CN-121991461-A - Resin composition and use thereof

Abstract

The present invention provides a resin composition comprising (A) an epoxy resin, (B) a dicyclopentadiene phenol resin, and (C) a first filler. The first filler has boehmite having a D50 particle size of 1 to 4 micrometers.

Inventors

• LIN ZONGXIAN

Assignees

• 台燿科技股份有限公司

Dates

Publication Date

20260508

Application Date

20241114

Priority Date

20241101

Claims (10)

1. 1. A resin composition comprising a resin and a solvent, characterized by comprising: (A) An epoxy resin; (B) Dicyclopentadiene phenol resin, and (C) A first filler having a D50 particle size boehmite of 1 to 4 micrometers.
2. 2. The resin composition of claim 1, wherein the epoxy resin (A) is selected from the group consisting of bisphenol-type epoxy resins, phenolic-type epoxy resins, trifunctional-type epoxy resins, stilbene-type epoxy resins, triazine-skeleton-containing epoxy resins, fluorene-skeleton-containing epoxy resins, triphenol-methane-type epoxy resins, stubble-extending-type epoxy resins, biphenyl-aralkyl-type epoxy resins, naphthalene-type epoxy resins, alicyclic-type epoxy resins, and combinations thereof.
3. 3. The resin composition according to claim 1, wherein the dicyclopentadiene phenol resin (B) has a structure represented by the following formula (I): Wherein, the N is an integer from 2 to 50; Ph is a hydroxyl-containing group derived from an aromatic phenol compound, and each Ph may be the same or different, and D has a structure represented by the following formula (II), and each D may be the same or different:
4. 4. The resin composition according to claim 1, wherein the dicyclopentadiene phenol resin is contained in an amount of 3 to 15% by weight based on the total weight of the resin composition excluding a solvent.
5. 5. The resin composition of claim 1, wherein the first filler is present in an amount of 10 to 31 weight percent based on the total weight of the resin composition excluding solvents.
6. 6. The resin composition of claim 1, further comprising a hardener selected from the group consisting of cyanate esters, benzoxazines, non-dicyclopentadiene type phenol resins, styrene maleic anhydride, dicyandiamide, diamino diphenyl sulfone, diamino diphenyl methane, and combinations thereof.
7. 7. The resin composition of claim 1, further comprising a second filler selected from the group consisting of silica, alumina, magnesia, magnesium hydroxide, calcium carbonate, talc, clay, aluminum nitride, boron nitride, aluminum hydroxide, aluminum silicon carbide, sodium carbonate, titanium dioxide, zinc oxide, zirconia, quartz, diamond-like, graphite, calcined kaolin, mica, hydrotalcite, polytetrafluoroethylene, glass beads, ceramic whiskers, carbon nanotubes, nanoscale inorganic powders, and combinations thereof.
8. 8. A prepreg obtained by impregnating or coating a substrate with the resin composition according to any one of claims 1 to 7 and drying the impregnated or coated substrate.
9. 9. A metal foil laminate, characterized in that it is produced by laminating the prepreg according to claim 8 with a metal foil, or by applying the resin composition according to any one of claims 1 to 7 to a metal foil and drying the coated metal foil.
10. 10. A printed circuit board, characterized in that it is produced from the metal foil laminate according to claim 9.

Description

Resin composition and use thereof Technical Field The present invention relates to a resin composition, and more particularly, to a composition comprising an epoxy resin, a dicyclopentadiene type phenol resin, and a specific filler. The resin composition of the invention can be used for forming a prepreg (prepreg) with a reinforcing material or can be used as an adhesive of metal foil to prepare a metal foil laminated plate (metal-CLAD LAMINATE) and a printed circuit board (printed circuit board, PCB). Background The printed circuit board is a circuit substrate of an electronic device, which carries other electronic components and electrically communicates the components to provide a stable circuit operating environment, so as to be widely applied to various electronic products. A common printed circuit board substrate is a Copper Clad Laminate (CCL) which is mainly composed of resin, reinforcement and copper foil. Common resins such as epoxy resin, phenolic resin, polyamine formaldehyde, silicone, teflon, etc., and common reinforcing materials such as glass fiber cloth, glass fiber mat, insulating paper, linen, etc. In general, a printed circuit board may be manufactured as follows. A reinforcing material such as a glass fabric is impregnated into a resin composition (e.g., an epoxy resin composition), and the glass fabric impregnated with the resin composition is cured to a semi-cured state (i.e., B-stage) to obtain a prepreg. Then, prepregs of a predetermined number of layers are laminated, and a metal foil is laminated on at least one outer side of the laminated prepregs to provide a laminate, and then the laminate is subjected to a hot pressing operation (i.e., C-stage) to obtain a metal foil laminated plate. The metal foil of the metal foil laminate surface is etched to form a specific circuit pattern (circuit pattern). Then, a plurality of holes are drilled on the metal foil laminated plate, and conductive materials are plated in the holes to form through holes (via holes), thereby completing the preparation of the printed circuit board. In recent years, as the multi-functions and high performance of home electronics products are developed, the wiring of printed circuit boards used is being developed toward higher density. In addition, because the voltage used by these electronic products is relatively high, the requirements on insulation reliability between the lines are more stringent. Particularly, when the electronic products are used in severe environments such as high temperature, humidity, pollution and the like, dust, moisture, pollutants and the like are easy to accumulate on the surface of the insulating substrate of the circuit board, so that dissociable dirty liquid is easy to form, the insulating substrate is easy to form a conductive or partially conductive channel due to partial discharge under the action of an external electric field, the surface of the material is further degraded gradually, and the situation that the tail end circuit or the electrical performance is rapidly reduced occurs. The "tracking phenomenon" refers to the process of gradually forming a conductive channel under the action of dissociable sewage and an external electric field, wherein, as flashover discharge repeatedly occurs between lines to generate electric sparks, traces of carbonized conductive circuits are easily formed, and the insulating property of the surface of the substrate is further damaged. The "tracking index" is used to measure the ability of an insulating material to resist tracking, with higher indices representing materials that are less prone to tracking. In order to raise the tracking index of the material, CN 101654004 and CN 102585440 teach the use of low bromine content epoxy resins (10 wt% to 15 wt% bromine content) or halogen free epoxy resins with the addition of large amounts of aluminum hydroxide inorganic filler. However, the use of aluminum hydroxide in a large amount causes a problem of deterioration in heat resistance because the thermal decomposition temperature of aluminum hydroxide is low, dehydration starts at 200 ℃, so that the produced substrate is liable to occur delamination and foaming at high temperature, thereby affecting the thermal reliability of the product. For the safety and reliability of electronic products, particularly printed circuit boards, in wet, easily contaminated environmental conditions, it is highly desirable to develop an insulating substrate with a high relative tracking index (Comparative Tracking Index, CTI). Disclosure of Invention In view of the foregoing, the present invention is directed to a resin composition comprising an epoxy resin, a dicyclopentadiene type phenol resin, and a specific filler. The electronic material obtained after the resin composition is cured has good glass transition temperature (Tg), coefficient of Thermal Expansion (CTE), heat resistance (expressed by T288, soldering resistance and heat resistance after moisture abs