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CN-121988995-A - Method and device for manufacturing chip heat dissipation element, electronic equipment and storage medium

CN121988995ACN 121988995 ACN121988995 ACN 121988995ACN-121988995-A

Abstract

The application discloses a manufacturing method and device of a chip heat dissipation part, electronic equipment and a storage medium, and relates to the technical field of chip heat dissipation part production. Firstly controlling a forging and pressing assembly to forge and press copper block raw materials to obtain an initial forming part, then carrying the initial forming part to a cutting assembly through a clamping carrying assembly, shooting the initial forming part through a shooting assembly to obtain a first image, obtaining first profile information of a first bending convex part and second profile information of a second bending convex part based on the first image, and then controlling the cutting assembly to cut so as to enable a first channel to be formed in the first bending convex part, and forming a second channel in the second bending convex part. And controlling the cutting assembly to cut the annular groove so as to form a first straight groove communicated with the first channel and a second straight groove communicated with the second channel on the bottom wall of the annular groove. Therefore, the manufacture of the chip radiating piece is automatically completed, manual assistance is not needed in the whole process, and the production efficiency can be improved.

Inventors

  • HE DONGMEI
  • ZENG JIE

Assignees

  • 东莞市万富鑫智能装备有限公司

Dates

Publication Date
20260508
Application Date
20260327

Claims (10)

  1. 1. The manufacturing method of the chip heat dissipation part is characterized by being applied to heat dissipation part manufacturing equipment, wherein the heat dissipation part manufacturing equipment comprises a forging and pressing assembly, a clamping and conveying assembly, a cutting assembly and a shooting assembly; The manufacturing method of the chip heat dissipation part comprises the following steps: controlling the forging and pressing assembly to forge and press the copper block raw material to obtain an initial forming piece, wherein a first bending convex part and a second bending convex part are formed on the end face of the initial forming piece, and an annular groove is formed on the bottom face of the initial forming piece; controlling the clamping and carrying assembly to clamp the initial forming part from the forging and pressing assembly, carrying the initial forming part to the cutting assembly, and enabling the end surface of the initial forming part to face upwards; controlling the shooting assembly to shoot the end face of the initial forming part to obtain a first image, and obtaining first contour information of the first bending convex part and second contour information of the second bending convex part based on the first image; controlling the cutting assembly to cut the first bending convex part and the second bending convex part respectively based on the first profile information and the second profile information so as to form a first channel in the first bending convex part and form a second channel in the second bending convex part; The cutting assembly is controlled to cut the annular groove to form a first straight groove communicated with the first channel and a second straight groove communicated with the second channel in the bottom wall of the annular groove.
  2. 2. The method of manufacturing a chip heat spreader according to claim 1, wherein the first bending protrusion comprises a first straight protrusion and a second straight protrusion, one end of the first straight protrusion is connected to one end of the second straight protrusion, and the first straight protrusion is perpendicular to the second straight protrusion; the step of cutting the first bending convex part comprises the following steps: Determining a position of the first straight-line convex part and a length of the first straight-line convex part based on the first contour information; Determining a first cutting depth based on a length of the first linear protrusion; Controlling the clamping and conveying assembly to drive the initial forming piece based on the position of the first straight convex part, so that the end side surface of the first straight convex part is positioned on one side of the first cutter and opposite to the first cutter; The first tool drive assembly is controlled to cut the first linear protrusion based on the first cutting depth such that a cavity having a length of the first cutting depth is formed inside the first linear protrusion.
  3. 3. The method of manufacturing a chip heat sink according to claim 2, further comprising, after the controlling the first tool driving element to cut the first linear protrusion based on the first cutting depth so that a cavity having a length of the first cutting depth is formed inside the first linear protrusion: determining a length of the second straight-line convex part based on the first contour information; Determining a second depth of cut based on a length of the second linear protrusion; Controlling the clamping and carrying assembly to drive the initial forming part to rotate by 90 degrees so that the end side surface of the second linear convex part is positioned on one side of the first cutter and opposite to the first cutter; And controlling the first cutter driving assembly to cut the first linear convex part based on the second cutting depth, so that a cavity with the length of the second cutting depth is formed inside the second linear convex part, and the cavity inside the second linear convex part is communicated with the cavity inside the first linear convex part.
  4. 4. The method of manufacturing a chip heat spreader according to claim 2, wherein the second bending protrusion includes a third linear protrusion and a fourth linear protrusion, one end of the third linear protrusion is connected to one end of the fourth linear protrusion, and the third linear protrusion and the fourth linear protrusion are perpendicular to each other; the step of cutting the second bending convex part comprises the following steps: Determining a position of the third linear protrusion and a length of the third linear protrusion based on the second profile information; determining a third depth of cut based on a length of the third linear protrusion; controlling the clamping and conveying assembly to drive the initial forming piece based on the position of the third linear convex part so that the end side surface of the third linear convex part is positioned on one side of the first cutter and opposite to the first cutter; And controlling the first cutter driving assembly to cut the third linear convex part based on the third cutting depth so that a cavity with the length of the third cutting depth is formed inside the third linear convex part.
  5. 5. The method of manufacturing a chip heat sink according to claim 4, further comprising, after controlling the first tool driving element to cut the third linear protrusion based on the third cutting depth so that a cavity having a length of the third cutting depth is formed inside the third linear protrusion: Determining a length of the fourth straight-line convex part based on the second contour information; determining a second depth of cut based on a length of the fourth linear protrusion; controlling the clamping and carrying assembly to drive the initial forming part to rotate by 90 degrees so that the end side surface of the fourth linear convex part is positioned on one side of the first cutter and opposite to the first cutter; And controlling the first cutter driving assembly to cut the fourth linear protrusion based on the fourth cutting depth, so that a cavity with the length of the fourth cutting depth is formed inside the fourth linear protrusion, and the cavity inside the fourth linear protrusion is communicated with the cavity inside the third linear protrusion.
  6. 6. The method of manufacturing a chip heat sink according to claim 1, wherein controlling the cutting assembly to cut the annular groove to form a first straight groove communicating with the first passage and a second straight groove communicating with the second passage in a bottom wall of the annular groove comprises: Controlling the shooting assembly to shoot the bottom surface of the initial forming part to obtain a second image, and obtaining third profile information of the annular groove based on the second image; determining a first region in the bottom wall of the annular groove directly below the first channel and a second region in the bottom wall of the annular groove directly below the second channel based on the third profile information; And controlling the cutting assembly to cut the first region and the second region respectively so as to form the first straight groove in the first region and form the second straight groove in the second region.
  7. 7. The method of manufacturing a chip heat sink according to claim 6, wherein the cutting assembly comprises a second cutter and a second cutter driving assembly, the second cutter driving assembly being coupled to the second cutter; the controlling the cutting assembly to cut the first region and the second region respectively to form the first straight groove in the first region and the second straight groove in the second region includes: Determining a straight groove depth based on the third profile information and the first profile information; controlling the clamping and conveying assembly to drive the initial forming part to move based on the third profile information so that the first area is positioned on one side of the second cutter and opposite to the second cutter; Controlling the second cutter driving assembly to drive the second cutter to cut the first region based on the straight groove depth so as to form the first straight groove, wherein the depth of the first straight groove is the straight groove depth; Controlling the clamping and conveying assembly to drive the initial forming part to move based on the third profile information so that the second area is positioned on one side of the second cutter and opposite to the second cutter; And controlling the second cutter driving assembly to drive the second cutter to cut the second region based on the depth of the straight groove so as to form the second straight groove, wherein the depth of the second straight groove is the depth of the straight groove.
  8. 8. The manufacturing device of the chip heat dissipation part is characterized by being applied to heat dissipation part manufacturing equipment, wherein the heat dissipation part manufacturing equipment comprises a forging and pressing assembly, a clamping and conveying assembly, a cutting assembly and a shooting assembly; the manufacturing device of the chip heat dissipation part comprises: the forging module is used for controlling the forging assembly to forge the copper block raw material to obtain an initial forming piece, wherein a first bending convex part and a second bending convex part are formed on the end face of the initial forming piece, and an annular groove is formed on the bottom face of the initial forming piece; The conveying module is used for controlling the clamping and conveying assembly to clamp the initial forming part from the forging and pressing assembly, conveying the initial forming part to the cutting assembly and enabling the end face of the initial forming part to face upwards; the image module is used for controlling the shooting assembly to shoot the end face of the initial forming piece to obtain a first image, and obtaining first contour information of the first bending convex part and second contour information of the second bending convex part based on the first image; The first cutting control module is used for controlling the cutting assembly to cut the first bending convex part and the second bending convex part respectively based on the first profile information and the second profile information so as to form a first channel in the first bending convex part and form a second channel in the second bending convex part; And the second cutting control module is used for controlling the cutting assembly to cut the annular groove so as to form a first straight groove communicated with the first channel and a second straight groove communicated with the second channel on the bottom wall of the annular groove.
  9. 9. An electronic device comprising a memory storing a computer program and a processor that when executing the computer program implements the method of manufacturing a chip heat sink according to any one of claims 1 to 8.
  10. 10. A computer-readable storage medium storing a computer program, wherein the computer program, when executed by a processor, implements the method of manufacturing a chip heat sink according to any one of claims 1 to 8.

Description

Method and device for manufacturing chip heat dissipation element, electronic equipment and storage medium Technical Field The present application relates to the field of manufacturing chip heat dissipation devices, and in particular, to a method and apparatus for manufacturing a chip heat dissipation device, an electronic device, and a storage medium. Background Chips generate a lot of heat during operation, such as a CPU or GPU, which are essentially large digital integrated circuits made up of numerous transistors. When each transistor works, the corresponding high and low voltages can be judged and output according to the passing condition of current, certain heat is generated during the operation, and when the chip works at high efficiency, a large amount of heat is generated. This heat needs to be conducted out through a specific path to maintain the normal operating temperature of the chip, and therefore, in electronic devices, a chip heat sink is usually required to be equipped for dissipating heat from the chip to ensure that the chip is maintained at the normal operating temperature. However, the current manufacturing process of the chip heat dissipation element generally requires more personnel to perform manual auxiliary production, which results in reduced production efficiency. Disclosure of Invention The present application aims to solve at least one of the technical problems existing in the prior art. Therefore, the application provides a manufacturing method and device of a chip heat dissipation part, electronic equipment and a storage medium, which can realize automatic production of the chip heat dissipation part without manual assistance and can improve production efficiency. The manufacturing method of the chip heat dissipation element is applied to heat dissipation element manufacturing equipment, and the heat dissipation element manufacturing equipment comprises a forging component, a clamping and carrying component, a cutting component and a shooting component; The manufacturing method of the chip heat dissipation part comprises the following steps: controlling the forging and pressing assembly to forge and press the copper block raw material to obtain an initial forming piece, wherein a first bending convex part and a second bending convex part are formed on the end face of the initial forming piece, and an annular groove is formed on the bottom face of the initial forming piece; controlling the clamping and carrying assembly to clamp the initial forming part from the forging and pressing assembly, carrying the initial forming part to the cutting assembly, and enabling the end surface of the initial forming part to face upwards; controlling the shooting assembly to shoot the end face of the initial forming part to obtain a first image, and obtaining first contour information of the first bending convex part and second contour information of the second bending convex part based on the first image; controlling the cutting assembly to cut the first bending convex part and the second bending convex part respectively based on the first profile information and the second profile information so as to form a first channel in the first bending convex part and form a second channel in the second bending convex part; The cutting assembly is controlled to cut the annular groove to form a first straight groove communicated with the first channel and a second straight groove communicated with the second channel in the bottom wall of the annular groove. The manufacturing method of the chip heat dissipation part at least has the advantages that the forging and pressing assembly is controlled to forge and press the copper block raw material to obtain the initial forming part, then the initial forming part is conveyed to the cutting assembly through the clamping and conveying assembly, the initial forming part is shot through the shooting assembly to obtain a first image, the first contour information of the first bending convex part and the second contour information of the second bending convex part are obtained based on the first image, and then the cutting assembly is controlled to cut, so that a first channel is formed in the first bending convex part, and a second channel is formed in the second bending convex part. And controlling the cutting assembly to cut the annular groove so as to form a first straight groove communicated with the first channel and a second straight groove communicated with the second channel on the bottom wall of the annular groove. Therefore, the manufacture of the chip radiating piece is automatically completed, manual assistance is not needed in the whole process, and the production efficiency can be improved. In addition, the control of the cutting process mainly depends on contour information, the contour information is obtained from a first image, different chip heat dissipation parts are shot through a shooting assembly, then the contour information is determined