CN-121988917-A - Laser processing apparatus and method for manufacturing electronic device

Abstract

A laser processing apparatus according to an aspect of the present disclosure performs hole processing on a workpiece using a pulse laser beam output from a laser apparatus, the laser processing apparatus including a Z-polarization plate disposed on an optical path of the pulse laser beam to convert a polarization state of the pulse laser beam into azimuth polarization, a diffraction optical element dividing the azimuth polarized pulse laser beam transmitted through the Z-polarization plate into a plurality of laser beams, and a condensing optical system for condensing the plurality of laser beams to generate a plurality of condensed spots on the workpiece.

Inventors

• TANAKA TOMONARI

Assignees

• 极光先进雷射株式会社

Dates

Publication Date

20260508

Application Date

20251009

Priority Date

20241107

Claims (20)

1. 1. A laser processing apparatus for processing a hole in an object to be processed by using a pulse laser beam outputted from a laser apparatus, The laser processing device is provided with: a Z polarizer disposed on an optical path of the pulsed laser beam and configured to convert a polarization state of the pulsed laser beam into azimuth polarization; A diffraction optical element for dividing the pulsed laser light polarized in the azimuth after passing through the Z-polarization plate into a plurality of laser light, and And a condensing optical system for condensing the plurality of laser beams to generate a plurality of condensed spots on the workpiece.
2. 2. The laser processing apparatus according to claim 1, wherein, The Z polarizer is arranged with its center coincident with the optical axis of the pulsed laser.
3. 3. The laser processing apparatus according to claim 1, wherein, The diffractive optical element is arranged with its center coincident with the optical axis of the pulsed laser light.
4. 4. The laser processing apparatus according to claim 1, wherein, The Z polarizer is configured by combining a plurality of 1/2 wavelength plates having different directions of optical axes.
5. 5. The laser processing apparatus according to claim 4, wherein, The number of the plurality of 1/2 wavelength plates is 4 or more and 12 or less.
6. 6. The laser processing apparatus according to claim 1, wherein, The pulsed laser light output from the laser device is linearly polarized light, The pulse laser light of linear polarization is incident on the Z-polarization plate.
7. 7. The laser processing apparatus according to claim 1, wherein, The laser processing apparatus includes a rotary table that holds the Z-polarization plate rotatably about an optical axis of the pulse laser beam.
8. 8. The laser processing apparatus according to claim 7, wherein, The Z polarizer is arranged with a center coincident with the rotation axis.
9. 9. The laser processing apparatus according to claim 1, wherein, The laser processing device includes a first moving stage that holds the Z-polarization plate so as to be movable in a direction orthogonal to an optical axis of the pulse laser.
10. 10. The laser processing apparatus according to claim 1, wherein, The laser processing device includes a second moving stage that holds the diffractive optical element so as to be movable in a direction orthogonal to an optical axis of the pulse laser beam.
11. 11. The laser processing apparatus according to claim 1, wherein, The Z-polarizing plate is a polarization converter in which the polarization direction of the azimuthal polarization is set to be a direction along the circumference.
12. 12. The laser processing apparatus according to claim 1, wherein, The Z-polarizer and the diffractive optical element are integrated into a multi-point polarization converter.
13. 13. The laser processing apparatus according to claim 12, wherein, The multi-point polarization transformer has a substrate, The Z polarizer and the diffractive optical element are formed in the substrate.
14. 14. The laser processing apparatus according to claim 13, wherein, The Z-polarizer is formed along the incident surface of the substrate, The diffractive optical element is formed along an exit surface of the substrate.
15. 15. The laser processing apparatus according to claim 13, wherein, The Z-polarizer is formed inside the substrate, The diffractive optical element is formed along an exit surface of the substrate.
16. 16. The laser processing apparatus according to claim 13, wherein, The Z-polarizer is formed along the exit face of the substrate, The diffractive optical element is formed along an exit surface of the substrate.
17. 17. The laser processing apparatus according to claim 13, wherein, The Z-polarizer is formed along the incident surface of the substrate, The diffractive optical element is formed along an incident surface of the substrate.
18. 18. The laser processing apparatus according to claim 12, wherein, The laser processing apparatus includes a rotary table that holds the multi-point polarization converter rotatably about an optical axis of the pulse laser beam as a rotation axis.
19. 19. The laser processing apparatus according to claim 12, wherein, The laser processing device includes a moving stage that holds the multi-point polarization converter so as to be movable in a direction orthogonal to an optical axis of the pulse laser.
20. 20. A method of manufacturing an electronic device, comprising the steps of: the interposer is manufactured by laser processing the interposer substrate by a laser processing device, The interposer is electrically coupled to the integrated circuit chip in combination, The interposer and the circuit board are combined and electrically connected to each other, The laser processing device uses the pulse laser output from the laser device to process the hole of the processed object, The laser processing device is provided with: a Z polarizer disposed on an optical path of the pulsed laser beam and configured to convert a polarization state of the pulsed laser beam into azimuth polarization; A diffraction optical element for dividing the pulsed laser light polarized in the azimuth after passing through the Z-polarization plate into a plurality of laser light, and And a condensing optical system for condensing the plurality of laser beams to generate a plurality of condensed spots on the workpiece.

Description

Laser processing apparatus and method for manufacturing electronic device Technical Field The present disclosure relates to a laser processing apparatus and a method of manufacturing an electronic device. Background In recent years, in semiconductor exposure apparatuses, resolution improvement has been demanded with miniaturization and high integration of semiconductor integrated circuits. Therefore, the wavelength of the light emitted from the exposure light source is being shortened. For example, as a gas laser device for exposure, a KrF excimer laser device that outputs laser light having a wavelength of about 248.4nm and an ArF excimer laser device that outputs laser light having a wavelength of about 193.4nm are used. In addition, the excimer laser has a pulse width of about 10ns and a short wavelength, and is therefore sometimes used for direct processing of polymer materials, glass materials, and the like. Chemical bonds in the polymer material can be cleaved by an excimer laser having a photon energy higher than the bond energy. Therefore, it is known that the non-heating processing of the polymer material can be performed by using an excimer laser, and the processing shape becomes uniform. Further, since it is known that glass, ceramics, and the like have high absorptivity of an excimer laser, even a material which is difficult to process by a visible light laser or an infrared laser can be processed by an excimer laser. Prior art literature Patent literature Patent document 1 specification of U.S. Pat. No. 7880117 Patent document 2 Japanese patent application laid-open No. 2022-060850 Patent document 3 International publication No. 2023/099946 Disclosure of Invention A laser processing apparatus according to an aspect of the present disclosure performs hole processing on a workpiece using a pulse laser beam output from a laser apparatus, the laser processing apparatus including a Z-polarization plate disposed on an optical path of the pulse laser beam to convert a polarization state of the pulse laser beam into azimuth polarization, a diffraction optical element dividing the azimuth polarized pulse laser beam transmitted through the Z-polarization plate into a plurality of laser beams, and a condensing optical system for condensing the plurality of laser beams to generate a plurality of condensed spots on the workpiece. A method for manufacturing an electronic device according to one aspect of the present disclosure includes the steps of forming an interposer by laser processing an interposer substrate using a laser processing apparatus, electrically connecting the interposer and an integrated circuit chip to each other, The laser processing device includes a Z-polarization plate disposed on an optical path of the pulse laser beam to convert a polarization state of the pulse laser beam into azimuth polarization, a diffraction optical element dividing the azimuth polarized pulse laser beam transmitted through the Z-polarization plate into a plurality of laser beams, and a condensing optical system for condensing the plurality of laser beams to generate a plurality of condensed spots on the object to be processed. Drawings Hereinafter, several embodiments of the present disclosure will be described, by way of example only, with reference to the accompanying drawings. Fig. 1 is a diagram schematically showing the structure of a laser processing system of a comparative example. Fig. 2 is a diagram schematically showing the structure of the laser device. Fig. 3 is a diagram schematically showing the structure of the laser processing system according to the first embodiment. Fig. 4 is a diagram showing a configuration example of the Z-polarizing plate. Fig. 5 is a diagram showing the function of the Z-polarizer. Fig. 6 is a diagram illustrating the adjustment of the position of the Z-polarizing plate. Fig. 7 is a view showing an example of laser light incident on the inner wall of the hole during hole processing. Fig. 8 is a view showing an example of laser light incident on the inner wall of the hole during hole processing. Fig. 9 is a diagram illustrating the polarization state of the inner wall in the case where linearly polarized laser light is incident on the hole. Fig. 10 is a diagram illustrating the polarization state of the inner wall in the case where laser light polarized in the azimuth enters the hole. Fig. 11 is a diagram showing a structure of a Z-polarizing plate according to a modification. Fig. 12 is a diagram showing the function of the Z-polarizing plate according to the modification. Fig. 13 is a diagram schematically showing the structure of a laser processing system according to the second embodiment. Fig. 14 is a diagram showing a configuration example of the multi-point polarization converter. Fig. 15 is a diagram showing a configuration of a multipoint polarization converter according to the first modification. Fig. 16 is a diagram showing a configuration of a multipoint polariz