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CN-121990770-A - Article of controlled bond sheet and method of making the same

CN121990770ACN 121990770 ACN121990770 ACN 121990770ACN-121990770-A

Abstract

The present application relates to articles of controlled bond sheet material and methods of making the same. Described herein are articles and methods of manufacture of articles, including a first sheet and a second sheet, wherein the sheet and carrier are bonded together with a coating, preferably a hydrocarbon polymer coating, and related deposition methods and inert gas treatments that can be applied to one or both sheets to control van der Waals, hydrogen, and covalent bonding between the sheets. The coating bonds the sheets together to prevent permanent bonding under high temperature processing while maintaining sufficient bonding to prevent delamination during high temperature processing.

Inventors

  • K. Adibi
  • R.A. Bellman
  • FENG JIANGWEI
  • G.M. Goyanov
  • LIANG ZHIWEI
  • S.LIU
  • P. Mazongda

Assignees

  • 康宁股份有限公司

Dates

Publication Date
20260508
Application Date
20170829
Priority Date
20160831

Claims (20)

  1. 1. An article of manufacture, comprising: a first sheet comprising a first sheet bonding surface, and A coating disposed on the first sheet bonding surface, the coating comprising a first coating bonding surface, a second coating bonding surface opposite the first coating bonding surface, and a refractive index greater than about 1.8, the first coating bonding surface bonded to the first sheet bonding surface, the coating further comprising a polymerized hydrogenated amorphous hydrocarbon compound, an intensity ratio of peaks in the raman spectrum of the coating that range from 1350 to 1400 cm -1 to peaks that range from 1530 to 1600 cm -1 of 0.5 to 0.6, and a polar functional group added with a precursor selected from hydrogen, carbon dioxide, nitrogen, nitrous oxide, ammonia, acrylic acid, allylamine, allyl alcohol, or mixtures thereof.
  2. 2. The article of claim 1, wherein the coating has an optical bandgap of less than 2 eV.
  3. 3. The article of claim 1, further comprising a second sheet bonding surface through which bonding occurs.
  4. 4. The article of claim 3, wherein at least one of the first sheet or the second sheet is a glass sheet.
  5. 5. The article of claim 1, wherein the average thickness of the coating is less than 10 nm a.
  6. 6. The article of claim 1, wherein the coating is a monolayer.
  7. 7. The article of claim 1, wherein the first sheet has an average thickness of less than 200 μm.
  8. 8. The article of any of claims 1-7, wherein the first coating bond surface has a bond energy to the first sheet bond surface of 600 mJ/m 2 or less after holding the article in an oven at 600 ℃ in a nitrogen atmosphere for 10 minutes.
  9. 9. The article of claim 1, wherein the first coating bond surface has a bond energy of 500 mJ/m 2 or less to the first sheet bond surface after holding the article in a nitrogen atmosphere oven at a temperature of 500 ℃ for 10 minutes.
  10. 10. The article of claim 1, wherein the percent bubble area variation of the coating according to degassing test #1 is less than or equal to 10% after holding the article in a furnace at a temperature of 600 ℃ in a nitrogen atmosphere for 10 minutes.
  11. 11. The article of claim 1, wherein the percent bubble area of the coating according to degassing test #1 varies by less than 10% after holding the article in a nitrogen atmosphere oven at a temperature of 500 ℃ for 10 minutes.
  12. 12. A method of making an article, comprising: Forming a coating on the first sheet bonding surface of the first sheet by vapor depositing a precursor compound on the first sheet bonding surface, the precursor compound comprising greater than 90% by weight hydrogen and carbon, and Wherein the coating comprises a polymerized hydrogenated amorphous hydrocarbon compound, a first coating bond surface, and a second coating bond surface opposite the first coating bond surface.
  13. 13. The method of claim 12, forming a coating by depositing a hydrocarbon precursor compound having the formula C n H y , wherein n is 1 to 6 and y is 2 to 14.
  14. 14. The method of claim 12, further comprising bonding the second coating bonding surface to a second sheet bonding surface of a second sheet.
  15. 15. The method of claim 12, wherein the hydrocarbon precursor compound is selected from the group consisting of alkanes, alkenes, and alkynes.
  16. 16. The method of claim 12, wherein the hydrocarbon precursor compound is an alkane selected from the group consisting of methane, ethane, propane, butane, pentane, and hexane.
  17. 17. The process of claim 12 wherein the hydrocarbon precursor compound is an olefin selected from the group consisting of ethylene, propylene, butene, pentene, and hexene.
  18. 18. The method of claim 12, wherein the hydrocarbon precursor compound is an alkyne selected from the group consisting of acetylene, propyne, butyne, pentyne, and hexyne.
  19. 19. The method of claim 14, wherein at least one of the first sheet or the second sheet is a glass sheet.
  20. 20. The method of claim 12, further comprising increasing the surface energy of the second coating bond surface by exposing the second coating bond surface to oxygen, nitrogen, or a combination thereof prior to bonding the second sheet bond surface to the second coating bond surface.

Description

Article of controlled bond sheet and method of making the same Cross reference to related applications The present application claims priority from U.S. patent application serial No. 62/381,731, filed on even date 08, 2016, 35, 119, and is hereby incorporated by reference in its entirety. Technical Field The present disclosure relates generally to articles for use with articles comprising sheets on a carrier and methods of making sheets on a carrier, and more particularly to articles for use with articles comprising flexible glass sheets controllably bonded to a glass carrier and methods of making flexible glass sheets controllably bonded to a glass carrier. Background The flexible substrate material offers the manufacturing possibilities of cheaper devices using roll-to-roll processing, as well as the potential to manufacture thinner, lighter, more flexible and durable displays. But the techniques, equipment and processes required for roll-to-roll processing of high quality displays have not been fully established. Because panel manufacturers have heavily invested in kits for processing large glass sheets, laminating flexible substrates to carriers and manufacturing display devices on flexible substrates by sheet-to-sheet processing provides a shorter term solution for developing valuable programs for thinner, lighter, and more flexible displays. Displays on polymer sheets, such as polyethylene naphthalate (PEN), have been demonstrated wherein the device fabrication is in the form of sheets-sheets with PEN laminated to a glass carrier. The upper temperature limit of PEN limits the device quality and the processes that can be used. In addition, the high permeability of the polymeric substrate results in environmental degradation of the Organic Light Emitting Diode (OLED) device, requiring a nearly hermetic package. Thin film packaging offers the possibility to overcome this limitation, but it has not been demonstrated to provide acceptable yields even in large volumes. In a similar manner, a glass carrier laminated to one or more thin glass substrates may be used to fabricate a display device. The low permeability, improved temperature and chemical resistance of thin glass are expected to enable higher performance, longer life flexible displays. Vacuum and wet etching environments may also be used during Low Temperature Polysilicon (LTPS) device fabrication, for example, for temperatures typically approaching 600 ℃ or higher. These conditions limit the materials that can be used and provide high demands on the carrier/sheet. There is therefore a need for a carrier method that allows the processing of thin glass (glass having a thickness of 0.3 millimeters (mm)) without contaminating or compromising the bond strength between the thin glass and the carrier at higher processing temperatures, using investment equipment available to the manufacturer, and wherein the thin glass is easily debonded from the carrier at the end of the processing. One commercial advantage is that manufacturers will be able to use the capital investment of their existing processing equipment while gaining the benefit of thin glass sheets for use in, for example, photovoltaic (PV) structures, OLEDs, liquid Crystal Displays (LCDs), and patterned Thin Film Transistor (TFT) electronics. In addition, such methods allow for processing flexibility including cleaning of thin glass sheets and carriers and surface preparation processes to promote bonding. The challenge of the known bonding method is the high temperature used to process the polysilicon TFTs. Hand-held, notebook and desktop displays are pushing panel manufacturers to shift from amorphous silicon TFT backplanes to oxide TFT or polysilicon TFT panels for the demand for higher pixel densities, high resolution and fast refresh rates, and for more widely used OLED displays. Because OLEDs are current driven devices, high mobility is required. Polysilicon TFTs also offer the advantage of integrating drive and other component activation. In the polysilicon TFT process, a higher temperature (ideally, a temperature in excess of 600 ℃) is preferred for dopant activation. Disclosure of Invention In view of this, there is a need for a sheet-carrier article that can withstand the rigors of TFT and Flat Panel Display (FPD) processing, including high temperature processing (without outgassing that would be incompatible with the semiconductor or display manufacturing process for which it is intended), yet still achieve removal of the entire sheet area from the carrier (either all-at-once or staged removal), so that the carrier can be reused for processing another sheet. The present specification describes methods of controlling adhesion between a multi-sheet article (e.g., carrier and sheet) and creating a temporary bond that is strong enough to withstand TFT and FPD processing (including processing at temperatures of about 300 ℃, about 400 ℃, about 500 ℃, and up to at least 600 ℃, including any r