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CN-121991385-A - Manufacturing method of cutting adhesive tape base material

CN121991385ACN 121991385 ACN121991385 ACN 121991385ACN-121991385-A

Abstract

The invention discloses a manufacturing method of a cutting adhesive tape base material, which comprises the following steps of (1) raw material preparation, namely mixing metallocene linear low-density polyethylene, polymethyl methacrylate, ethylene propylene rubber grafted maleic anhydride and an antioxidant according to mass percent to obtain a mixed material, (2) pretreatment, namely dust removal treatment of the mixed material in a dust-free environment, (3) melt extrusion, namely putting the pretreated mixed material into a single screw extruder for melt plasticization, wherein the length-diameter ratio of the extruder screw is larger than a standard value, the temperature of 1-3 areas is respectively set to 195 ℃, 210 ℃ and 220 ℃, the temperature of the other areas and a die head is set to 240 ℃, and (4) tape casting molding, namely extruding the melt plasticized material through a clothes rack type co-extrusion die head, and casting the extruded material onto a cooling roller for cooling shaping, and (5) post-treatment, namely embossing and corona treatment and rolling the shaped film in sequence to obtain the cutting adhesive tape base material.

Inventors

  • WANG JIAJIN
  • WANG JIE
  • YU JIAAN

Assignees

  • 艾米新材(东莞)有限公司

Dates

Publication Date
20260508
Application Date
20260204

Claims (10)

  1. 1. A method for manufacturing a dicing tape base material, comprising the steps of: (1) The preparation of raw materials, namely mixing metallocene linear low-density polyethylene, polymethyl methacrylate, ethylene propylene rubber grafted maleic anhydride and an antioxidant according to mass percent to obtain a mixed material; (2) Pre-treating, namely carrying out dust removal treatment on the mixed material in a dust-free environment; (3) Melting and extruding, namely putting the pretreated mixed material into a single screw extruder for melting and plasticizing, wherein the length-diameter ratio of the extruder screw is larger than a standard value, the temperatures of 1-3 areas are respectively set to 195 ℃, 210 ℃ and 220 ℃, and the temperatures of the other areas and a die head are set to 240 ℃; (4) Casting, namely extruding the melted and plasticized material through a clothes rack type co-extrusion die head, and casting the extruded material onto a cooling roller for cooling and shaping; (5) And (3) post-treatment, namely embossing and corona treatment are sequentially carried out on the shaped film, and the film is rolled to obtain the cutting adhesive tape base material.
  2. 2. The method for producing a base material for dicing tape according to claim 1, wherein the mass percentage of the mixture in the step (1) is 60 to 90% of metallocene linear low density polyethylene, 10 to 40% of polymethyl methacrylate, 5 to 8% of ethylene propylene rubber grafted maleic anhydride, and 1 to 3% of antioxidant.
  3. 3. The method for producing a dicing tape substrate according to claim 2, wherein the mass percentage of the metallocene linear low density polyethylene is 65%.
  4. 4. The method for producing a dicing tape base material according to claim 2, wherein the polymethyl methacrylate is 25% by mass.
  5. 5. The method of claim 1, wherein the dust-free environment in step (2) is a ten-thousand-stage dust-free room, and the dust-removing treatment comprises dust removal by sucking the mixture into a cyclone above an extruder hopper by vacuum.
  6. 6. The method for producing a dicing tape substrate according to claim 1, wherein the single screw extruder in step (3) is an extruder having a large aspect ratio.
  7. 7. The method of claim 1, wherein the step (4) is performed by extruding through a double-layer co-extrusion die to form a composite substrate structure of the outer layer and the inner layer.
  8. 8. The method of producing a dicing tape substrate according to claim 7, wherein the thickness ratio of the outer layer to the inner layer is 50 to 60 μm and 20 to 30 μm.
  9. 9. The method according to claim 7, wherein the raw material composition of the outer layer and the inner layer each contains metallocene linear low density polyethylene, polymethyl methacrylate, ethylene propylene rubber grafted maleic anhydride, and an antioxidant.
  10. 10. The method for producing a dicing tape base material according to claim 9, wherein the inner layer raw material further contains Low Density Polyethylene (LDPE), and the mass percentage of the low density polyethylene in the inner layer raw material is 60 to 95%.

Description

Manufacturing method of cutting adhesive tape base material Technical Field The invention relates to the technical field of semiconductor packaging materials, in particular to a manufacturing method of a dicing tape base material. Background The dicing film is a key auxiliary material in the semiconductor packaging process, and the performance of the substrate directly affects the dicing quality of the wafer and the pick-up efficiency of the subsequent die. Currently, the wafer dicing tape base materials on the market are mainly divided into two main types, namely, polyvinyl chloride (PVC) is used as a raw material and is prepared through a calendaring process, and polyolefin (such as polyethylene and polypropylene) is used as a raw material and is prepared through a tape casting process. The PVC substrate occupies a main market share due to good comprehensive performance, but releases harmful substances in the production and waste treatment processes, so that the PVC substrate has serious environmental pollution problem and does not accord with the development trend of green manufacturing. Accordingly, the industry is striving to develop environmentally friendly polyolefin substrates as alternatives. However, the prior polyolefin substrate still faces a plurality of technical bottlenecks in practical application, namely, firstly, PVC substrates produced in China are easy to separate out small molecules due to various auxiliary agents added in the formula, so that residual glue is generated in the wafer dicing process, and wafers are polluted. Secondly, the single polyolefin substrate prepared by the traditional tape casting method has the problems of poor film expansion performance (film expansion is difficult or collapse is easy to occur due to stress relaxation after film expansion), appearance defects caused by crystal points or poor plasticization on the surface of the substrate, and the like. These appearance defects can form bubbles or pits when the adhesive is subsequently coated, which causes poor bonding between the adhesive layer and the substrate, and finally leads to degluing, adhesive residue or grain flying (chipping) when picking up grains, and seriously affects the production yield and efficiency. In addition, the adhesion between the surface energy of the single polyolefin material and the adhesive layer is generally weak, and the risk of adhesive residue is also increased. Currently, high performance dicing tape substrates are almost entirely imported, Therefore, the development of a method for manufacturing the domestic cutting adhesive tape base material, which has high performance, low pollution and stable production, has important significance. Disclosure of Invention The present invention is directed to a method for manufacturing a dicing tape substrate, which overcomes the above-mentioned drawbacks of the prior art. The method aims to solve the problems of poor coating, weak adhesion between the substrate and a glue layer, easy adhesive residue and the like caused by easy collapse and a plurality of appearance crystal points after film expansion of the existing polyolefin substrate through specific raw material formula design, optimized production process and strict clean control, thereby manufacturing the high-performance cutting adhesive tape substrate with excellent tensile property, low stress relaxation, high surface cleanliness and no adhesive residue risk. In order to achieve the above purpose, the invention is realized by the following technical scheme: The invention provides a manufacturing method of a cutting adhesive tape base material, which comprises the following steps: (1) The preparation of raw materials, namely mixing metallocene linear low-density polyethylene, polymethyl methacrylate, ethylene propylene rubber grafted maleic anhydride and an antioxidant according to mass percent to obtain a mixed material; (2) Pre-treating, namely carrying out dust removal treatment on the mixed material in a dust-free environment; (3) Melting and extruding, namely putting the pretreated mixed material into a single screw extruder for melting and plasticizing, wherein the length-diameter ratio of the extruder screw is larger than a standard value, the temperatures of 1-3 areas are respectively set to 195 ℃, 210 ℃ and 220 ℃, and the temperatures of the other areas and a die head are set to 240 ℃; (4) Casting, namely extruding the melted and plasticized material through a clothes rack type co-extrusion die head, and casting the extruded material onto a cooling roller for cooling and shaping; (5) And (3) post-treatment, namely embossing and corona treatment are sequentially carried out on the shaped film, and the film is rolled to obtain the cutting adhesive tape base material. Further, the mass percentage of the mixture in the step (1) is 60-90% of metallocene linear low density polyethylene, 10-40% of polymethyl methacrylate, 5-8% of ethylene propylene rubber grafted maleic anhydri