CN-121989514-A - Composite copper foil and method for producing same

Abstract

The invention provides a composite copper foil, which comprises a first copper foil, a second copper foil and an insulating bonding layer. The insulating bonding layer is positioned between the first copper foil and the second copper foil. The thickness of the insulating bonding layer is less than 5 microns.

Inventors

• YUAN JINGYAO
• ZHENG WEISHENG
• ZHENG WENDA
• WU ZHONGNI

Assignees

• 南亚塑胶工业股份有限公司

Dates

Publication Date

20260508

Application Date

20241129

Priority Date

20241105

Claims (10)

1. 1. A method for manufacturing a composite copper foil, comprising: providing a first copper foil and a second copper foil which are structurally separated; forming an insulating bonding material between the first copper foil and the second copper foil, and And forming an insulating bonding layer by the insulating bonding material so that the first copper foil and the second copper foil are bonded through the insulating bonding layer.
2. 2. The method of manufacturing a composite copper foil according to claim 1, further comprising: providing a first carrier having a first peelable layer thereon, wherein the first copper foil is formed on the first peelable layer, and Providing a second carrier having a second peelable layer thereon, wherein the second copper foil is formed on the second peelable layer.
3. 3. The method of manufacturing a composite copper foil according to claim 2, further comprising: Forming the insulating bonding material on at least one of the first copper foil or the second copper foil, and The first copper foil and the second copper foil are made face-to-face, and the insulating bonding material is located between the first copper foil and the second copper foil.
4. 4. The method of manufacturing a composite copper foil according to claim 2, wherein: the first and second peelable layers are made of inorganic material, and The insulating bonding material is an organic material.
5. 5. The method of manufacturing a composite copper foil according to claim 2, wherein: The thickness of the first supporting body is 5 times to 30 times of that of the first copper foil; The thickness of the second supporting body is 5 times to 30 times of that of the second copper foil; The thickness of the second carrier is 5 times to 30 times that of the first copper foil, and/or The thickness of the first carrier is 5 to 30 times the thickness of the second copper foil.
6. 6. The method of manufacturing a composite copper foil according to claim 2, wherein: The thickness of the first copper foil is 15 to 50 times the thickness of the first peelable layer; The thickness of the second copper foil is 15 to 50 times the thickness of the second peelable layer; the thickness of the second copper foil is 15 times to 50 times the thickness of the first peelable layer, and/or The thickness of the first copper foil is 15 to 50 times the thickness of the second peelable layer.
7. 7. The method of manufacturing a composite copper foil according to claim 1, further comprising: after the insulating bonding material contacts the first copper foil and the second copper foil, the insulating bonding material is cured to form the insulating bonding layer.
8. 8. The method for manufacturing a composite copper foil according to claim 1, wherein the thickness of the insulating bonding layer is thinner than the thickness of the insulating bonding material.
9. 9. A composite copper foil comprising: A first copper foil; a second copper foil, and And an insulating bonding layer between the first copper foil and the second copper foil, wherein the thickness of the insulating bonding layer is less than 5 microns.
10. 10. The composite copper foil of claim 9, consisting of the first copper foil, the second copper foil, and the insulating bond layer.

Description

Composite copper foil and method for producing same Technical Field The present invention relates to a metal foil and a method for manufacturing the same, and more particularly, to a composite copper foil and a method for manufacturing the same. Background The conventional method for manufacturing the composite copper foil is to provide a polymer film (such as a Polyester (PET) film or a Polyimide (PI) film). Then, first conductive films (often referred to as conductive seed layers) are formed on both surfaces of the polymer film by sputtering. Then, a second conductive film (often called a plating layer) is formed by thickening the first conductive film by electroplating. The composite copper foil formed by the method is often limited by the thickness of the polymer film and the corresponding forming mode of the conductive film, and the overall thickness is difficult to be effectively reduced (for example, at least 6 micrometers). In addition, if the thin polymer film is directly used for double-sided plating, it may not be effectively insulated due to penetration of plated atoms, plated particles and/or plasma during plating (e.g., sputtering or similar plasma deposition plating). Therefore, how to manufacture a composite copper foil with a small thickness and still having good quality is a subject of research. Disclosure of Invention The invention aims at a composite copper foil and a manufacturing mode thereof, and the structure and/or the manufacturing mode of the composite copper foil are simpler, and the thickness can be thinner, but still the composite copper foil has good quality. According to an embodiment of the invention, a method for manufacturing a composite copper foil includes the steps of providing a first copper foil and a second copper foil separated in structure, forming an insulating bonding material between the first copper foil and the second copper foil, and forming the insulating bonding material into an insulating bonding layer so that the first copper foil and the second copper foil are bonded via the insulating bonding layer. According to an embodiment of the present invention, a composite copper foil includes a first copper foil, a second copper foil, and an insulating bonding layer. The insulating bonding layer is located between the first copper foil and the second copper foil. The insulating bonding layer has a thickness of less than 5 microns. Based on the above, the manufacturing mode and/or structure of the composite copper foil of the invention can be simpler, and the thickness can be thinner, but still the composite copper foil can have good quality. Drawings Figure 1 is a partial flow diagram of a method of partially manufacturing a composite copper foil according to one embodiment of the invention. Fig. 2A to 2E are schematic partial side views of a method for partially manufacturing a composite copper foil according to an embodiment of the present invention. Description of the reference numerals 80, Compounding copper foil; A first copper-containing foil carrier; 11, a first bearing body; A first peelable layer 12; 13, a first copper foil; A second copper-containing foil carrier 20; A second carrier 21; A second peelable layer 22; 23, a second copper foil; 33 an insulating bonding layer; 39 insulating bonding material; t11, T12, T13, T33, T39; s10, S20, S30, S40, S50 and S60. Detailed Description Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts. In the following detailed description, for purposes of explanation and not limitation, example embodiments disclosing specific details are set forth in order to provide a thorough understanding of the various principles of the present invention. However, it will be apparent to one having ordinary skill in the art having had the benefit of the present disclosure, that the present invention may be practiced in other embodiments that depart from the specific details disclosed herein. In addition, descriptions of well-known devices, methods and materials may be omitted so as to not obscure the description of the various principles of the present invention. Ranges may be expressed herein as from "about" one particular value to "about" another particular value, as well as directly to one particular value and/or to another particular value. When the range is expressed, another embodiment includes from the one particular value and/or to the other particular value. Similarly, when values are expressed as approximations, by use of the antecedent "about," it will be understood that the particular value forms another embodiment. It will be further understood that the endpoints of each of the ranges are obviously related to the other endpoint or independent of the other endpoint. Non-limiting terms