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CN-121989117-A - Polishing planetary wheel, double-sided polishing machine and polishing method

CN121989117ACN 121989117 ACN121989117 ACN 121989117ACN-121989117-A

Abstract

The invention discloses a polishing planetary gear, a double-sided polishing machine and a polishing method, wherein the polishing planetary gear comprises an outer wheel body, a polishing roller and a polishing roller, wherein the outer wheel body is matched with the double-sided polishing machine so as to integrally position the polishing planetary gear; the polishing device comprises a plurality of inner side wheel bodies, a positioning guide mechanism and a positioning guide mechanism, wherein the inner side wheel bodies are embedded in the accommodating holes one by one, clamping openings for placing substrates to be polished are formed in the inner side wheel bodies, the inner side wheel bodies rotate relative to the outer side wheel bodies so as to drive the substrates to rotate, and the positioning guide mechanism is arranged between the outer side wheel bodies and the inner side wheel bodies and is matched with the outer side wheel bodies and the inner side wheel bodies so as to guide the inner side wheel bodies to rotate relative to the outer side wheel bodies and further limit the movement track of the substrates to deviate. The invention can guide the inner wheel body in the polishing process, avoid the deviation of the inner wheel body, and reduce the motion friction interference, thereby stabilizing the rotation track of the inner wheel body, further reducing the processing deviation of the substrate and improving the surface flatness of the photomask glass substrate.

Inventors

  • NAKANISHI HIROSHI
  • WANG SHUDONG
  • LIU SHUWEI

Assignees

  • 擎方科技(济南)有限公司

Dates

Publication Date
20260508
Application Date
20260327

Claims (10)

  1. 1. A polishing star wheel, comprising: The outer wheel body is matched with the double-sided polishing machine so as to integrally position the polishing planetary wheel, and a plurality of containing holes are formed in the outer wheel body; The inner side wheel bodies are embedded in the accommodating holes one by one, clamping openings for placing the substrate to be polished are formed in the inner side wheel bodies, and the inner side wheel bodies rotate relative to the outer side wheel bodies so as to drive the substrate to rotate; the positioning guide mechanism is arranged between the outer wheel body and the inner wheel body, and is matched with the outer wheel body and the inner wheel body so as to guide the inner wheel body to rotate relative to the outer wheel body and further limit the movement track deviation of the substrate.
  2. 2. The polishing planetary wheel according to claim 1, wherein the positioning guide mechanism comprises a fixed member connected to the inner wheel body and a plurality of rolling members engaged with the fixed member; the rolling elements are in rolling contact with the outer wheel body so as to guide the inner wheel body to rotate relative to the outer wheel body.
  3. 3. The polishing planetary wheel according to claim 2, wherein the fixing member is circumferentially disposed along an outer edge of the inner wheel body.
  4. 4. The polishing planetary wheel according to claim 2, wherein the fixing member is provided with a receiving groove, and the rolling member is embedded in the receiving groove and is in rolling contact with the fixing member, so as to guide the inner wheel body to rotate relative to the outer wheel body.
  5. 5. The polishing planetary wheel according to claim 4, wherein the accommodating groove is annular, the plurality of rolling elements are uniformly embedded in the accommodating groove, and the rolling elements partially protrude out of the annular accommodating groove and are in rolling contact with the outer wheel body.
  6. 6. The polishing planetary wheel according to claim 5, wherein the inner wall of the annular receiving groove is provided with a limit projection to limit circumferential displacement of the rolling element in the receiving groove.
  7. 7. The polishing planetary wheel according to claim 5 or 6, wherein a groove guide is concavely provided on a wall of the accommodation hole of the outer wheel body, and a rolling surface of the rolling member cooperates with the groove guide to restrict axial displacement of the inner wheel body relative to the outer wheel body.
  8. 8. The polishing planetary wheel of claim 7, wherein the groove guide rail is embedded with a wear bushing.
  9. 9. A twin polishing machine comprising a polishing star wheel according to any one of claims 1 to 8, further comprising: A polishing machine body; the gear assembly is arranged on the polishing machine body and matched with the polishing planetary gear so as to drive the polishing planetary gear to integrally move; The polishing mechanism is arranged on the polishing machine body and corresponds to the inner wheel body of the polishing planetary wheel so as to carry out double-sided polishing operation on the substrate to be polished in the clamping opening; And the control system is electrically connected with the gear assembly and the polishing mechanism to control the transmission rate of the gear assembly and the polishing parameters of the polishing mechanism.
  10. 10. A polishing method of the double-sided polishing machine according to claim 9, comprising the steps of: step one, placing a substrate to be polished into clamping openings of all inner side wheel bodies; step two, mounting the polishing planetary wheel on a designated station of a double-sided polishing machine, so that annular meshing teeth of the outer wheel body are meshed with the gear assembly; Step three, starting a polishing mechanism and a gear assembly to drive a polishing planetary wheel to integrally move so that each inner wheel body rotates under the guidance of a positioning guide mechanism, wherein the polishing mechanism carries out synchronous double-sided polishing on the substrate in each clamping port; step four, after finishing the polishing operation, taking out the substrate and detecting the surface flatness of the substrate, if the flatness does not reach the preset standard, returning to the step two, readjusting the polishing parameters, and performing secondary fine polishing on the defect area of the surface of the substrate; if the flatness meets the standard, the polishing operation is completed.

Description

Polishing planetary wheel, double-sided polishing machine and polishing method Technical Field The invention relates to the field of polishing, in particular to a polishing planetary wheel, a double-sided polishing machine and a polishing method. Background The photomask glass substrate is a basic component for transferring a photoetching pattern, and the surface machining precision of the photomask glass substrate directly influences the resolution of the photoetching process and the pattern forming effect. With the increase of the integration level of semiconductor devices, the development of photolithography technology is advanced to short wavelength, the 193nmArF generation and subsequent technologies are widely applied, and further requirements are made on the surface flatness of the photomask glass substrate. The substrate preparation needs high-precision polishing, and the planarization processing cannot be independently finished due to low local polishing rate, so that the substrate is flattened in advance by adopting a double-sided polishing process in the industry, and the ultra-planarization is realized by matching with local polishing. The double-sided polishing of the photomask glass substrate is performed on a double-sided polisher, and the polishing star wheel is used as a component for clamping the substrate and is generally composed of an outer star wheel and a plurality of inner star wheels. The outer side planetary wheel is of an annular structure, a plurality of circular mounting openings are uniformly formed in the circumferential direction of the outer side planetary wheel, a plurality of inner side planetary wheels are embedded in the circular mounting openings in a one-to-one correspondence mode, and the central axes of the outer side planetary wheels are uniformly distributed by encircling the inner side planetary wheels, so that a distribution pattern similar to a planet is formed. The outer side star wheel can be matched with a gear of the double-sided polishing machine to realize integral positioning, and the inner side star wheel is provided with a square opening for placing and fixing a photomask glass substrate. In the polishing process, the inner star wheel rotates around the axis of the inner star wheel while rotating integrally with the outer star wheel, so as to drive the substrate to form a preset motion track, and the uniform polishing of the surface of the substrate is realized. However, when the photomask glass substrate is polished on both sides, because the multiple inner star wheels are uniformly distributed around the central axis of the outer star wheel, and the composite motion of following the integral rotation and self rotation of the outer star wheel is required to be completed at the same time, friction and interference between the inner wall of the mounting opening of the outer star wheel and the outer wall of the inner star wheel inevitably occur, and the friction and interference can cause the motion track of the inner star wheel to deviate, so that the stable motion posture cannot be maintained, and further, the processing error of non-rotational symmetry can remain on the surface of the substrate. Finally, the photomask glass substrate processed by the polishing star wheel cannot achieve surface flatness below 200nm, cannot meet the flatness process requirements of 193nm wavelength ArF generation and subsequent semiconductor lithography technologies on the photomask glass substrate, cannot provide a base substrate meeting the requirements for subsequent local polishing processing, and further affects the preparation quality of a final photomask and the formation effect of lithography patterns. Disclosure of Invention The invention provides a polishing star wheel, a double-sided polishing machine and a polishing method, which are used for solving the problems that the inner wheel body and the outer wheel body of the existing polishing star wheel are easy to rub and interfere, the movement track of the inner wheel body is offset, so that a photomask glass substrate generates non-rotationally symmetrical processing errors, and the surface flatness cannot meet 193nmArF photoetching process requirements. Through setting up location guiding mechanism between outside wheel body and inboard wheel body, can guide the inboard wheel body in the polishing process, avoid its skew that takes place, reduce the motion friction simultaneously and interfere to stabilize the rotation track of inboard wheel body, and then reduce the base plate processing deviation, and promote photomask glass substrate's surface flatness. Based on this, in a first aspect of the present invention, a polishing star wheel is proposed, comprising: The outer wheel body is matched with the double-sided polishing machine so as to integrally position the polishing planetary wheel, and a plurality of containing holes are formed in the outer wheel body; The inner side wheel bodies are embedded in the