to acquire an image of the at least one pre-processing location of the at least one substrate to be processed.
4. The substrate processing apparatus according to claim 1, further comprising: a control module connecting the clamping assembly and the processing module, and The monitoring module is connected with the control module and is configured to monitor the drilling state of the at least one substrate to be processed, and the monitoring module detects the morphological parameters of the at least one substrate to be processed by using the monitoring lasers with different delay times so as to monitor the drilling state of the at least one substrate to be processed in real time.
5. The substrate processing apparatus according to claim 4, wherein the monitoring module includes a light emitting unit that emits a first laser beam and a second laser beam toward the at least one substrate to be processed, a light receiving unit that includes: A first sensor located at a first side of the at least one substrate to be processed, the first sensor receiving reflected light of the first laser beam reflected by the at least one substrate to be processed to generate a reflected signal, and A second sensor located at a second side of the at least one substrate to be processed, the light emitting unit emitting the second laser beam toward the at least one substrate to be processed, the second sensor receiving a penetrating light of the second laser beam through the at least one substrate to be processed to generate a penetrating signal; Wherein the image processing unit is electrically connected with the first sensor and the second sensor, and is configured to receive the reflected signal and generate a first detection map and receive the transmitted signal and generate a second detection map; wherein the first sensor is connected with a first moving device so as to move the first sensor in a three-dimensional space; Wherein the second sensor is connected with a second moving device so as to move the second sensor in the three-dimensional space; the light emitting unit is connected with the laser moving device so as to move in the three-dimensional space.
6. The substrate processing apparatus according to claim 5, wherein the first laser beam and the second laser beam have a wavelength range of 300 to 2000nm, and the first laser beam and the second laser beam have a pulse width range of 50fs to 50ns.
7. The substrate processing apparatus according to claim 5, wherein the image processing unit is a waveform generator; The first sensor and the second sensor are optical wavefront sensors, the first detection map is a first detection waveform map, the second detection map is a second detection waveform map, or the first sensor and the second sensor are laser vibrometers, the reflected signals are reflected ultrasonic waves, the transmitted signals are transmitted ultrasonic waves, the first detection map is a first waveform map, and the second detection map is a second waveform map.
8. The apparatus of claim 5, wherein the first sensor and the second sensor are photoelastic sensors, the first detection map is a first stress distribution feature map, the second detection map is a second stress distribution feature map, or the first sensor and the second sensor are hyperspectral sensors, the image processing unit is a hyperspectral generator, the first detection map is a first detection spectrum map, and the second detection map is a second detection spectrum map.
9. The substrate processing apparatus of claim 5, further comprising an artificial intelligence module for learning and pre-training drilling parameters of the at least one substrate to be processed, and automatically selecting an appropriate monitoring module and optimally setting a plurality of monitoring parameters of the monitoring module according to characteristics of the at least one substrate to be processed, wherein the artificial intelligence module comprises: the database unit is provided with relevant data materials of the type, shape, size, thickness and density of the at least one substrate to be processed, wherein the database unit is connected to a cloud platform through the Internet to update the relevant data materials; The learning training unit is connected with the database unit and performs learning and pre-training according to related data in the database unit through a deep learning algorithm; A parameter optimizing setting unit connected with the database unit for optimizing setting of the drilling parameters according to the related data of the type, shape, size, thickness and density of the at least one substrate to be processed, and And the monitoring module setting unit is connected with the database unit to select a proper monitoring module according to the related data of the type, shape, size, thickness and density of the at least one substrate to be processed.
10. The substrate processing apparatus of claim 1, further comprising a cleaning module comprising a gas source and a gas nozzle connected to the gas source to supply a cleaning substance to the holding module or the at least one substrate to be processed to remove impurities on the holding module or the at least one substrate to be processed.
11. A substrate processing method, characterized in that the substrate processing method comprises the steps of: Applying a plurality of adhesives to at least one substrate to be processed; clamping the at least one substrate to be processed through a plurality of guard plate assemblies; Clamping the plurality of shield assemblies and the at least one substrate to be processed with a plurality of clamping assemblies, and Generating a focused laser beam through a processing module and projecting the focused laser beam towards at least one pre-processing position of the at least one substrate to be processed so as to form a hole on the at least one substrate to be processed; wherein each adhesive is adjacent to the outer side of the corresponding guard plate assembly or the outer side of the at least one substrate to be processed, or each adhesive is positioned at the at least one pre-processing position, or each adhesive surrounds the at least one pre-processing position.

Description

Substrate processing apparatus and substrate processing method Technical Field The present application relates to a substrate processing apparatus and a substrate processing method, and more particularly, to a substrate processing apparatus and a substrate processing method for preventing a processing position from being broken. Background As technology advances, substrates used in the electronics industry are increasingly miniaturized. In addition, the substrate drilling method has also been developed from the conventional drilling (drill) method to a laser machining method instead. However, in the conventional laser processing technique, delamination tends to occur in a drilled hole after processing (for example, drilling) a substrate, and micro defects such as chipping, burrs, cracking, and cracking tend to occur because a heat affected zone of the processed composite material is large. Therefore, how to overcome the above-mentioned drawbacks by improving the structural design has become one of the important issues to be solved in the art. Disclosure of Invention The application aims to solve the technical problem of providing a substrate processing device and a substrate processing method aiming at the defects in the prior art. In order to solve the above technical problems, one of the technical solutions adopted in the present application is to provide a substrate processing apparatus, which includes a holding module and a processing module. The holding module comprises a plurality of guard plate assemblies, a plurality of adhesive objects and a plurality of clamping assemblies. The plurality of shield assemblies are configured to clamp at least one substrate to be processed having at least one pre-processing position. A plurality of stickers are disposed on the plurality of shield assemblies, the plurality of stickers configured to adhere the at least one substrate to be processed. A plurality of clamping assemblies are configured to clamp the plurality of shield assemblies with the at least one substrate to be processed. A machining module corresponds to one of the shield assemblies, the machining module being configured to generate a focused laser beam and project toward the at least one pre-machining location. Wherein each adhesive is adjacent to the outer side of the corresponding guard plate assembly or the outer side of the at least one substrate to be processed, or each adhesive is positioned at the at least one pre-processing position, or each adhesive surrounds the at least one pre-processing position. In one possible or alternative embodiment, each of the shield assemblies is a transparent sheet material. Wherein each of the adhesives is water or a polymeric adhesive. The processing module comprises a laser emission component, a light beam adjusting component, a scanning component and a focusing component. The laser emission component is used for providing at least one pulse laser beam, wherein the pulse width of the at least one pulse laser beam is 50-500 fs, the repetition frequency of the at least one pulse laser beam is 0.5-10 GHz, and the pulse energy of the at least one pulse laser beam is 100-1000 mu J. A beam adjustment assembly corresponds to the laser emitting assembly, the beam adjustment assembly being configured for receiving the at least one pulsed laser beam and for converting the at least one pulsed laser beam into a modulated laser beam. A scanning assembly corresponds to the beam adjustment assembly, the scanning assembly being configured for receiving the modulated laser beam and for selectively projecting the modulated laser beam in at least one projection direction. A focusing assembly corresponds to the beam adjustment assembly, the focusing assembly being configured to receive and focus the modulated laser beam to produce the focused laser beam having a predetermined aspect ratio and project the focused laser beam toward the at least one pre-machining location. In one possible or alternative embodiment, the substrate processing apparatus further comprises a control module and an image acquisition module. The control module is connected with the clamping assembly and the processing module. An image acquisition module is coupled to the control module, the image acquisition module configured to acquire an image of the at least one pre-processing location of the at least one substrate to be processed. In one possible or alternative embodiment, the substrate processing apparatus further comprises a control module and a monitoring module. The control module is connected with the clamping assembly and the processing module. The monitoring module is connected with the control module and is configured to monitor the drilling state of the at least one substrate to be processed, and the monitoring module detects morphological parameters of the at least one substrate to be processed by using the monitoring lasers with different delay times so as to monitor the drilling state of th