CN-121989548-A - Film tearing device and film tearing method
Abstract
The application relates to a film tearing device and a film tearing method. A film tearing device comprises a bearing seat, a film tearing mechanism and a position sensor. The carrier has a carrier surface for carrying the substrate with the film material attached thereon. The dyestripping mechanism comprises a clamping piece and a dyestripping piece. The film tearing piece is used for stripping the film material, and the film tearing piece can be moved close to the clamping piece to jointly clamp the film material. The position sensor is arranged corresponding to the film tearing mechanism, and can move along the normal direction of the bearing surface relative to the film tearing mechanism to be close to the outer surface of the substrate. And obtaining a displacement compensation value according to the displacement of the sensing end of the position sensor relative to the film tearing piece, wherein the film tearing piece can move away from the clamping piece along the normal direction of the bearing surface according to the displacement compensation value.
Inventors
- LIN YINGSONG
- LAI JINSEN
- CHEN JUNWEI
Assignees
- 志圣科技(广州)有限公司
Dates
- Publication Date
- 20260508
- Application Date
- 20241106
Claims (12)
- 1. A film tearing apparatus comprising: a bearing seat having a bearing surface for bearing a substrate to which a film material is attached; a film tearing mechanism comprising a clamping member and a film tearing member for peeling the film material and movable close to the clamping member to jointly clamp the film material, and The position sensor is arranged corresponding to the film tearing mechanism and can move along the normal direction of the bearing surface relative to the film tearing mechanism to be close to an outer surface of the substrate; And the film tearing piece moves away from the clamping piece along the normal direction of the bearing surface according to the displacement compensation value.
- 2. The film tearing apparatus of claim 1, wherein the clamping member comprises a first clamping surface facing the carrier, the film tearing member comprises a second clamping surface facing the first clamping surface, the first clamping surface and the second clamping surface jointly clamp the film material, and the normal directions of the first clamping surface and the second clamping surface are not parallel to the normal direction of the carrier.
- 3. The film tearing apparatus of claim 2, wherein the film tearing member further comprises a knife portion closer to the carrier than the second clamping surface, and the knife portion is configured to peel the film material.
- 4. The film tearing apparatus of claim 2, wherein the first clamping surface and the second clamping surface each have a protrusion structure.
- 5. The film tearing apparatus of claim 2, further comprising a cleaning unit disposed corresponding to the film tearing member of the film tearing mechanism to clean the second clamping surface of the film tearing member.
- 6. The film tearing apparatus of claim 1 wherein the position sensor is a contact position sensor.
- 7. A film tearing method comprising: Providing a substrate with a film material attached to a bearing surface; abutting a clamping piece against the film material; executing a position compensation procedure, comprising: Moving a position sensor along the normal direction of the bearing surface to align a sensing end of the position sensor with the substrate, and Obtaining a displacement compensation value according to the displacement of the sensing end relative to a film tearing piece; Performing a film edge stripping procedure comprising: moving the film tearing piece along the normal direction of the bearing surface according to the displacement compensation value so as to enable the film tearing piece to be abutted against the substrate; Peeling an edge portion of the film material with the film tearing member, and The edge part is clamped by the film tearing piece and the clamping piece together, and The film tearing piece and the clamping piece are jointly moved to peel off the film material.
- 8. The film tearing method of claim 7, wherein peeling the edge portion of the film material with the film tearing member comprises: reversely moving the film tearing piece abutting against the substrate to a stripping position by a correction distance, wherein the correction distance is smaller than the displacement compensation value; The stripping part at the stripping position moves along a stripping direction perpendicular to the normal direction of the bearing surface so as to separate the edge part from the substrate.
- 9. The film tearing method of claim 8, wherein co-clamping the edge portion with the film tearing member and the clamping member comprises: and moving the film tearing piece to be close to the clamping piece so that the edge part is clamped between the film tearing piece and the clamping piece.
- 10. The film tearing method of claim 7 wherein the film edge peel procedure is repeatedly performed.
- 11. The method of claim 7, wherein the gripper is not moved during the position compensation process.
- 12. The method of claim 7, wherein the position sensor is a touch position sensor and the sensing end is abutted against the substrate during the position compensation process.
Description
Film tearing device and film tearing method Technical Field The present invention relates to a film tearing device and a film tearing method, and more particularly, to a film tearing device and a film tearing method using a position sensor. Background In the industry of semiconductor or electronic components, a part of the manufacturing process needs to attach a multi-layer film material on a substrate, wherein the outermost release film plays roles of preventing dust from adhering, protecting static electricity or isolating from air. The work flow for attaching the film stock typically includes a film attaching process and a film tearing process for removing the film stock. Because the thickness of the film material of part of the product is very thin and the viscosity is higher, if the electronic component which is easy to remain residual glue and even hurt the surface of the substrate is directly torn off, for the product with the characteristics, the edge of the film material is lifted by using the film tearing device, and then the whole film material is torn off. Currently, the industry is developing an automated film tearing device, but the automated film tearing is challenging due to the thickness diversity of the film materials. Furthermore, the film tearing device can be suitable for various substrates (such as a circuit board or a copper foil), but the substrates may have different thicknesses, so that the film tearing piece of the film tearing device cannot accurately move to a position suitable for film tearing when film tearing operation is performed. Disclosure of Invention In view of the above, the present invention provides a film tearing device, which is helpful to solve the problem that a film tearing member cannot be moved to a film tearing position accurately. The invention also provides a film tearing method. The film tearing device disclosed by the invention comprises a bearing seat, a film tearing mechanism and a position sensor. The carrier has a carrier surface for carrying the substrate with the film material attached thereon. The film tearing mechanism comprises a clamping piece and a film tearing piece. The film tearing piece is used for stripping the film material, and the film tearing piece can be moved close to the clamping piece to jointly clamp the film material. The position sensor is arranged corresponding to the film tearing mechanism, and can move along the normal direction of the bearing surface relative to the film tearing mechanism to be close to the outer surface of the substrate. A displacement compensation value is obtained according to the displacement of a sensing end of the position sensor relative to the film tearing piece, and the film tearing piece can move away from the clamping piece along the normal direction of the bearing surface according to the displacement compensation value. The film tearing method disclosed by the invention comprises the steps of providing a substrate attached with film materials on a bearing surface, abutting a clamping piece against the film materials, executing a position compensation procedure, executing a film edge peeling procedure, and jointly moving the film tearing piece and the clamping piece to peel the film materials. The position compensation program comprises moving a position sensor along the normal direction of the bearing surface so as to align a sensing end of the position sensor with the substrate, and obtaining a displacement compensation value according to the displacement of the sensing end relative to a film tearing piece. The film edge stripping procedure comprises the steps of moving the film tearing piece along the normal direction of the bearing surface according to the displacement compensation value so as to enable the film tearing piece to be abutted against the substrate, stripping one edge part of the film material by the film tearing piece, and clamping the edge part by the film tearing piece and the clamping piece together. According to the film tearing device and the film tearing method disclosed by the invention, the position sensor can be moved close to the surface of the substrate to obtain a displacement compensation value related to the displacement of the sensing end relative to the film tearing piece. The tear film element can then be moved along away from the grip element in accordance with this displacement compensation value. Furthermore, the moving distance of the film tearing piece can be determined according to the displacement compensation value, so that the film tearing piece can be accurately moved to the surface of the substrate, the situation that the stripping position cannot be accurately reached in the follow-up process due to the fact that the moving distance of the film tearing piece is too short can not occur, and the situation that the substrate is crushed by the film tearing piece due to the fact that the moving distance of the film tearing piece is too long can not occur.