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CN-121989161-A - 8 Inch or smaller size carrier head and chemical mechanical polishing equipment

CN121989161ACN 121989161 ACN121989161 ACN 121989161ACN-121989161-A

Abstract

The invention discloses a bearing head with the size of 8 inches or less and chemical mechanical polishing equipment, which comprises a base, a retaining ring, an air film, a pressing ring, a first clamping ring and a second clamping ring, wherein the air film comprises a circular bottom plate and a side wall which extends vertically upwards along the periphery of the bottom plate, the top of the side wall extends inwards and then bends outwards until being pressed and fixed by the pressing ring and the retaining ring to form a bending part, the air film also comprises an inner partition wall which extends inwards and then horizontally from the side wall, the first clamping ring is clamped and positioned along the outer side surface of the bending part of the side wall and the second clamping ring is clamped and positioned along the inner side surface of the bending part of the side wall.

Inventors

  • WANG YU

Assignees

  • 华海清科股份有限公司

Dates

Publication Date
20260508
Application Date
20221227

Claims (9)

  1. 1. A carrier head of 8 inches or less in size comprising a base, a retaining ring, a gas film, a pressure ring, a first snap ring, and a second snap ring; The air film comprises a circular bottom plate and a side wall extending upwards vertically along the periphery of the bottom plate, wherein the top of the side wall extends inwards and then bends outwards to be fixed by the compression ring and the retaining ring, and a bending part is formed; The air film also comprises an inner partition wall which is formed by horizontally extending inwards from the side wall and then extending upwards, wherein the thickness of the side wall below the inner partition wall is larger than that of the side wall above the inner partition wall, and the thickness of the side wall below the inner partition wall is reduced along with the reduction of the height to form a trapezoid side wall structure; The first clamping ring is clamped and positioned along the outer side surface of the bending part of the side wall, and the second clamping ring is clamped and positioned along the inner side surface of the bending part of the side wall; the second snap ring is composed of an annular wall and a horizontal wall, and a through hole penetrating through the annular wall is formed in the peripheral edge of the lower portion of the horizontal wall of the second snap ring, so that gas is discharged from the through hole to act on the root of the horizontal wall and the edge of the gas film is pressed down through the trapezoid side wall structure.
  2. 2. The carrier head of claim 1, wherein the inner bulkhead extends upwardly to be flush with the second snap ring and is clamped at its upper end to the base.
  3. 3. The carrier head of claim 2, wherein the inner barrier is formed around a bottom surface and an inner peripheral surface of the second barrier, a first chamber is defined between the sidewall of the gas film and the inner barrier, and the second barrier is positioned in the first chamber, such that when gas is introduced into the first chamber, the gas pressure acts on the second barrier and causes the second barrier to exert a downward pressure on the sidewall below the inner barrier.
  4. 4. The carrier head of claim 2, wherein the gas film further comprises a first diaphragm positioned inside the inner partition, and wherein a second chamber is formed between the sidewall, the base, the inner partition, and the first diaphragm such that when gas is introduced into the second chamber, gas pressure acts on the sidewall below the inner partition.
  5. 5. The carrier head of claim 1, wherein the bend is formed by a first annular horizontal plate, a vertical plate, a second horizontal plate, and an angled fixed plate.
  6. 6. The carrier head of claim 5, wherein the first horizontal plate extends horizontally inwardly along the top of the side wall, and the vertical plate extends vertically upwardly along the inner edge of the first horizontal plate to be flush with the second snap ring and then extends horizontally outwardly to form a second horizontal plate.
  7. 7. The carrier head of claim 6, wherein the second horizontal plate has a width of 30% to 75% of the first horizontal plate.
  8. 8. The carrier head of claim 7, wherein the upper surface of the second horizontal plate is provided with a clamp ring that is disposed on the top surface of the second clamp ring and that clamps and secures the second horizontal plate to the upper surface of the first clamp ring.
  9. 9. A chemical mechanical polishing apparatus comprising the carrier head according to any one of claims 1 to 8, further comprising a polishing platen, a dresser, and a polishing liquid supply means.

Description

8 Inch or smaller size carrier head and chemical mechanical polishing equipment Technical Field The invention relates to the technical field of chemical mechanical polishing, in particular to a bearing head with the size of 8 inches or smaller and chemical mechanical polishing equipment. Background Chemical Mechanical Polishing (CMP) is a globally planarized ultra-precise surface finishing technique. The polishing method is characterized in that a wafer is generally placed at the lower part of a bearing head, the bottom surface of the wafer with a deposition layer is abutted against a rotating polishing pad, the bearing head and the polishing pad are driven by a driving component to rotate in the same direction and give downward load to the wafer, and meanwhile, polishing liquid is supplied between the polishing pad and the wafer, so that material removal of the wafer is realized under the combined action of chemistry and machinery. Small-sized carrier heads, such as 8 inch or 6 inch carrier heads, suffer from poor pressure regulation due to insufficient internal space and limited zoning, and cannot provide more precise control of wafer polishing. Disclosure of Invention Embodiments of the present invention provide a carrier head and chemical mechanical polishing apparatus of 8 inches or less in size, which aim to address at least one of the technical problems in the prior art. A first aspect of an embodiment of the present invention provides a 8 inch or smaller sized carrier head comprising a base, a retaining ring, a gas film, a pressure ring, a first snap ring, and a second snap ring; The air film comprises a circular bottom plate and a side wall extending upwards vertically along the periphery of the bottom plate, wherein the top of the side wall extends inwards and then bends outwards to be fixedly pressed by the pressing ring and the retaining ring and form a bending part; The air film also comprises an inner partition wall which is formed by extending inwards and horizontally from the side wall and then extending upwards; The first clamping ring is clamped and positioned along the outer side surface of the bending part of the side wall and the second clamping ring is clamped and positioned along the inner side surface of the bending part of the side wall. In one embodiment, the thickness of the sidewall below the inner partition wall is greater than the thickness of the sidewall above it. In one embodiment, the thickness of the sidewall below the inner partition wall decreases with decreasing height forming a trapezoidal sidewall structure. In one embodiment, the second snap ring is comprised of an annular wall and a horizontal wall. In one embodiment, a through hole penetrating the second snap ring is provided at an outer peripheral edge of a lower portion of the horizontal wall, so that gas can be discharged from the through hole to act on a root portion of the horizontal wall and press down an edge of the gas film via the trapezoidal sidewall structure. In one embodiment, the inner partition extends upwardly to be flush with the second snap ring and is clamped at its upper end to the base. In one embodiment, the bending part is composed of a ring-shaped first horizontal plate, a vertical plate, a second horizontal plate and an inclined fixing plate. In one embodiment, the first horizontal plate extends horizontally and inwardly along the top of the side wall, and the vertical plate extends vertically upwards along the inner side edge of the first horizontal plate to be flush with the second snap ring and then extends horizontally and outwardly to form a second horizontal plate. In one embodiment, the second horizontal plate has a width of 30% to 75% of the first horizontal plate. In one embodiment, the upper surface of the second horizontal plate is provided with a clamp ring which is provided on the top surface of the second clamp ring and which press-fastens the second horizontal plate to the upper surface of the first clamp ring. A second aspect of an embodiment of the present invention provides a chemical mechanical polishing apparatus including a carrier head as described above, further including a polishing platen, a dresser, and a polishing liquid supply device. The wafer edge polishing method and device have the beneficial effects that the appearance of wafer edge polishing can be accurately controlled. Drawings The advantages of the present invention will become more apparent and more readily appreciated from the detailed description given in conjunction with the following drawings, which are meant to be illustrative only and not limiting of the scope of the invention, wherein: FIG. 1 illustrates a chemical mechanical polishing apparatus provided in accordance with one embodiment of the present invention; FIG. 2 illustrates a carrier head provided by an embodiment of the present invention; fig. 3 shows a carrier head according to another embodiment of the present invention. Detailed Descr