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CN-121991462-A - Resin composition

CN121991462ACN 121991462 ACN121991462 ACN 121991462ACN-121991462-A

Abstract

The invention provides a resin composition which can bring a cured product with a small linear thermal expansion coefficient and can inhibit peeling (delamination) caused by the breakage of the cured product, a method for producing the resin composition, a resin sheet containing the resin composition, a circuit board containing the cured product of the resin composition, and a semiconductor device containing the circuit board. The solution of the present invention is a resin composition comprising (A) an epoxy resin, (B) an active ester resin containing a radical polymerizable group, and (C) a resin containing an imide bond, wherein the component (A) comprises a liquid epoxy resin having a viscosity of 100 mPas or more at 25 ℃, the component (C) comprises at least any one of a (C-1) maleimide resin and a (C-2) polyimide resin, and the total amount of the component (C-1) and the component (C-2) is 6 mass% or more and 20 mass% or less relative to 100 mass% of the resin component in the resin composition.

Inventors

  • NAGATA KAZUYA

Assignees

  • 味之素株式会社

Dates

Publication Date
20260508
Application Date
20251106
Priority Date
20241108

Claims (20)

  1. 1. A resin composition comprising (A) an epoxy resin, (B) an active ester resin containing a radical polymerizable group, and (C) a resin containing an imide bond, wherein, (A) The component (A-1) comprises a liquid epoxy resin having a viscosity of 100 mPas or more at 25 ℃, (C) The component (C-1) comprises at least any one of maleimide resin and polyimide resin (C-2), The total amount of the (C-1) component and the (C-2) component is 6% by mass or more and 20% by mass or less relative to 100% by mass of the resin component in the resin composition.
  2. 2. The resin composition according to claim 1, wherein component (a) further comprises (a-3) an epoxy resin which is solid at 25 ℃.
  3. 3. The resin composition according to claim 2, wherein the content of the (A-3) component is 10% by mass or more and 50% by mass or less relative to 100% by mass of the resin component in the resin composition.
  4. 4. The resin composition according to claim 2, wherein the content of the (A-3) component is 25% by mass or more relative to 100% by mass of the resin component in the resin composition.
  5. 5. The resin composition according to claim 2, wherein the mass ratio M A3 /M A1 is 1.5 to 10 inclusive, when the content of the (A-1) component relative to 100 mass% of the resin component in the resin composition is M A1 [ mass% ], and the content of the (A-3) component relative to 100 mass% of the resin component in the resin composition is M A3 [ mass% ].
  6. 6. The resin composition according to claim 1, wherein the component (A-1) comprises a liquid epoxy resin having an epoxy equivalent of 150g/eq. Or more.
  7. 7. The resin composition according to claim 1, wherein the content of the (A-1) component is 3% by mass or more and 25% by mass or less relative to 100% by mass of the resin component in the resin composition.
  8. 8. The resin composition according to claim 1, wherein the content of the component (A-1) is 15% by mass or less based on 100% by mass of the resin component in the resin composition.
  9. 9. The resin composition according to claim 1, wherein the content of the component (B) is 5% by mass or more and 40% by mass or less relative to 100% by mass of the resin component in the resin composition.
  10. 10. The resin composition according to claim 1, wherein the component (B) contains a monovalent group represented by the following formula (B'), In the formula (B '), a compound represented by the formula (B'), Ar B1 represents a divalent aromatic group optionally having a substituent; Ar B2 represents a monovalent aromatic group optionally having a substituent; * Indicating the bonding site.
  11. 11. The resin composition according to claim 1, wherein the component (B) comprises at least one of an active ester compound represented by the following formula (B-i) and an active ester compound represented by the following formula (B-ii), In the formula (B-i) and the formula (B-ii), Ar 11 each independently represents a monovalent aromatic group optionally having a substituent; ar 12 each independently represents a divalent aromatic group optionally having a substituent; R 11 each independently represents an optionally substituted divalent aromatic group, an optionally substituted divalent aliphatic group, an oxygen atom, a sulfur atom, or a divalent group formed by a combination thereof; at least one of Ar 11 、Ar 12 and R 11 has a substituent containing a radical polymerizable group; m1, n1, m2 and n2 each independently represent an integer of 0 or more.
  12. 12. The resin composition according to claim 1, wherein the component (B) comprises an active ester compound having a structure represented by the following formula (B-iv-a), In the formula (B-iv-a), Ring Ar 40 represents an aromatic ring optionally having a substituent; r 40 represents a monovalent group selected from a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, and an alkenyl group having 1 to 8 carbon atoms; l represents a single bond or a divalent non-aromatic group containing no tetrahydrodicyclopentadiene ring.
  13. 13. The resin composition according to claim 1, wherein, The epoxy equivalent of the component (A-1) is 150g/eq. Or more and 5000g/eq. Or less, (B) The active ester group equivalent of the component (A) is 120g/eq. Or more and 1000g/eq. Or less.
  14. 14. The resin composition according to claim 1, wherein the component (C) comprises a component (C-1), The content of the component (C-1) exceeds 30% by mass based on 100% by mass of the total of the components (A-1) and (B).
  15. 15. The resin composition according to claim 1, wherein the component (C) comprises a component (C-1), The epoxy equivalent of the component (A-1) is 150g/eq. Or more and 5000g/eq. Or less, (B) The active ester group equivalent of the component is 120g/eq to 1000g/eq, The maleimide group equivalent of the component (C-1) is 50g/eq. Or more and 2000g/eq. Or less.
  16. 16. The resin composition according to claim 1, wherein the resin composition further comprises (D) other thermosetting resin.
  17. 17. The resin composition according to claim 16, wherein (D) the other thermosetting resin comprises an active ester resin containing no radical polymerizable group, The active ester resin containing no free radical polymerizable group comprises an active ester compound represented by the following formula (D-2), In the formula (D-2), Ar 61 each independently represents a monovalent aromatic group optionally having a substituent; Ar 62 each independently represents a divalent aromatic group optionally having a substituent; r 61 each independently represents a divalent hydrocarbon group optionally having a substituent; Neither Ar 61 、Ar 62 nor R 61 contains a free radical polymerizable group; n 61 represents an integer of 0 or more.
  18. 18. The resin composition according to claim 1, wherein the resin composition further comprises (E) an inorganic filler material.
  19. 19. The resin composition according to claim 18, wherein the total amount of the (C-1) component and the (C-2) component is 2% by mass or more and 7% by mass or less relative to 100% by mass of the nonvolatile component in the resin composition.
  20. 20. The resin composition according to claim 18, wherein the content of the component (E) is 65% by mass or more based on 100% by mass of the nonvolatile component in the resin composition.

Description

Resin composition Technical Field The present invention relates to a resin composition. Further, the present invention relates to a resin sheet, a circuit board, and a semiconductor device. Background Circuit boards such as printed wiring boards are widely used in various electronic devices. As a method for manufacturing a circuit board, a method based on a build-up (build-up) method in which insulating layers and conductor layers are alternately stacked on an inner layer substrate is known. The insulating layer is formed, for example, by using a cured product of a resin composition (patent documents 1 and 2). Specifically, an insulating layer containing a cured product of a resin composition can be formed by forming a resin composition layer containing a resin composition and curing the resin composition layer. Prior art literature Patent literature Patent document 1 Japanese patent No. 6992333 Patent document 2 Japanese patent application laid-open No. 2021-161323. Disclosure of Invention Technical problem to be solved by the invention In recent years, miniaturization and higher density of wiring have been demanded in circuit boards due to the demand for miniaturization of electronic devices and electronic components. With miniaturization and higher density of wiring, it is important to reduce warpage of an insulating layer, and from the viewpoint of reducing warpage of an insulating layer, a cured product of a resin composition is required to have a small coefficient of linear thermal expansion (CTE). In addition, in forming the insulating layer, a resin composition containing an epoxy resin and an active ester resin is sometimes used. When the resin composition is used to form an insulating layer, curing stress sometimes remains when the resin composition is cured. If the stress remains, the cured product is likely to be damaged, and thus peeling (delamination ) of the insulating layer may occur with the damage of the cured product. The present invention has been made in view of the above circumstances, and an object thereof is to provide a resin composition which can provide a cured product having a small linear thermal expansion coefficient and can suppress peeling (delamination) due to breakage of the cured product, a method for producing the resin composition, a resin sheet containing the resin composition, a circuit board containing the cured product of the resin composition, and a semiconductor device containing the circuit board. Means for solving the technical problems The present inventors have conducted intensive studies to solve the above-described problems. As a result, the present inventors have found that the above-mentioned problems can be solved by a resin composition comprising (a) an epoxy resin, (B) a radical polymerizable group-containing active ester resin and (C) an imide bond-containing resin, wherein the component (a) comprises a liquid epoxy resin having a viscosity of 100mpa·s or more at 25 ℃, and the component (C) comprises at least one of a (C-1) maleimide resin and a (C-2) polyimide resin, and the total amount of the component (C-1) and the component (C-2) is 6 mass% or more and 20 mass% or less relative to 100 mass% of the resin component in the resin composition, thereby completing the present invention. Namely, the present invention includes the following. <1> A resin composition comprising (A) an epoxy resin, (B) an active ester resin containing a radical polymerizable group, and (C) a resin containing an imide bond, wherein, (A) The component (A-1) comprises a liquid epoxy resin having a viscosity of 100 mPas or more at 25 ℃, (C) The component (C-1) comprises at least any one of maleimide resin and polyimide resin (C-2), The total amount of the (C-1) component and the (C-2) component is 6 mass% or more and 20 mass% or less relative to 100 mass% of the resin component in the resin composition; <2> the resin composition according to <1>, wherein the (A) component further comprises (A-3) an epoxy resin which is solid at 25 ℃; <3> the resin composition according to <2>, wherein the content of the (A-3) component is 10 mass% or more and 50 mass% or less with respect to 100 mass% of the resin component in the resin composition; <4> the resin composition according to <2> or <3>, wherein the content of the (A-3) component is 25% by mass or more with respect to 100% by mass of the resin component in the resin composition; <5> the resin composition according to any one of <2> to <4>, wherein when the content of the (A-1) component relative to 100% by mass of the resin component in the resin composition is M A1 [ mass% ], and the content of the (A-3) component relative to 100% by mass of the resin component in the resin composition is M A3 [ mass% ], the mass ratio M A3/MA1 is 1.5 or more and 10 or less; <6> the resin composition according to any one of <1> to <5>, wherein the component (A-1) comprises a liquid epoxy resin having an epoxy equivalent of 150g/eq. Or more; The resin