CN-121989377-A - Wire breakage processing device and method of multi-wire cutting machine and multi-wire cutting system

CN121989377ACN 121989377 ACN121989377 ACN 121989377ACN-121989377-A

Abstract

A broken wire processing device and method of a multi-wire cutting machine and a multi-wire cutting system, wherein the device comprises a control unit, wherein the control unit is suitable for acquiring broken wire types of cutting wires and executing a corresponding reset scheme based on the broken wire types, and the broken wire types of the cutting wires comprise at least one of wire mesh broken wire type broken wires and non-wire mesh broken wire type broken wires. The wire mesh wire-lack type wire breakage or the wire mesh wire-lack type wire breakage type of the cutting wire is obtained, and the corresponding resetting scheme is executed based on different wire breakage types, so that the resetting precision and efficiency during wire mesh wire breakage can be improved, the cutting precision and the cutting efficiency of the multi-wire cutting machine are further improved, the damage to the surface of the cut crystal bar to be cut is reduced, and the product yield and the production efficiency are improved.

Inventors

Zeng Zhangbiao
ZHU CHAOJIE
LU HUIJUAN
ZENG CHENG
WANG ZHENWEI
ZHAO NING
WANG BO
PENG TONGHUA
YANG JIAN

Assignees

深圳市重投天科半导体有限公司
北京天科合达半导体股份有限公司
江苏天科合达半导体有限公司

Dates

Publication Date: 20260508
Application Date: 20260210

Claims (14)

1. The broken wire processing device of the multi-wire cutting machine is used for resetting a broken wire in the multi-wire cutting machine and comprises a cutting base, a cutting wire, a crystal bar to be cut, a paying-off side wire wheel, a first sheave, a second wire wheel and a wire collecting side wire wheel; Characterized by comprising the following steps: The control unit is suitable for acquiring the broken wire type of the cutting wire and executing a corresponding reset scheme based on the broken wire type; the wire breaking type of the cutting wire comprises at least one wire mesh wire-lack type wire breaking and non-wire mesh wire-lack type wire breaking.
2. The wire breakage processing device of a multi-wire saw as defined in claim 1, wherein said control unit includes: The detection module is suitable for detecting the cutting line and acquiring the broken line type of the cutting line; the configuration module is suitable for configuring a corresponding reset tool for the cutting line based on the broken line type; and the cutting module is suitable for controlling the cutting line to continuously cut the crystal bar to be cut after the cutting line is reset.
3. The wire breakage processing device of a multi-wire saw as defined in claim 2, wherein, The detection module comprises: the first detection submodule is suitable for detecting the tension of the cutting line between the first sheave and the second sheave and determining that the broken line type of the cutting line is a wire mesh broken line type when the tension of the cutting line between the first sheave and the second sheave is 0; The second detection sub-module is suitable for detecting the positions of the first wire guide wheel and the second wire guide wheel, and determining that the broken wire type of the cutting wire is a non-wire mesh broken wire type broken wire when the positions of the first wire guide wheel and the second wire guide wheel are changed.
4. The wire breakage processing device of a multi-wire saw as defined in claim 2, wherein said configuration module includes: The first configuration submodule is suitable for lifting the crystal bar to be cut to a first preset height when the wire breakage type is wire mesh wire breakage type, and configuring a reset plug rule for the multi-wire cutting machine so as to fix the cutting wire into a corresponding wire seam in the crystal bar to be cut; And the second configuration submodule is suitable for lifting the crystal bar to be cut to a second preset height when the wire breakage type is a non-wire mesh wire breakage type, and configuring a crystal bar supporting strip for the multi-wire cutting machine so as to fix the cutting wire into a corresponding wire seam in the crystal bar supporting strip.
5. The wire break processing device of a multi-wire saw of claim 4, wherein the first predetermined height is greater than the second predetermined height.
6. The wire breakage processing device of a multi-wire saw as defined in claim 4, further comprising: the inspection module is suitable for acquiring the widths of a plurality of seams after the cutting lines are fixed in the corresponding seams in the crystal bar to be cut, and sending cutting control signals when the widths of the plurality of seams are equal.
7. The broken wire processing method of the multi-wire cutting machine is characterized by comprising the following steps of: Obtaining the broken line type of the cutting line; based on the broken line type, executing a corresponding reset scheme; the wire breaking type of the cutting wire comprises at least one wire mesh wire-lack type wire breaking and non-wire mesh wire-lack type wire breaking.
8. The wire breakage processing method of a multi-wire saw according to claim 7, wherein the acquiring the wire breakage type of the cutting wire and executing the corresponding reset scheme based on the wire breakage type includes: detecting the cutting line to obtain the broken line type of the cutting line; Configuring a corresponding reset tool for the cutting line based on the broken line type; and after the cutting line is reset, controlling the cutting line to continuously cut the crystal bar to be cut.
9. The method for processing broken wires of a multi-wire saw according to claim 8, wherein the detecting the cutting wire to obtain the broken wire type of the cutting wire includes: Detecting the tension of a cutting line between a first sheave and a second sheave, and determining that the wire breakage type of the cutting line is wire mesh wire breakage type when the tension of the cutting line between the first sheave and the second sheave is 0; Detecting the positions of the first wire guide wheel and the second wire guide wheel, and determining that the wire breaking type of the cutting wire is a non-wire mesh wire-breaking type wire breaking when the positions of the first wire guide wheel and the second wire guide wheel are changed.
10. The wire breakage processing method of a multi-wire saw according to claim 8, wherein configuring the reset tool for the cutting wire based on the wire breakage type includes: When the wire breakage type is wire mesh wire breakage type, the crystal bar to be cut is lifted to a first preset height, and a reset feeler gauge is configured for the multi-wire cutting machine so as to fix the cutting wire into a corresponding wire seam in the crystal bar to be cut; When the wire breakage type is a non-wire mesh wire breakage type, the crystal bar to be cut is lifted to a second preset height, and a crystal bar supporting strip is configured for the multi-wire cutting machine so as to fix the cutting wire into a corresponding wire seam in the crystal bar supporting strip.
11. The method for wire breakage processing for a multi-wire saw as defined in claim 10, further comprising obtaining widths of a plurality of said wire slits after fixing said cutting wire to a corresponding wire slit in said ingot to be cut, and transmitting a cutting control signal when the widths of the plurality of said wire slits are equal.
12. A multi-wire cutting system comprising the wire breakage processing device of a multi-wire cutting machine according to any one of claims 1 to 6, and The reset feeler is partially positioned in the crystal bar to be cut; And the crystal bar supporting strip is attached to the bottom of the crystal bar to be cut.
13. The multi-wire cutting system of claim 12 wherein the thickness of the reset plug is equal to the wire diameter of the cutting wire.
14. The multi-wire cutting system of claim 12 wherein the material of the boule strip is graphite.

Description

Wire breakage processing device and method of multi-wire cutting machine and multi-wire cutting system Technical Field The invention relates to the field of semiconductors, in particular to a broken wire processing device and method of a multi-wire cutting machine and a multi-wire cutting system. Background Silicon carbide wafers, commonly referred to as silicon carbide single crystal substrates. The method takes high-purity silicon carbide as a raw material, and a slice is manufactured by a crystal growth technology and is used for epitaxially growing silicon carbide or other semiconductor films on the surface of the slice so as to manufacture power devices and radio frequency devices. Silicon carbide (SiC) is used as a third-generation semiconductor material, and has important applications in the fields of power devices, radio frequency devices and the like due to high hardness, high brittleness and high chemical stability. However, these characteristics also make the cutting process of silicon carbide crystals extremely difficult, and especially the wire breakage problem easily occurs in the multi-wire cutting process, which seriously affects the cutting efficiency and the wafer quality. After the broken wire occurs, the broken wire needs to be repaired, the position of the repaired cut wire needs to be reset, and the cutting task is ensured to be continued. However, the current dicing line has low resetting efficiency and low resetting precision, which causes damage to the surface of the wafer during subsequent dicing, reduces the dicing efficiency, and further affects the yield and the production efficiency of the product. Disclosure of Invention The invention solves the technical problem of how to improve the resetting efficiency of the cutting line. In order to solve the technical problems, the embodiment of the invention provides a broken wire processing device of a multi-wire cutting machine, which is used for resetting a broken wire in the multi-wire cutting machine, wherein the multi-wire cutting machine comprises a cutting base, a cutting wire, a crystal bar to be cut, a paying-off side wire wheel, a first sheave, a second wire wheel and a wire collecting side wire wheel, the multi-wire cutting machine comprises a control unit, the control unit is suitable for acquiring the broken wire type of the cutting wire and executing a corresponding resetting scheme based on the broken wire type, and the broken wire type of the cutting wire comprises at least one of wire mesh broken wire type broken wire and non-wire mesh broken wire type broken wire. Optionally, the control unit comprises a detection module, a configuration module and a cutting module, wherein the detection module is suitable for detecting the cutting line to obtain the broken line type of the cutting line, the configuration module is suitable for configuring a corresponding reset tool for the cutting line based on the broken line type, and the cutting module is suitable for controlling the cutting line to continuously cut the crystal bar to be cut after the cutting line is reset. Optionally, the detection module comprises a first detection submodule, a second detection submodule and a non-wire network wire breakage type detection submodule, wherein the first detection submodule is suitable for detecting the tension of a cutting wire between the first sheave and the second sheave and determining that the wire breakage type of the cutting wire is wire network wire breakage type wire breakage when the tension of the cutting wire between the first sheave and the second sheave is 0, and the second detection submodule is suitable for detecting the positions of the first wire guide wheel and the second wire guide wheel and determining that the wire breakage type of the cutting wire is non-wire network wire breakage type wire breakage when the positions of the first wire guide wheel and the second wire guide wheel are changed. Optionally, the configuration module comprises a first configuration sub-module, a second configuration sub-module and a crystal bar supporting bar, wherein the first configuration sub-module is suitable for lifting the crystal bar to be cut to a first preset height when the wire breakage type is wire mesh wire breakage type, a reset clearance gauge is configured for the multi-wire cutting machine so as to fix the cutting wire into a corresponding seam in the crystal bar to be cut, and the second configuration sub-module is suitable for lifting the crystal bar to be cut to a second preset height when the wire breakage type is non-wire mesh wire breakage type, and a crystal bar supporting bar is configured for the multi-wire cutting machine so as to fix the cutting wire into the corresponding seam in the crystal bar supporting bar. Optionally, the first preset height is greater than the second preset height. Optionally, the crystal bar cutting device further comprises a checking module, wherein the checking module is suita