CN-121991463-A - Epoxy resin composition, epoxy resin adhesive film and application thereof

Abstract

The invention belongs to the technical field of adhesives, and relates to an epoxy resin composition, an epoxy resin adhesive film and application thereof, wherein the epoxy resin composition comprises epoxy resin, a curing agent, a toughening agent, a filler and rosin modified phenolic resin, the curing agent at least comprises a latent curing agent, the toughening agent at least comprises acrylate rubber, the softening point of the rosin modified phenolic resin is 120-180 ℃, the acid value is 40-100 mgKOH/g, and the types of the curing agent and the toughening agent are limited by introducing the rosin modified phenolic resin with the specific softening point and the acid value, so that the epoxy resin adhesive film prepared from the epoxy resin composition has the characteristics of low damping loss factor, high stability of damping loss factor, high elastic modulus, high toughness, high peel strength, good normal-temperature storage stability and high-temperature quick reactivity.

Inventors

• HE JILIANG
• DENG JIANBO
• WU MIAN
• WU YOUPING

Assignees

• 苏州赛伍应用技术股份有限公司

Dates

Publication Date

20260508

Application Date

20251231

Claims (10)

1. 1. The epoxy resin composition is characterized by comprising the following components in parts by weight: (A) 100 parts by weight of an epoxy resin; (B) 30-200 parts of a curing agent; (C) 30-100 parts by weight of a toughening agent; (D) 1-100 parts of filler; (E) 10-100 parts by weight of rosin modified phenolic resin; Wherein the curing agent comprises at least a latent curing agent; The toughening agent at least comprises acrylate rubber; the softening point of the rosin modified phenolic resin is 120-180 ℃, and the acid value is 40-100 mgKOH/g.
2. 2. The epoxy resin composition according to claim 1, wherein the epoxy resin is any one or a combination of at least two of bisphenol a epoxy resin, bisphenol F epoxy resin, biphenyl epoxy resin, or naphthalene ring epoxy resin in a solid state at normal temperature; Preferably, the epoxy resin comprises 1 to 10 parts by weight of glycidylamine type epoxy resin; preferably, the glycidylamine-type epoxy resin comprises 4,4 '-diaminodiphenylmethane tetraglycidyl amine and/or 4,4' -diaminodicyclohexylmethane tetraglycidyl amine.
3. 3. The epoxy resin composition according to claim 1 or 2, wherein the curing agent is added in an amount of 50 to 150 parts by weight; Preferably, the latent curing agent comprises an imidazole-based latent curing agent and/or a microcapsule-type latent curing agent; preferably, the curing agent comprises at least a encapsulated latent curing agent; Preferably, the curing agent further comprises a liquid phenolic resin.
4. 4. An epoxy resin composition according to any one of claims 1 to 3, wherein the toughening agent is added in an amount of 50 to 80 parts by weight; Preferably, the weight average molecular weight of the acrylate rubber is 20-100 ten thousand; Preferably, the toughening agent further comprises a phenoxy resin and/or a nitrile rubber.
5. 5. The epoxy resin composition according to any one of claims 1 to 4, wherein the filler is added in an amount of 2 to 30 parts by weight; preferably, the filler comprises any one or a combination of at least two of angular silica, spherical silica, fumed silica, alumina, aluminum hydroxide, aluminum nitride, boron nitride, titanium dioxide, strontium titanate, barium sulfate, talc, calcium silicate, calcium carbonate, mica, polytetrafluoroethylene, or graphene, more preferably any one or a combination of at least two of angular silica, spherical silica, or fumed silica, and still more preferably fumed silica.
6. 6. The epoxy resin composition according to any one of claims 1 to 5, wherein the rosin-modified phenolic resin is added in an amount of 20 to 50 parts by weight; preferably, the rosin modified phenolic resin has a structure as shown in the following formula I: A formula I; wherein n is 0 or a positive integer.
7. 7. The epoxy resin composition according to any one of claims 1 to 6, further comprising any one or a combination of at least two of a flame retardant, an adhesion promoter, and a pigment.
8. 8. An epoxy resin adhesive film, which is obtained by mixing the epoxy resin composition according to any one of claims 1 to 7 with a solvent to prepare a resin solution, coating the obtained resin solution on a release layer, and drying.
9. 9. The epoxy adhesive film of claim 8, wherein the solvent comprises any one or a combination of at least two of toluene, butanone, acetone, ethyl acetate, or propylene glycol methyl ether.
10. 10. Use of the epoxy resin film of claim 8 or 9 in flexible circuit boards.

Description

Epoxy resin composition, epoxy resin adhesive film and application thereof Technical Field The invention belongs to the technical field of adhesives, and relates to an epoxy resin composition, an epoxy resin adhesive film and application thereof. Background The pure adhesive film for the flexible circuit board (FPC) is mainly applied to the adhesion between a PI reinforcing plate, an FR4 reinforcing plate, a steel sheet reinforcing plate and a multi-layer plate, and the adhesion between the FPC and other electronic components or parts. In recent years, the development of the electronic industry is rapid, the use amount of FPC board is greatly increased, and the application range is greatly widened, so that the use of pure adhesive films applied to FPC is also rapidly increased. As electronic products are developed in the direction of lighter, thinner and finer, and tend to be applied in some scenes where the environment is worse or extreme, there is a higher requirement on the performance of the pure adhesive film for FPC. The pure adhesive film used in the FPC field mainly comprises an epoxy system pure adhesive film and an acrylic acid system pure adhesive film. At present, carboxyl-terminated nitrile rubber is generally required to be toughened on an epoxy resin film on the market, so that the peeling strength can be effectively improved, but due to the addition of the nitrile rubber, the epoxy resin can be slowly pre-cured at room temperature under the condition that a curing agent and an accelerator are not added, so that the storability of the epoxy resin film is seriously influenced, and the fluidity and the adhesiveness of the adhesive film are greatly reduced. The existing acrylic acid system pure adhesive film has longer storage time and basically does not react at room temperature, but has poor heat resistance, especially poor damp-heat resistance, and cannot meet the requirements of a multilayer board. In the prior art, the adhesive film prepared from the epoxy resin composition disclosed in the CN119799235A, CN120098581A, CN119799236A series invention has good normal-temperature storage stability, good high-temperature reactivity and quick response, and the adhesive film has low damping loss factor in the range of 0-100 ℃, good stability of the damping loss factor, high elastic modulus and high toughness and bonding strength. The adhesive film has the advantages that the adhesive films are compounded with other components while acrylate rubber is introduced into an epoxy resin system, so that the damping loss factor of the adhesive film in the range of 0-100 ℃ is greatly reduced and the stability of the damping loss factor is improved on the premise that the adhesive film has excellent toughness and peeling strength, and meanwhile, the adhesive film has higher elastic modulus, excellent normal-temperature storage stability and high-temperature quick reactivity; however, the introduced polyarylester or styrene-maleic anhydride copolymer contains a large amount of rigid low-grade benzene rings in the molecular structure, and the obtained adhesive film has poor wettability to a back paste after quick pressing when in use, so that the adhesive property after quick pressing is influenced, and the manufacturability after quick pressing and the humidity and heat aging resistance of the adhesive film are influenced. CN119799236A introduces at least two toughening agents with different glass transition temperatures into an epoxy resin system formula, greatly reduces the damping loss factor of the adhesive film within the range of 0-100 ℃ and improves the stability of the damping loss factor on the premise of ensuring the adhesive film to have excellent toughness and peeling strength, and simultaneously ensures that the adhesive film has higher elastic modulus, excellent normal-temperature storage stability and high-temperature quick response, but the excessive addition of rubber can cause the reduction of the modulus of the adhesive film, and also causes poor wettability of the adhesive film to a back paste after quick pressing, influences the adhesive property after quick pressing and influences the wet heat aging resistance of the adhesive film. Therefore, in order to solve the technical problems, the development of an epoxy resin composition which has the advantages of low damping loss factor, high toughness, good normal-temperature storage stability, good high-temperature quick reactivity, good bonding performance and good damp-heat resistance after quick pressing is still a problem to be solved in the field. Disclosure of Invention Aiming at the defects existing in the prior art, the invention aims to provide an epoxy resin composition, an epoxy resin adhesive film and application thereof, wherein the epoxy resin composition, the epoxy resin adhesive film and application thereof are prepared by introducing rosin modified phenolic resin with a specific structure, limiting types of a curing agent and