CN-121989455-A - Craft gift 3D relief forming system

CN121989455ACN 121989455 ACN121989455 ACN 121989455ACN-121989455-A

Abstract

The application relates to the technical field of three-dimensional forming and discloses a process gift 3D embossment forming system which comprises a substrate and temperature control module, a phased array acoustic transducer matrix module and a control and processing unit module, wherein the control and processing unit module is configured to execute closed loop self-adaptive control, the control and processing unit module instructs the phased array acoustic transducer matrix module to work in a detection mode so as to emit ultrasonic pulses and receive echoes, so that the current actual height of the surface of a substrate is measured, the actual measured height is compared with a preset target height, a morphology error is calculated, and the phased array acoustic transducer matrix module is instructed to work in a forming mode according to the morphology error to generate a focused sound beam. The application realizes high-precision self-adaptive molding by constructing acoustic closed-loop feedback, and the processing process is non-contact, thereby being applicable to the automation and flexible manufacturing of high-fidelity process gifts.

Inventors

CHENG JUAN
XUE KAI
Bai Fangting
LIU XIAOGANG
PAN MING
MA YAN
WANG HENGLIANG
JIA GUOCHEN

Assignees

陕西麦讯品牌创意有限公司

Dates

Publication Date: 20260508
Application Date: 20260204

Claims (10)

1. A craft gift 3D embossment forming system, comprising: the substrate processing device comprises a substrate and a temperature control module, wherein the substrate is used for bearing a substrate to be processed and heating the substrate so as to enable the substrate to enter a preset plastic forming state; A phased array acoustic transducer matrix module disposed on one side of the substrate, and The control and processing unit module is electrically connected with the substrate, the temperature control module and the phased array acoustic transducer matrix module; wherein the control and processing unit module is configured to: a, instructing the phased array acoustic transducer matrix module to operate in a detection mode to transmit ultrasonic pulses and receive echoes reflected from the substrate surface, thereby measuring a current real height matrix of the substrate surface according to the flight time of the echoes; b calculating a morphology error matrix according to a preset target height matrix and the current actual height matrix, and And c, if the morphology error matrix does not meet the convergence condition, according to the morphology error matrix, commanding the phased array acoustic transducer matrix module to work in a molding mode so as to generate a focused acoustic beam at a specific surface position to carry out non-contact plastic pushing on the substrate, thereby reducing the morphology error, and circularly executing the steps a to c until the convergence condition is met.
2. The process gift 3D embossment forming system of claim 1, wherein said control and processing unit module is further configured to calculate elements in said current height matrix by the formula : ; Wherein, the Is the first Coordinate point at time of iteration Is used for measuring the measured height of the steel plate, For the velocity of the sound wave in the propagation medium, To the first measured at the coordinate point Time of flight for the second iteration.
3. The process gift 3D embossment forming system of claim 2, wherein said focused acoustic beam produces an acoustic radiation pressure at said substrate surface that is a non-contact force that causes plastic deformation of said substrate.
4. The process gift 3D embossment-shaping system of claim 1, wherein said control and processing unit module is further configured to calculate the amount of acoustic pressure impulse to be applied at a specific location on said substrate surface based on said topographical error matrix and to control the intensity of the acoustic radiation pressure of said focused acoustic beam and its dwell time accordingly.
5. The system of claim 4, wherein the control and processing unit module employs an incremental PID control algorithm to calculate the sound pressure impulse increment to be applied in the next iteration based on the current and historical morphology error matrices.
6. The process gift 3D embossment shaping system of claim 1, wherein said phased array acoustic transducer matrix module includes an array of a plurality of miniature transducer elements, said control and processing unit module being further configured to calculate a phase delay required for each miniature transducer element in said array for its drive signal based on coordinates of said particular location to effect beam focusing.
7. The process gift 3D embossment forming system of claim 1, wherein said base and temperature control module are configured to heat said substrate to its glass transition temperature The temperature is above so that the plastic molding material enters a high-elastic state as the preset plastic molding state.
8. The process gift 3D embossment forming system of claim 1, wherein the control and processing unit module is further configured to stop heating of the base and temperature control module and start the dynamic cooling module to cool down and solidify the substrate after the convergence condition is satisfied.
9. The process gift 3D embossment-molding system of claim 1, further comprising a second phased array acoustic transducer matrix module disposed on the other side of the substrate and connected to the control and processing unit module for cooperating with the first phased array acoustic transducer matrix module to effect double-sided acoustic pressure manipulation of the substrate.
10. The process gift 3D embossment-shaping system of claim 1, wherein said control and processing unit module is further configured to instruct said phased array acoustic transducer matrix module to simultaneously transmit a first frequency probe signal and a second frequency shaping signal using frequency multiplexing techniques to achieve synchronization of probing and shaping.

Description

Craft gift 3D relief forming system Technical Field The invention relates to the technical field of three-dimensional forming, in particular to a 3D embossment forming system for a craft gift. Background The art gift with three-dimensional relief structure is popular in the market due to its rich visual layering and tactile feel. Currently, the mainstream manufacturing methods for realizing such relief structures rely mainly on physical molds for embossing or injection molding. Although this type of method enables large-scale production reproductions, it has a core disadvantage in that it is severely dependent on physical molds. Each new design needs to redevelop and manufacture a set of precise dies corresponding to the new design, which not only leads to long development period and high input cost in the early stage, but also leads to lack of flexibility in the whole production process, and is difficult to meet the demands of the current market on personalized customization and small-batch quick response. In order to overcome the limitations of the mold, the industry has also explored digital subtractive manufacturing techniques using mechanical engraving or laser ablation. However, mechanical engraving is a contact type machining, and the direct action of the tool and the material surface inevitably generates stress concentration and micro scratches, which affect the finish of the product surface, and also has the problem of tool wear. While laser ablation, while achieving non-contact, has a high temperature principle of action that creates a heat affected zone on the surface of the material, can alter the physicochemical properties of the material, and can be difficult to remove. More importantly, the process is largely performed in an open loop control manner, whether by conventional compression molding or by a later digital processing method. The system only executes preset processing instructions unidirectionally, but cannot acquire the actual morphology of the workpiece surface in real time in the processing process and compare the actual morphology with the target morphology. Therefore, when disturbance such as uneven physical properties of materials, fluctuation of ambient temperature or errors of equipment itself occurs in the processing process, the system cannot dynamically compensate, and the accumulated errors can be directly reflected on a final product, so that dimensional accuracy and fidelity to a digital model are difficult to ensure. Disclosure of Invention Aiming at the defects of the prior art, the invention provides a process gift 3D embossment forming system, which solves the problems that the processing precision is difficult to guarantee due to the general lack of real-time closed loop feedback control in the prior art and the processing mode is easy to cause the surface damage of a workpiece. In order to achieve the purpose, the invention is realized by the following technical scheme that the craft gift 3D relief forming system comprises: the substrate processing device comprises a substrate and a temperature control module, wherein the substrate is used for bearing a substrate to be processed and heating the substrate so as to enable the substrate to enter a preset plastic forming state; A phased array acoustic transducer matrix module disposed on one side of the substrate, and The control and processing unit module is electrically connected with the substrate, the temperature control module and the phased array acoustic transducer matrix module; wherein the control and processing unit module is configured to: a, instructing the phased array acoustic transducer matrix module to operate in a detection mode to transmit ultrasonic pulses and receive echoes reflected from the substrate surface, thereby measuring a current real height matrix of the substrate surface according to the flight time of the echoes; b calculating a morphology error matrix according to a preset target height matrix and the current actual height matrix, and And c, if the morphology error matrix does not meet the convergence condition, according to the morphology error matrix, commanding the phased array acoustic transducer matrix module to work in a molding mode so as to generate a focused acoustic beam at a specific surface position to carry out non-contact plastic pushing on the substrate, thereby reducing the morphology error, and circularly executing the steps a to c until the convergence condition is met. Preferably, the control and processing unit module is further configured to calculate the elements in the current implementation height matrix by the following formula: ; Wherein, the Is the firstCoordinate point at time of iterationIs used for measuring the measured height of the steel plate,For the velocity of the sound wave in the propagation medium,To the first measured at the coordinate pointTime of flight for the second iteration. Preferably, the focused acoustic beam generates an acoustic radiati