CN-121991269-A - Curable composition, film forming method, and method for producing product

Abstract

Curable composition, film forming method, and method for producing product. The curable composition comprises a polymerizable compound (a), a photopolymerization initiator (b), and a solvent (d). The curable composition has a viscosity of 1.3 mPa-s to 60 mPa-s at 23 ℃ and 1 atm. The amount of the solvent (d) is more than 5% by volume to 95% by volume relative to the entire curable composition. The boiling point of solvent (d) is less than 250 ℃. The curable composition in the state excluding the solvent (d) has a viscosity of 8 mPa s to 30 mPa s at 23 ℃ and 1 atm.

Inventors

• ITO YUTO
• ITO TOSHIHIRO
• KAWATA ISAO
• Imamura naruki
• NAKADA EIICHI

Assignees

• 佳能株式会社

Dates

Publication Date

20260508

Application Date

20251031

Priority Date

20241105

Claims (20)

1. 1. A curable composition comprising a curable resin composition and a curable resin, the curable composition comprises: A polymerizable compound (a); Photopolymerization initiator (b), and A solvent (d) having a boiling point of less than 250 ℃, the amount of the solvent being from more than 5% to 95% by volume relative to the whole curable composition, Wherein, the The curable composition has a viscosity of 1.3 mPa s to 60 mPa s at 23 ℃ and 1 atm, and The viscosity of the composition formed by excluding the solvent (d) from the curable composition is 8 mPa s to 30 mPa s at 23 ℃ and 1 atm.
2. 2. A curable composition comprising a curable resin composition and a curable resin, the curable composition comprises: A polymerizable compound (a); A photopolymerization initiator (b); A surfactant (C) having a viscosity of 500 mPa s or less at 23 ℃ and 1 atm, and A solvent (d) having a boiling point of less than 250 ℃, the amount of the solvent being from more than 5% to 95% by volume relative to the whole curable composition, Wherein the curable composition has a viscosity of 1.3 mPa s to 60 mPa s at 23 ℃ and 1 atm.
3. 3. The curable composition according to claim 1, wherein a viscosity of a composition formed by excluding the solvent (d) from the curable composition is 8 mPa s to 20 mPa s at 23 ℃ and 1 atm.
4. 4. The curable composition according to claim 2, wherein the surfactant (C) has a viscosity of 400 mPa s or less at 23 ℃ and 1 atm.
5. 5. The curable composition of claim 1, wherein the solvent (d) comprises one or more solvents, and the one or more solvents each have a boiling point of 100 ℃ to less than 250 ℃ at 1 atm.
6. 6. The curable composition according to claim 1, wherein the polymerizable compound (a) comprises one or more polymerizable compounds, and the one or more polymerizable compounds each have a boiling point of 250 ℃ or higher at 1 atm.
7. 7. The curable composition according to claim 1, wherein the polymerizable compound (a) comprises a monofunctional polymerizable compound and a polyfunctional polymerizable compound, and Wherein the polyfunctional polymerizable compound accounts for 20 mass% or more of the polymerizable compound (a).
8. 8. The curable composition according to claim 1, wherein the polymerizable compound (a) comprises one or more polymerizable compounds, and each of the one or more polymerizable compounds has a molecular weight of 200 or more.
9. 9. The curable composition according to claim 1, wherein the polymerizable compound (a) comprises a polymer having a polymerizable functional group.
10. 10. The curable composition according to claim 1, wherein the curable composition exhibits a glass transition temperature of 70 ℃ or higher after curing.
11. 11. The curable composition according to claim 1, wherein the polymerizable compound (a) comprises one or more polymerizable compounds, and the one or more polymerizable compounds each have a vapor pressure of 0.001 mmHg or less at 80 ℃ and 1 atm.
12. 12. The curable composition according to claim 1, wherein the polymerizable compound (a) comprises a compound (a-1) having an aromatic structure, an aromatic heterocyclic structure, or an alicyclic structure.
13. 13. The curable composition according to claim 1, Wherein, the The polymerizable compound (a) includes one or more polymerizable compounds, and The polymerizable compound (a) has a large western parameter abbreviated as OP of 1.80 to 4.00, which is a mole fraction weighted average of N/(Nc-No) values of respective molecules of the one or more polymerizable compounds, where N represents a total number of atoms in the molecule, nc is a number of carbon atoms in the molecule, and No is a number of oxygen atoms in the molecule.
14. 14. The curable composition according to claim 1, wherein the composition obtained by removing the solvent (d) contains 10 mass% or more of silicon atoms.
15. 15. The curable composition according to claim 1, wherein the curable composition has a carbon dioxide solubility coefficient of 0.5 kg/m 3 .atm to 10kg/m 3 .atm.
16. 16. The curable composition according to claim 1, wherein the curable composition is used in an inkjet method.
17. 17. A film forming method for forming a film of a curable composition on a substrate using a die, the method comprising: Discretely applying a plurality of droplets of the curable composition of any one of claims 1 to 16 onto the substrate; After the application of the droplets, contacting the plurality of droplets on the substrate with a mold so as to form a liquid film between the substrate and the mold; solidifying the liquid film into a solidified film after the contacting of the liquid droplets with the mold, and The cured film is released from the mold after the curing.
18. 18. The film forming method of claim 17, further comprising waiting until the droplets of the curable composition merge on the substrate, thereby forming a substantially continuous liquid film between the applying and the contacting, and until the solvent in the liquid film volatilizes.
19. 19. The film forming method according to claim 18, wherein the waiting is continued until the solvent in the liquid film volatilizes to 10% by volume or less with respect to the entire liquid film.
20. 20. The film forming method according to claim 18, wherein in the waiting step, the substrate is heated at a temperature of 30 ℃ to 200 ℃ for 10 seconds to 600 seconds.

Description

Curable composition, film forming method, and method for producing product Technical Field The present disclosure relates to curable compositions, film forming methods, and methods of making articles. Background In the field of semiconductor devices, microelectromechanical systems (MEMS), and the like, miniaturization is increasingly required, and imprint technology (optical imprint technology) is attracting attention as a microfabrication technology. In the imprint technique, a curable composition is supplied (applied) onto a substrate and cured in a state where a mold having a fine concave-convex pattern in a contact surface is in contact with the composition. Therefore, the concave-convex pattern of the mold is transferred to the cured film of the curable composition, thereby forming a pattern on the substrate. Imprint technology enables the formation of fine patterns (structures) having a size of several nanometers on a substrate. An example of patterning using imprint technology will be described. First, the liquid curable composition is discretely dropped (applied) in the pattern forming region on the substrate. The droplets of the curable composition in the pattern forming region spread on the substrate surface. This phenomenon is called pre-spreading. Next, the curable composition on the substrate is brought into contact with (pressed against) the contact surface of the mold. Therefore, the droplets of the curable composition spread over the gap between the substrate and the mold due to capillary action. This phenomenon is known as spreading. In addition, the curable composition fills the concave portion of the mold pattern due to capillary action. This phenomenon is called filling. The duration of time required to complete such spreading and filling is called the filling time. After the completion of the filling, the curable composition is irradiated with light to be cured. The cured composition on the substrate is then separated from the mold. Therefore, a cured pattern of the curable composition is formed by transferring the pattern of the mold to the curable composition on the substrate by these steps. At this time, the cured pattern of the curable composition formed on the substrate has a residual film. The residual film is a cured film that remains between the concave portion (convex portion of the mold pattern) of the cured film of the curable composition and the substrate. In addition, photolithography for manufacturing semiconductor devices requires that the substrate be planarized. For example, in extreme ultraviolet lithography (EUV), which is a lithography technology that has attracted attention in recent years, since the depth of focus for forming a projected image decreases with the progress of miniaturization, the relief pattern in the substrate surface to which the curable composition is supplied must be limited to several tens of nanometers or less. The imprint technique also needs to be planarized to the same extent as EUV to improve the filling degree of the curable composition and line width accuracy. In the planarization technique (japanese patent laid-open No. 2019-140394), a flat surface is formed by discretely dropping a curable composition onto a substrate having a concave-convex structure in an amount corresponding to the concave-convex structure and then curing the composition while being in contact with a mold having the flat surface. In the pattern forming method and the planarization technique using imprinting, the curable composition on the substrate is brought into contact with the mold in a state where droplets of the curable composition are not in contact with each other. This process inevitably results in air bubbles being trapped between the mold, substrate and composition. Therefore, it takes a long time for the bubbles to diffuse through the mold and the substrate so as to disappear, which is one of factors that reduce productivity (yield). Therefore, a technique of combining droplets of the curable composition on a substrate before bringing the curable composition into contact with a mold has been developed (see japanese patent laid-open No. 2022-188736). The technique disclosed in japanese patent laid-open No. 2022-188736 requires that the curable composition fills the contact area (pattern forming area) between the mold and the substrate to the end (edge) by bringing the mold into contact with the liquid film of the curable composition formed by spreading the liquid droplets (pressing against the liquid film). This phenomenon is called edge filling. The speed at which edge filling is performed is referred to as the edge filling speed. In a pattern forming method and a planarization technique using imprinting, in which droplets of a curable composition on a substrate are brought into contact with a mold, it takes a certain time to fill a desired region (pattern forming region) up to a tip (edge). This is one of factors that reduce productivity (yield). Disclos