CN-121989154-A - Wafer edge polishing roller, wafer edge polishing apparatus including the same, and wafer edge polishing method

Abstract

The invention discloses a wafer edge polishing roller, wafer edge polishing equipment comprising the wafer edge polishing roller and a wafer edge polishing method. The wafer edge polishing platen includes a plurality of first polishing units disposed at a first body portion, a plurality of second polishing units disposed at a second body portion below the first body portion, a driving unit configured to rotate the first body portion and the second body portion, a plurality of third polishing units disposed at least one of the first body portion or the second body portion, and a controller. Each of the first to third polishing units includes a center shaft, a weight attached to one side of the center shaft, and a polishing section attached to the other side of the center shaft. The controller is configured to adjust a distance between the central shaft and the counterweight.

Inventors

• Jin Puen
• Li Hengluo

Assignees

• 爱思开矽得荣株式会社

Dates

Publication Date

20260508

Application Date

20251031

Priority Date

20241101

Claims (20)

1. 1. A wafer edge polishing platen comprising: a plurality of first polishing units disposed at the first body portion; a plurality of second polishing units disposed at a second body portion, the second body portion being located below the first body portion; a driving unit configured to rotate the first body portion and the second body portion; a plurality of third polishing units disposed at least at one of the first body portion or the second body portion, and A controller; Wherein each of the plurality of first polishing units to the plurality of third polishing units comprises: A central shaft; a weight attached to one side of the center shaft, and A polishing portion connected to the other side of the central shaft, and Wherein the controller is configured to adjust a distance between the central shaft and the counterweight.
2. 2. The wafer edge polishing platen of claim 1, wherein the first body portion and the second body portion are connected to each other via a connecting portion so as to rotate together.
3. 3. The wafer edge polishing platen of claim 1, wherein each of the plurality of first polishing elements to the plurality of third polishing elements comprises: A first connecting portion connecting the weight to the center shaft, and And a second connecting portion connecting the polishing portion to the center shaft.
4. 4. The wafer edge polishing platen according to claim 1, wherein the first polishing unit polishes an upper surface of an edge region of the wafer, The second polishing unit polishes the lower surface of the edge region of the wafer, and The third polishing unit polishes a side surface of an edge region of the wafer.
5. 5. The wafer edge polishing platen as recited in claim 1, wherein the central axis is a servo motor, and Wherein the servo motor and the counterweight are coupled to each other using screws.
6. 6. The wafer edge polishing platen as recited in claim 1, wherein the central axis is a cylinder, and Wherein a distance between the counterweight and the cylinder is changed by pressurization of the cylinder.
7. 7. The wafer edge polishing platen of claim 1, wherein in each of the plurality of first polishing units, the central shaft is fixed to the first body portion, the arrangement is disposed above the first body portion, and the polishing portion is disposed below the first body portion.
8. 8. The wafer edge polishing platen of claim 1, wherein in each of the plurality of second polishing units, the central shaft is fixed to the second body portion, the arrangement is disposed below the second body portion, and the polishing portion is disposed above the second body portion.
9. 9. The wafer edge polishing platen of claim 1, wherein in each of the plurality of third polishing units, the central shaft is fixed to the first body portion or the second body portion, the configuration is set above the first body portion or below the second body portion, and the polishing portion is set below the first body portion or above the second body portion.
10. 10. The wafer edge polishing platen according to claim 1, wherein each of the plurality of first polishing units to the third polishing unit is provided in four, and Wherein the plurality of first polishing units to the plurality of third polishing units are alternately arranged in order along the periphery of the wafer disposed between the first body portion and the second body portion.
11. 11. The wafer edge polishing platen of claim 1, wherein each of the plurality of first polishing elements and the plurality of second polishing elements comprises a polishing pad disposed on the polishing section, and Wherein the polishing pad has a polishing surface inclined with respect to an axis connecting the first body portion and the second body portion.
12. 12. The wafer edge polishing platen of claim 1, wherein each of the plurality of third polishing units comprises a polishing pad, and Wherein the polishing pad has a polishing surface parallel to an axis interconnecting the first body portion and the second body portion.
13. 13. The wafer edge polishing platen of claim 1, wherein the plurality of first polishing elements and the plurality of second polishing elements are symmetrically disposed with respect to each other about a center of a wafer area to be polished between the first body portion and the second body portion.
14. 14. The wafer edge polishing platen of claim 1, wherein each of the plurality of first polishing elements to the plurality of third polishing elements comprises a polishing pad, and Wherein the shape of the polishing pad of each of the first polishing unit and the second polishing unit is different from the shape of the polishing pad of each of the third polishing unit.
15. 15. A wafer edge polishing apparatus comprising: The wafer edge polishing roll according to any one of claims 1 to 14, and A wafer support chuck disposed to face a lower surface of the second body portion of the wafer edge polishing platen, the wafer support chuck being spaced apart from the lower surface of the second body portion.
16. 16. The wafer edge polishing apparatus of claim 15 wherein the first body portion and the second body portion are configured to rotate about a first axis of rotation interconnecting the first body portion and the second body portion, Wherein the wafer support chuck is configured to rotate about a second axis of rotation, and Wherein the first axis of rotation and the second axis of rotation coincide with each other.
17. 17. The wafer edge polishing apparatus of claim 16, wherein the wafer support chuck comprises: a rotating body rotating about the second axis of rotation, and And a supporting body which rotates and supports the wafer along with the rotation of the rotating body.
18. 18. A wafer edge polishing method comprising: Receiving a target profile of an edge region of a wafer; determining polishing amounts of an upper surface, a lower surface, and a side surface of an edge region of the wafer based on the target profile, and The upper surface, the lower surface and the side surfaces of the edge region of the wafer are polished using different polishing pads, Wherein the different polishing pads are disposed in the plurality of first polishing units to the plurality of third polishing units, respectively, and Wherein the different polishing pads differ from each other in pressure applied according to rotation of the plurality of first polishing units to the plurality of third polishing units.
19. 19. The wafer edge polishing method of claim 18, wherein each of the plurality of first polishing units to the plurality of third polishing units comprises: A central shaft; a weight attached to one side of the center shaft, and A polishing section connected to the other side of the central shaft, each of the different polishing pads being disposed on the polishing section, and Wherein a centrifugal force generated by rotation of the balance weight can be changed by adjusting a distance between the center axis of each of the plurality of first polishing units to the plurality of third polishing units and the balance weight.
20. 20. The wafer edge polishing method as recited in claim 19, wherein when a centrifugal force generated by rotation of the counterweight is changed, a pressure applied by each of the different polishing pads is also changed.

Description

Wafer edge polishing roller, wafer edge polishing apparatus including the same, and wafer edge polishing method Cross Reference to Related Applications The present application claims priority from korean patent application No. 10-2024-0160776, filed on 1 month 11 of 2024, the contents of which are hereby incorporated by reference as if fully set forth herein. Technical Field The present disclosure relates to a wafer edge polishing roller, a wafer edge polishing apparatus including the same, and a wafer edge polishing method, and more particularly, to a wafer edge polishing roller for polishing an edge front bevel and an edge rear bevel in an edge region of a wafer, and a wafer edge polishing apparatus including the same. Background The single crystal silicon wafer may be manufactured by a slicing process of slicing an ingot to obtain a thin disk-shaped wafer, an edge grinding process of grinding an outer periphery of the wafer obtained by the slicing process to prevent breakage or deformation of the wafer, a grinding process of removing damage due to mechanical processing remaining on the wafer to improve flatness of the wafer, a polishing process of mirror polishing the wafer, and a cleaning process of removing abrasives and impurities adhering to the polished wafer. After the above-described edge grinding process, an edge polishing process is performed to mirror-polish the rough surface in the edge region of the wafer. The edge area of the wafer is polished using a device called an edge polishing cylinder. The shape of the edge of the wafer may vary slightly through the edge grinding process. Therefore, even when edge polishing is performed using an edge polishing roller of a constant shape, there may be a difference in the shape of the edge region of the polished wafer. The edge polishing cylinder includes polishing units for polishing an apex of an edge region of the wafer, a front bevel portion, and a rear bevel portion, respectively. Each polishing unit includes a polishing pad for independently polishing the apex, front bevel portion and rear bevel portion of the wafer. However, the above conventional wafer edge polishing roller has the following problems. Since different customers have different demands on the profile of the edge area of the wafer, it may be necessary to vary the degree of polishing of the edge area of the wafer. Accordingly, when the target profile of the edge region of the wafer changes, the edge polishing rollers need to be replaced accordingly. Disclosure of Invention Accordingly, the present disclosure is directed to a wafer edge polishing roller, a wafer edge polishing apparatus including the same, and a wafer edge polishing method that substantially obviate one or more problems due to limitations and disadvantages of the related art. The present disclosure is directed to solving the above-described problems of the prior art, and an aspect of the present disclosure is to provide a wafer edge polishing roller that can be used without replacement even if a target profile of an edge region of a wafer is changed, a wafer edge polishing apparatus including the wafer edge polishing roller, and a wafer edge polishing method. Additional advantages, aspects, and features of the disclosure will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the disclosure. Aspects and other advantages of the disclosure may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings. The wafer edge polishing platen according to an embodiment of the present disclosure may include a plurality of first polishing units disposed at a first body portion, a plurality of second polishing units disposed at a second body portion below the first body portion, a driving unit configured to rotate the first body portion and the second body portion, a plurality of third polishing units disposed at least one of the first body portion or the second body portion, and a controller. Each of the plurality of first to third polishing units may include a central shaft, a weight connected to one side of the central shaft, and a polishing portion connected to the other side of the central shaft, and the controller may be configured to adjust a distance between the central shaft and the weight. The central shaft may be a servo motor, and the servo motor and the counterweight may be coupled to each other using screws. The central shaft may be a cylinder, and the distance between the counterweight and the cylinder may be changed by pressurization of the cylinder. In each of the plurality of first polishing units, the center shaft may be fixed to the first body portion, the weight may be disposed above the first body portion, and the polishing portion may be disposed below the first body portion. In e