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CN-121991302-A - Resin composition, article thereof and use thereof

CN121991302ACN 121991302 ACN121991302 ACN 121991302ACN-121991302-A

Abstract

The invention provides a resin composition, which comprises 100 parts by weight of unhydrogenated maleic anhydride modified first polyolefin, 20-100 parts by weight of acrylic ester monomer, oligomer or combination thereof, wherein the acrylic ester monomer has more than two unsaturated carbon-carbon double bonds, and 5-160 parts by weight of benzocyclobutene modified second polyolefin. In addition, the present invention provides an article made of the above resin composition, which is improved in at least one of the characteristics of tin-float crack rate, tensile force to copper foil, Z-axis thermal expansion rate, water absorption rate, dielectric loss, etc. The invention also provides application of the resin composition in a resin filling process of a printed circuit board.

Inventors

  • ZHANG YAN
  • WANG RONGTAO
  • JIA ZHENG
  • JIANG XUEYAN

Assignees

  • 台光电子材料(昆山)股份有限公司

Dates

Publication Date
20260508
Application Date
20241105

Claims (20)

  1. 1. A resin composition comprising a resin, a binder and a binder, characterized by comprising the following steps: 100 parts by weight of unhydrogenated maleic anhydride-modified first polyolefin; Component (B) 20 to 100 parts by weight of an acrylate monomer having two or more unsaturated carbon-carbon double bonds, an oligomer thereof, or a combination thereof, and And (C) 5-160 parts by weight of benzocyclobutene modified second polyolefin.
  2. 2. The resin composition of claim 1, wherein the unhydrogenated maleic anhydride-modified first polyolefin comprises any one of maleic anhydride-added polybutadiene, maleic anhydride-added polyisoprene, maleic anhydride-added styrene-butadiene copolymer, maleic anhydride-added styrene-isoprene copolymer, maleic anhydride-styrene copolymer, or a combination thereof.
  3. 3. The resin composition of claim 1, wherein the benzocyclobutene modified second polyolefin is 20 to 120 parts by weight.
  4. 4. The resin composition of claim 1, wherein the benzocyclobutene modified second polyolefin comprises any one of benzocyclobutene modified heteroatom-containing polyolefin, benzocyclobutene modified heteroatom-free polyolefin, or a combination thereof.
  5. 5. The resin composition according to claim 4, wherein the benzocyclobutene-modified second polyolefin comprises a benzocyclobutene-modified heteroatom-containing polyolefin and a benzocyclobutene-modified heteroatom-free polyolefin, and the mass ratio of the benzocyclobutene-modified heteroatom-free polyolefin to the benzocyclobutene-modified heteroatom-containing polyolefin is 1:3 to 7:1.
  6. 6. The resin composition of claim 4, wherein the heteroatom-containing polyolefin comprises any one of maleic anhydride-added polybutadiene, maleic anhydride-added polyisoprene, maleic anhydride-added styrene-butadiene copolymer, maleic anhydride-added styrene-isoprene copolymer, vinyl-polybutadiene-urea ester polymer, silane-modified styrene-butadiene copolymer, terminal acryl-polybutadiene, epoxy-containing polybutadiene, or a combination thereof.
  7. 7. The resin composition of claim 4, wherein the polyolefin that does not contain heteroatoms comprises any one of polybutadiene, polyisoprene, styrene-butadiene copolymer, styrene-isoprene copolymer, styrene-butadiene-divinylbenzene polymer, styrene-ethylene-divinylbenzene polymer, styrene-ethylvinylbenzene-divinylbenzene polymer, or a combination thereof.
  8. 8. The resin composition of claim 1, wherein the acrylate monomer comprises any one of tricyclodecane dimethanol di (meth) acrylate, dioxane glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, tris (2-hydroxyethyl) isocyanurate tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, di-trimethylolpropane tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, or a combination thereof.
  9. 9. The resin composition of claim 1, wherein the acrylate monomer has two acrylate groups or three acrylate groups.
  10. 10. The resin composition of claim 1, wherein the acrylate monomer or oligomer thereof has a glass transition temperature of greater than or equal to 90 ℃ after curing.
  11. 11. The resin composition of claim 1, wherein the acrylate monomer or oligomer thereof has a glass transition temperature of greater than or equal to 150 ℃ after curing.
  12. 12. The resin composition of claim 1, wherein the resin composition does not include an organic solvent.
  13. 13. The resin composition of claim 1, further comprising any one of or a combination of a polyolefin other than the unhydrogenated maleic anhydride modified first polyolefin and the benzocyclobutene modified second polyolefin, a cross-linking agent containing unsaturated carbon-carbon double bonds, a benzoxazine resin, an epoxy resin, an active ester, a phenolic resin, an amine curing agent, a polyamide, a polyimide, a cyanate resin.
  14. 14. The resin composition of claim 1, further comprising any one or combination of an inorganic filler, a flame retardant, a hardening accelerator, a polymerization inhibitor, a colorant, a silane coupling agent, a surfactant, a toughening agent.
  15. 15. An article made from the resin composition according to any one of claims 1 to 14, wherein the article comprises a prepreg, a resin film, a laminate or a printed circuit board.
  16. 16. An article made from the resin composition of any one of claims 1 to 14, wherein the article comprises a resin cured product obtained by curing the resin composition.
  17. 17. The article of claim 16, wherein the article has one or more of the following characteristics: the tin-float crack rate measured by the method of reference IPC-TM-650.2.4.13.1 is 0%; The tensile force to the copper foil measured by the method of reference IPC-TM-650.2.4.8 is more than or equal to 3.5lb/in; the Z-axis thermal expansion rate measured by a method of referring to IPC-TM-650.2.4.24.5 is less than or equal to 1.72%; the water absorption measured by the methods of the references IPC-TM-650.2.6.2.1 and IPC-TM-650.6.16.1 is less than or equal to 0.39%, and The dielectric loss measured at a frequency of 10GHz by the method referenced JIS C2565 is less than or equal to 0.0048.
  18. 18. Use of the resin composition according to any one of claims 1 to 14 in a resin-stuffing process for printed circuit boards.
  19. 19. The use of claim 18, wherein the printed circuit board resin fill process comprises a printed circuit board plug hole process, a printed circuit board slot fill process, or a printed circuit board circuit fill process.
  20. 20. The use according to claim 19, wherein in the printed circuit board plugging process, at least one hole of a printed circuit board is filled with a cured product of the resin composition, in the printed circuit board slot filling process, at least one groove of a printed circuit board is filled with a cured product of the resin composition, and in the printed circuit board circuit filling process, at least one circuit open area of a printed circuit board is covered with a cured product of the resin composition.

Description

Resin composition, article thereof and use thereof Technical Field The present invention relates to a resin composition, an article thereof and use thereof, and more particularly, to a resin composition suitable for use in a resin-stuffing process of a printed circuit board (Printed Circuit Board, PCB). Background With the development of miniaturization of assembly components, PCBs are increasingly miniaturized and thinned, and wiring areas of PCBs are also continuously reduced, which requires higher densities of PCB wiring. The resin filling process is a new technology invented for shrinking the design size of the PCB to match with assembled components, and effectively improves the reliability and the manufacturing process capability of a high-density interconnection technology (HIGH DENSITY Interconnect, HDI). Meanwhile, the resin filling technology is used for solving the problem which cannot be solved by green oil filling or pressing filling. For example, the resin is used to fill the blind/buried/through holes of the inner layer or the resin is used to fill the open areas of the thick copper circuit, and then the pressing is performed, so that the contradiction between the thickness control of the pressed dielectric layer and the design of the inner layer filling glue is balanced. For example, filling the via holes with resin improves the reliability issues associated with green oil filling. However, in the prior art, the resin composition used in the resin filling process is mainly prepared by using the traditional epoxy resin and calcium carbonate, and has the problems of poor characteristics, such as high water absorption and dielectric loss, high Z-axis thermal expansion rate, high curing shrinkage rate, low tensile force on copper foil, high tin-float crack rate and the like, so that the requirement of the printed circuit board for high-frequency high-speed information transmission cannot be met. Disclosure of Invention In view of the problems encountered in the prior art, and in particular, the prior art material fails to meet one or more of the above-mentioned characteristics, it is a primary object of the present invention to provide a resin composition capable of solving at least one of the above-mentioned problems, an article made of the resin composition, and use of the resin composition in a printed circuit board plugging process, a printed circuit board slot filling process, or a printed circuit board circuit filling process. In one aspect, the present invention provides a resin composition comprising: 100 parts by weight of unhydrogenated maleic anhydride-modified first polyolefin; Component (B) 20 to 100 parts by weight of an acrylate monomer having two or more unsaturated carbon-carbon double bonds, an oligomer thereof, or a combination thereof, and And (C) 5-160 parts by weight of benzocyclobutene modified second polyolefin. In another aspect, the present invention also provides an article made of the above resin composition, which comprises a prepreg, a resin film, a laminate or a printed circuit board. In still another aspect, the present invention also provides an article made of the above resin composition, comprising a resin cured product obtained by curing the resin composition. The aforementioned resin composition and its article have at least one of the following characteristics: the tin-float crack rate measured by the method of reference IPC-TM-650.2.4.13.1 is 0%; The tensile force to the copper foil measured by the method of reference IPC-TM-650.2.4.8 is more than or equal to 3.5lb/in; the Z-axis thermal expansion rate measured by a method of referring to IPC-TM-650.2.4.24.5 is less than or equal to 1.72%; the water absorption measured by the methods of the references IPC-TM-650.2.6.2.1 and IPC-TM-650.6.16.1 is less than or equal to 0.39%, and The dielectric loss measured at a frequency of 10GHz by the method referenced JIS C2565 is less than or equal to 0.0048. In yet another aspect, the present invention provides the use of the foregoing resin composition in a resin-stuffing process for printed circuit boards. The printed circuit board resin filling process comprises a printed circuit board hole filling process, a printed circuit board slot filling process or a printed circuit board circuit filling process. In the printed circuit board plugging process, at least one hole of the printed circuit board is filled with a cured product of the resin composition. In the slot filling process of the printed circuit board, at least one groove of the printed circuit board is filled with a cured product of the resin composition. In the printed circuit board circuit filling process, at least one circuit open area of a printed circuit board is covered with a cured product of the resin composition. Detailed Description The following examples further illustrate the aspects of the invention in detail, but are not intended to limit the scope of the invention in any way. The terms used in the