CN-121989440-A - Preparation method of in-situ embedded luminous flexible fabric based on additive manufacturing

CN121989440ACN 121989440 ACN121989440 ACN 121989440ACN-121989440-A

Abstract

The invention discloses a preparation method of an in-situ embedded luminous flexible fabric based on additive manufacturing, and belongs to the field of intelligent wearing and flexible electronic manufacturing. The method adopts a Fused Deposition Modeling (FDM) technology, a pause instruction is preset in a G-code, a printer is automatically paused after a bottom matrix of an interlocking fabric unit is constructed, a flexible circuit board and a light-emitting device are accurately placed into an electronic accommodating cavity reserved by the unit, after printing is resumed, a spray head is switched to a light-transmitting material, and a packaging cover plate layer is printed above an electronic element by adopting specific bridging parameters, so that in-situ packaging of the device and construction of an optical light-equalizing layer are completed. The invention realizes the integration and automatic molding of the functional electronic module and the flexible fabric structure, and the prepared luminous fabric has excellent waterproof performance, mechanical flexibility and circuit connection reliability, and solves the problems of easy falling off of electronic circuits, low integration level and complicated process in the traditional intelligent clothing manufacturing.

Inventors

WEI QINGSONG
LIU XI
WANG MINGLING
YUAN ZISHUN
Dai Ziang
Zhu Lvtao
ZHANG HUAPENG

Assignees

浙江理工大学

Dates

Publication Date: 20260508
Application Date: 20260228

Claims (10)

1. The preparation method of the in-situ embedded luminous flexible fabric based on additive manufacturing is characterized by comprising the following steps of: S1, model construction and intelligent slicing, namely constructing an interlocking unit three-dimensional model comprising a bottom matrix, an electronic accommodating cavity and a packaging cover plate, setting a printing layer height in slicing software, inserting a pause instruction when printing to the upper edge height of the accommodating cavity, setting a Z-axis lifting height, and generating a corresponding G-code file; s2, printing a multi-material matrix, namely printing a bottom matrix of the interlocking unit and a connecting mechanism by using a light-tight structural material until a set embedding height is reached, so as to form a semi-finished product with an opening cavity; S3, embedding an in-situ device, namely placing the pre-welded flexible circuit board assembly into an electronic accommodating cavity, ensuring that the surface of the flexible circuit board assembly is lower than a subsequent printing plane, and placing a lead into a reserved wiring channel; S4, constructing a bridging package and a functional layer, namely, adopting a bridging process for first layer package, then switching to a light-transmitting flexible material, and continuing printing to complete package cover plates and an optical diffusion layer; s5, post-processing and integration, namely interlocking joints of the movable printing fabric, and realizing electrical interconnection among units through an internal wiring channel or an external connector to obtain the integrally formed luminous flexible fabric.
2. The preparation method of the intelligent slice is characterized in that the S1 model construction and intelligent slice is specifically implemented by constructing an interlocking unit three-dimensional model comprising a bottom matrix, an electronic accommodating cavity and a packaging cover plate, setting an embedding height threshold in slice software, and generating a G-code file comprising a 'pause printing' instruction; the slicing software is also arranged to insert a pause instruction when the height of the printing layer is 0.1mm-0.3mm and the height of the Z-axis lifting height is 2mm-10mm when the printing layer is printed to the height of the upper edge of the electronic accommodating cavity, and the embedded height threshold value is the printing height corresponding to the upper edge of the electronic accommodating cavity; The S2 multi-material matrix printing is specifically that a bottom matrix and a peripheral connecting mechanism of an interlocking unit are printed by adopting a light-tight structural material until the embedding height threshold value set in the step S1 is printed to form a semi-finished product structure with an open cavity, wherein the printing temperature of the structural material is 190-240 ℃; The S3 in-situ device embedding is specifically that the printing equipment executes a pause instruction of the step S1, and the spray head automatically moves to a preset safe coordinate position, a flexible circuit board assembly which is welded with a light-emitting device in advance is embedded into an electronic accommodating cavity of the step S1, the surface of the FPC is ensured to be at least 0.2mm lower than a subsequent printing plane, and a connecting wire of the FPC is placed into a wiring channel reserved by a matrix; The construction of the S4 bridging package and the functional layer comprises the steps of firstly, setting the rotating speed of a spray head cooling fan to be 100%, reducing the printing speed to be 10mm/S-30mm/S, and performing bridging printing by utilizing the surface tension of the material above a cavity, then, switching to a light-transmitting flexible material, and continuing printing until the whole interlocking unit is completed to form a package cover plate and an optical diffusion layer, wherein the normal flow is the printing extrusion flow of the opaque structural material in the step S2, and the printing temperature of the light-transmitting flexible material is 220-250 ℃; The S5 post-treatment and integration specifically comprises the steps of taking the printed fabric off the platform, moving interlocking joints of the printed fabric, and realizing electrical interconnection among units through an internal wiring channel or an external connector to obtain the integrally formed luminous flexible fabric, wherein the electrical interconnection can be in any mode of conductive silver adhesive bonding, laser welding or a board-to-board connector.
3. The preparation method according to claim 2, wherein in the step S1, a multi-material switching instruction is set in slicing software, wherein in the step S2, a substrate is printed by adopting a non-transparent rigid or semi-rigid structural material, the material is one or more of PLA, ABS or carbon fiber reinforced PLA, in the step S4, a packaging cover plate layer is printed by adopting a transparent flexible material, and the transparent flexible material is one or more of transparent or semitransparent PETG, TPU or flexible photosensitive resin.
4. The preparation method of claim 2, wherein a layer of high temperature resistant insulating glue is pre-coated at the bonding pad node before the flexible circuit board assembly is embedded in the step S3, or transparent UV curing glue or low viscosity epoxy resin is injected into the electronic accommodating cavity in the step S3 after the embedding in the step S3 is completed and before the printing instruction is restored in the step S4, wherein the injection volume is 35-55% of the cavity volume, and the electronic element is pre-encapsulated and reinforced.
5. The manufacturing method of the electronic device of claim 2, wherein the inner side wall of the electronic containing cavity of the interlocking unit is provided with a positioning buckle or a limiting step, a penetrating wiring channel is arranged in the bottom base body or below the connecting mechanism, the turning part and the outlet of the wiring channel are designed with round angles, and the radius R of the round angles is not smaller than 0.5mm.
6. The preparation method according to claim 2, which is suitable for array continuous manufacturing, wherein in the step S1, an array model composed of M multiplied by N interlocking units is established, M and N are integers more than or equal to 2, in the step S3, a whole net-shaped flexible circuit board matched with the layout of the array model is embedded, and circuit modules and connecting wires corresponding to the electronic accommodating cavities of the units are arranged on the circuit board.
7. The method according to claim 2, wherein in step S1, the three-dimensional model of interlocking units is constructed, the connection mechanism between the units is a topology structure imitating plain weave interweaving or chain mail ring buckling, and the projected shape of the units is any one of hexagon, quadrangle or triangle.
8. The method of manufacturing of claim 2, wherein the integrated devices on the flexible circuit board assembly include one or more of a patch LED, a micro temperature sensor, a pressure sensor, a vibration motor, or a flexible energy storage unit.
9. The method according to claim 2, wherein in step S4, after switching to the light-transmitting flexible material, a section of waste extrusion is performed, the extrusion length is 5mm-15mm, the extrusion speed is 20mm/S-50mm/S, so as to clean the last material remained in the nozzle and stabilize the extrusion pressure, and the thickness of the first encapsulation layer of the bridge printing is 1.0-1.2 times the height of the printing layer in step S1.
10. An in-situ embedded luminous flexible fabric prepared by the method of any one of claims 1-9, which is characterized in that the fabric is composed of a plurality of interlocking units, wherein independent flexible circuit boards and luminous devices are packaged in the units, the units are hinged through a mechanical connecting mechanism and can be electrically connected through an internal wiring channel, and the luminous surface of the luminous devices faces to a packaging cover plate layer made of light-transmitting materials.

Description

Preparation method of in-situ embedded luminous flexible fabric based on additive manufacturing Technical Field The invention belongs to the field of intelligent wearing and flexible electronic manufacturing, and particularly relates to a preparation method of an in-situ embedded luminous flexible fabric based on additive manufacturing. Background With the rapid development of intelligent wearable technology, electronic textiles (E-textiles) are being widely used from the conceptual perspective. The key point of realizing the deep fusion of the electronic function and the textile is to develop a flexible circuit integration technology with high performance, high reliability and comfortable wearing. The current main flow technical path can be divided into two types, namely a textile circuit based on a textile technology, such as knitting conductive yarns such as stainless steel core yarns into a textile by knitting (such as the preparation and the performance of an elastic knitted fabric with embedded conductive lines in the publication) or a tatting mode, so as to form an embedded conductive path. Although the method realizes good fusion and stretchability of the circuit and the fabric substrate, high-performance and miniaturized standard electronic chips (such as surface mount devices (LEDs) and Integrated Circuits (ICs)) are difficult to integrate, the complexity of circuit patterns is severely limited by a weaving process, and the functions are single. Secondly, a printing function body based on additive manufacturing, such as a microstructure with sensing or luminous functions (such as gradient modulus packaging disclosed in CN118712145A or doping printing sensor to flexible resin) is directly molded by using a 3D printing technology. Although the path has extremely high design freedom, the electrical and optical properties of the printing material are often inferior to those of professional industrial devices, and various heterogeneous functional electronic components are difficult to integrate in a single structure. In addition, as disclosed in CN108284226a, a method for 3D printing a high-strength composite material electronic packaging shell by adopting a laser selective melting (SLM) technology exists in the prior art, but the method is oriented to packaging of rigid and high-heat-conductivity aerospace devices, and is contrary to the requirements of the flexible wearing field on material flexibility, air permeability and light weight. Another type of co-printing technology for liquid metal and polymer, as disclosed in CN201810160724.0, is to extrude two functional materials simultaneously to make continuous conductive paths instead of integrating separate, fully functional prefabricated electronic modules. In summary, the prior art fails to effectively solve the core contradiction of how to realize high reliability and integrated integration of complex and multi-component standard electronic devices while maintaining good flexible wearing experience of fabrics. Therefore, the development of a new method which can embed the high-performance prefabricated electronic module into the flexible fabric in situ and accurately in the manufacturing process and realize reliable packaging and interconnection has important significance for promoting the industrialization of intelligent clothing. Disclosure of Invention The invention aims to overcome the defects of low electronic function integration level, poor reliability, complex process and difficult mass production in the existing intelligent fabric manufacturing technology and provides an in-situ embedded luminous flexible fabric preparation method based on additive manufacturing. The method aims at realizing in-situ encapsulation and integrated molding of the standard flexible electronic module inside the flexible interlocking fabric structure of 3D printing through innovative printing-pause-embedding-continuous printing process time sequence and intelligent control logic, so as to obtain the intelligent fabric with excellent mechanical flexibility, high circuit reliability, good waterproofness and complex function integration capability, and provide a feasible technical scheme for large-scale and automatic production of intelligent wearable equipment. In order to achieve the above purpose, the invention provides an in-situ embedded luminous flexible fabric preparation method based on additive manufacturing, which comprises the following steps: S1, model construction and intelligent slicing, namely constructing an interlocking unit three-dimensional model comprising a bottom matrix, an electronic accommodating cavity and a packaging cover plate, setting a printing layer height in slicing software, inserting a pause instruction when printing to the upper edge height of the accommodating cavity, setting a Z-axis lifting height, and generating a corresponding G-code file; S2, printing a multi-material matrix, namely starting printing equipment, printing a b