CN-121991319-A - Photocurable resin component, perovskite solar cell device, preparation method and application

Abstract

The invention relates to a photo-curing resin component, a perovskite solar cell device, a preparation method and application thereof. The photo-curing resin component is prepared from raw materials including epoxy resin, acrylic acid or acrylic acid derivatives, organic alkali, polymerization inhibitor, photoinitiator and optional filler. The photo-curing resin component can be used for efficiently packaging perovskite solar cell devices, and aims to improve the stability and service life of the cell devices. The novel photo-curing resin of the invention uses the epoxy acrylate as a main component, and can effectively avoid chemical reaction with the perovskite active layer, thereby prolonging the effective working time of the battery. The invention successfully prepares the photo-curing resin with good light transmittance, weather resistance and mechanical property by optimizing the raw material proportion and the preparation process. In addition, the preparation method of the resin is simple and convenient, has high cost efficiency, is suitable for large-scale production, and provides a high-efficiency and stable new material solution for the field of perovskite solar cell encapsulation.

Inventors

• CAO MENGYU
• JI WENXI
• LI JI
• XU NING
• WANG SHUYANG
• Niu xinmiao
• DU JIAQI
• LI BINGHAI

Assignees

• 中国石油化工股份有限公司
• 中石化(北京)化工研究院有限公司

Dates

Publication Date

20260508

Application Date

20241106

Claims (10)

1. 1. A photo-curing resin component is prepared from raw materials including epoxy resin, acrylic acid or acrylic acid derivative, organic base, polymerization inhibitor, photoinitiator and optional filler.
2. 2. The photocurable resin component according to claim 1, characterized in that: The epoxy resin is selected from at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, hydrogenated bisphenol A epoxy resin and alicyclic epoxy resin, and/or, The acrylate derivative is selected from at least one of methacrylic acid, acrylic acid ester, methacrylic acid ester, silicon-containing or fluorine-containing acrylic acid ester, and/or, The organic base is at least one selected from diethyl amine, diisopropylamine, triethylamine, triethanolamine and benzylamine, and/or, The polymerization inhibitor is at least one selected from p-methoxyphenol, 2, 6-di-tert-butyl-p-methylphenol, p-methoxyphenyldiphenol, 2, 6-tetramethylpiperidine-1-nitroxide radical, hydroxydiphenyl methane, N-ethylhydroxylamine, thiourea, 4-hydroxy-2, 6-tetramethylpiperidine-N-oxide, and/or, The photoinitiator is selected from at least one of 2-hydroxy-2-methyl-1-phenylpropion, 1-hydroxycyclohexyl benzophenone, 2,4, 6-trimethylbenzoyl diphenyl phosphine oxide, 2-dimethoxy phenyl acetophenone, 2-hydroxy-2-methyl-1-phenyl-1-acetone, phenyl bis (2, 4, 6-trimethylbenzoyl) phosphine oxide, 2-hydroxy-2-methyl-1- [4- (2-hydroxy ethoxy) phenyl ] -1-acetone, benzoin diethyl ether, bis (2, 4, 6-trimethylbenzoyl) phosphine oxide, benzophenone, dimethyl thiobenzimidazole, oxazolidone and 4,4' -diamino benzophenone, The filler is at least one selected from UV resistant agent, light conversion material, antioxidant, tackifier, toughening agent, flame retardant and nanomaterial.
3. 3. A process for the preparation of a photocurable resin component as claimed in any one of claims 1-2 which comprises mixing acrylic acid or an acrylic acid derivative, an organic base and a polymerization inhibitor and then adding dropwise the mixture to an epoxy resin, and after completion of the reaction, adding a photoinitiator and optionally a filler.
4. 4. A photocurable resin component according to claim 3, characterized in that: The epoxy resin is taken as 100 parts by weight, the acrylic acid or acrylic acid derivative is 12-50 parts by weight, the organic base is 0.5-5 parts by weight, the polymerization inhibitor is 0.5-10 parts by weight, the photoinitiator is 3-15 parts by weight, the filler is 0-5 parts by weight, preferably, the epoxy resin is taken as 100 parts by weight, the acrylic acid or acrylic acid derivative is 14-40 parts by weight, the organic base is 0.5-4 parts by weight, the polymerization inhibitor is 0.5-5 parts by weight, the photoinitiator is 5-15 parts by weight, and the filler is 0-3 parts by weight; More preferably, the molar ratio of the epoxy resin to the acrylic acid or acrylic acid derivative is 1 (0.8 to 1.2), preferably 1 (0.80 to 0.99).
5. 5. A method for producing a photocurable resin component according to claim 3, characterized in that: The reaction temperature is 75 to 105 ℃, preferably 80 to 90 ℃, and/or, The reaction time is 1.5 to 6 hours, preferably 2 to 3 hours.
6. 6. Use of the photocurable resin component according to any one of claims 1 to 2 or the photocurable resin component obtained by the production method according to any one of claims 3 to 5 in the field of perovskite solar cell device encapsulation.
7. 7. A perovskite solar cell device, comprising a conductive glass substrate, a perovskite solar cell layer, an ultraviolet curing encapsulation adhesive and a cover plate, wherein the perovskite solar cell layer is placed on the conductive glass substrate, the ultraviolet curing encapsulation adhesive is formed by the ultraviolet irradiation of the light curing resin component according to any one of claims 1-2 or the light curing resin component obtained by the preparation method according to any one of claims 3-5, and is formed by crosslinking and curing, and the ultraviolet curing encapsulation adhesive is directly and integrally covered on the outer surface of the perovskite solar cell layer by the edge of the conductive glass substrate, and the cover plate is covered above the perovskite solar cell layer.
8. 8. The perovskite solar cell device of claim 7, wherein: The perovskite solar cell layer comprises an electron transport layer, a perovskite active layer, a hole transport layer and an electrode layer, wherein the perovskite active layer is preferably organic-inorganic hybridized metal lead halide/tin perovskite material ABX 3 , more preferably, A is at least one organic cation selected from CH 3 NH 3 + 、HC(NH 2 ) 2+ , B is at least one metal cation selected from Sn 2+ 、Pb 2+ , X is halogen element ion, and/or, The lead wire led out from the electrode layer and the lead wire led out from the conductive glass substrate form an external circuit, and/or, The cover plate is a high-transmittance glass cover plate and/or, The thickness of the ultraviolet light curing packaging adhesive is 1-1000 mu m, preferably 10-500 mu m, and/or, The acid value of the ultraviolet curing packaging adhesive is 3-15 mgNaOH/g, preferably 6-13 mgNaOH/g.
9. 9. A method of manufacturing a perovskite solar cell device as claimed in claim 7 or 8, comprising placing a perovskite solar cell layer on a conductive glass substrate, integrally covering the photo-curable resin component from the edge of the conductive glass substrate to all outer surfaces of the perovskite solar cell layer, covering a cover plate on the upper surface of the coated photo-curable resin component, and then photo-curing.
10. 10. The method of manufacturing a perovskite solar cell device according to claim 9, wherein: The photo-curing resin comprises 92-98wt% of acrylic epoxy resin oligomer, 1-5wt% of photoinitiator, 0-4wt% of filler, preferably 92-95wt% of acrylic epoxy resin oligomer, 2-5wt% of photoinitiator, 0-3wt% of filler and/or, The photo-curing time is 5 s-3 min, preferably 5-60 s.

Description

Photocurable resin component, perovskite solar cell device, preparation method and application Technical Field The invention relates to the technical field of perovskite solar cell packaging, in particular to a photo-curing resin component and a preparation method thereof, which are used for efficient packaging of perovskite solar cell devices, and the preparation method and application thereof. Background Perovskite solar cells, as a representative of the third generation solar cells, mainly realize photoelectric conversion by using a photovoltaic material having a perovskite structure. The main challenge faced in the commercialization process is to improve stability, especially to maintain its performance in harsh environments such as moisture, oxygen, dust, corrosive chemicals, and external impact. The packaging technology commonly used at present mainly relies on hot melt adhesive films such as POE and EVA to isolate the external environment by lamination packaging with the battery cells. In CN117500296a, POE is used as an encapsulation filler, and butyl rubber is used as an edge seal to form a vacuum lamination encapsulation, which has an excellent effect of protecting a device by multi-structure encapsulation, but the process is too complicated. Perovskite solar cells contain a variety of heat-sensitive materials, and thus a film-like encapsulation method that requires a high-temperature lamination method is not ideal. The high temperature hot pressing method used in the packaging method of the perovskite solar cell disclosed in CN112510152A is up to 140-150 ℃ and the time is up to 20-30 minutes. Under this condition, bond breakage and material decomposition failure occur to generate PbI 2 and release halogen vapors. Although the ultraviolet curing glue packaging method is simplified in steps and can avoid the influence of high temperature on the active layer of the battery, the glue is easy to react with the perovskite active layer, so that the battery is invalid. Therefore, a new ultraviolet curing packaging adhesive is urgently needed. Disclosure of Invention In order to solve the problem of performance degradation caused by the reaction of the perovskite solar cell device packaging adhesive and the perovskite layer in the prior art, the invention provides a photo-curing resin component, an innovative preparation method thereof and application thereof in the field of perovskite solar cell device packaging, and in addition, the invention also provides a perovskite solar cell device and a preparation method thereof. According to the photo-curing resin component and the preparation method thereof, the obtained epoxy acrylate and the perovskite active layer do not react, so that the stability of the battery can be remarkably improved, and the efficiency of the packaged battery can be still kept at 88% after 720 hours. In addition, the resin has good light transmittance, weather resistance and mechanical properties, has wide application range and shows excellent application prospect. It is an object of the present invention to provide a photocurable resin component prepared from raw materials including an epoxy resin, acrylic acid or an acrylic acid derivative, an organic base, a polymerization inhibitor, a photoinitiator, and optionally a filler. The epoxy resin is at least one selected from bisphenol A epoxy resin, bisphenol F epoxy resin, hydrogenated bisphenol A epoxy resin and alicyclic epoxy resin. The acrylate derivative is at least one selected from methacrylic acid, acrylic acid ester, methacrylic acid ester, silicon-containing or fluorine-containing acrylic acid ester. The organic base is at least one selected from diethylamine, diisopropylamine, triethylamine, triethanolamine and benzylamine. The polymerization inhibitor is at least one selected from p-methoxyphenol, 2, 6-di-tert-butyl-p-methylphenol, p-methoxyphenyldiphenol, 2, 6-tetramethylpiperidine-1-nitroxide radical, hydroxydiphenyl methane, N-ethylhydroxylamine, thiourea and 4-hydroxy-2, 6-tetramethylpiperidine-N-oxide. The photoinitiator is at least one selected from 2-hydroxy-2-methyl-1-phenylpropion, 1-hydroxycyclohexyl benzophenone, 2,4, 6-trimethylbenzoyl diphenyl phosphine oxide, 2-dimethoxyphenyl acetophenone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, phenyl bis (2, 4, 6-trimethylbenzoyl) phosphine oxide, 2-hydroxy-2-methyl-1- [4- (2-hydroxyethoxy) phenyl ] -1-propanone, benzoin diethyl ether, bis (2, 4, 6-trimethylbenzoyl) phosphine oxide, benzophenone, dimethylthiobenzimidazole, oxazolidinone and 4,4' -diaminobenzophenone. Further, a filler may be further added to the photocurable resin component, and the filler is at least one selected from the group consisting of an anti-UV agent, a light conversion material, an antioxidant, a tackifier, a toughening agent, a flame retardant, and a nanomaterial. The filler includes, but is not limited to, at least one of benzophenone-based anti-UV agent, benzotriazole-based anti-UV agent, pho