Search

CN-121991467-A - Low-allergy hand paste epoxy resin composition and preparation method and application thereof

CN121991467ACN 121991467 ACN121991467 ACN 121991467ACN-121991467-A

Abstract

The invention relates to a low-allergy hand lay-up epoxy resin composition, and a preparation method and application thereof. The low-allergy-free hand lay-up epoxy resin composition comprises a resin component and a curing agent component, wherein the low-allergy-free hand lay-up epoxy resin composition does not contain a diluent, the resin component comprises bisphenol A type epoxy resin and bisphenol F type epoxy resin, and the preparation raw materials of the curing agent component comprise isophorone diamine, polyether amine and epoxy resin. The low-allergy hand lay-up epoxy resin composition provided by the invention has the advantages of low allergy and high temperature resistance while ensuring good mechanical properties, and can effectively solve the allergy phenomenon of the existing epoxy resin composition in the hand lay-up molding process technology, and has strong practicability.

Inventors

  • TAN SHUIPING

Assignees

  • 惠柏新材料科技（上海）股份有限公司

Dates

Publication Date
20260508
Application Date
20260317

Claims (10)

  1. 1. A low-allergic hand lay-up epoxy resin composition, characterized in that the low-allergic hand lay-up epoxy resin composition comprises a resin component and a curing agent component, and the low-allergic hand lay-up epoxy resin composition does not contain a diluent; the resin component comprises bisphenol A type epoxy resin and bisphenol F type epoxy resin; the preparation raw materials of the curing agent component comprise isophorone diamine, polyether amine and epoxy resin.
  2. 2. The low-allergic hand-lay-up epoxy resin composition according to claim 1, wherein the mass ratio of the resin component and the hardener component is 100 (25-29).
  3. 3. The low-allergic hand-lay-up epoxy resin composition according to claim 1 or 2, wherein the mass ratio of bisphenol a type epoxy resin to bisphenol F type epoxy resin in the resin component is 1 (1-2.5).
  4. 4. A low allergy free hand lay-up epoxy resin composition according to any one of claims 1 to 3, wherein the bisphenol a epoxy resin has a purity of 90% or more; Preferably, the bisphenol A type epoxy resin has an epoxy value of 0.571 to 0.588 mol/100g; preferably, the viscosity of the bisphenol A type epoxy resin is 4000-6000 mPa s; Preferably, the total chlorine mass content in the bisphenol A type epoxy resin is less than or equal to 1000 ppm.
  5. 5. The low-allergic hand-lay-up epoxy resin composition according to any one of claims 1 to 4, wherein the purity of the bisphenol F-type epoxy resin is not less than 90%; Preferably, the bisphenol F type epoxy resin has an epoxy value of 0.617-0.658 mol/100g; Preferably, the viscosity of the bisphenol F type epoxy resin is 1000-1500 mPa s; preferably, the total chlorine mass content in the bisphenol F type epoxy resin is less than or equal to 1200 ppm.
  6. 6. The hypoallergenic hand lay-up epoxy resin composition of any one of claims 1-5, wherein the hardener component comprises the following components in parts by weight: 45-65 parts of isophorone diamine; 15-40 parts of polyether amine; 10-20 parts of epoxy resin.
  7. 7. The low-allergic hand-lay-up epoxy resin composition according to claim 6, wherein the mass ratio of isophorone diamine and polyether amine in the preparation raw material of the curing agent component is (1.4-2.4): 1.
  8. 8. The hypoallergenic hand lay-up epoxy resin composition of any one of claims 1-7, wherein the epoxy resin is bisphenol a type epoxy resin; Preferably, the epoxy resin has an epoxy value of 0.54-0.57 mol/100g; preferably, the epoxy resin has a viscosity of 8000-11000 mPa s; preferably, the total chlorine mass content in the epoxy resin is less than or equal to 2000 ppm.
  9. 9. A method of preparing a low allergy free hand lay-up epoxy resin composition according to any one of claims 1 to 8, comprising the steps of: Preparing a resin component, namely mixing bisphenol A epoxy resin and bisphenol F epoxy resin to obtain the resin component; preparing a curing agent component, namely reacting isophorone diamine, polyether amine and epoxy resin to obtain the curing agent component; preferably, the temperature of the reaction is 70-80 ℃; preferably, the reaction time is 3-4h.
  10. 10. Use of the hypoallergenic hand lay-up epoxy resin composition according to any one of claims 1-8 in wind power blades.

Description

Low-allergy hand paste epoxy resin composition and preparation method and application thereof Technical Field The invention relates to the technical field of resin compositions, in particular to a low-allergy hand lay-up epoxy resin composition, a preparation method and application thereof. Background The wind power blade is used as a core component of the wind turbine generator, and the performance of the wind power blade directly influences the generating efficiency and the running stability of the wind turbine generator. Along with the continuous rising of the global wind power installation quantity, the rapid development and the induction of the two technical requirements are that firstly, the efficiency of the manufacturing process is improved, and secondly, the maintenance response speed is optimized. Under the background, the hand lay-up forming process becomes a preferred scheme for reinforcing the inside and the outside of the blade and repairing the damage of small area due to the advantages of flexibility and timeliness. The process can be rapidly solidified in a closed environment at 40-50 ℃, can save more than 1 hour of operation time compared with a vacuum pouring process, and obviously reduces shutdown loss. However, current hand lay-up epoxy applications in wind blade repair present significant challenges, primarily manifested by allergic reactions initiated upon operator contact. The allergic phenomenon is caused by active ingredients in the epoxy resin, such as amine curing agents and Volatile Organic Compounds (VOC), which are easy to contact through skin or inhale through respiratory tract in the construction process, so that the health problems of contact dermatitis, allergic rhinitis and the like are caused. In the in-blade reinforcement and summer outdoor maintenance scenarios, the high temperatures of the working environment (40-50 ℃) can exacerbate resin volatilization, while the closed interior space of the blade further limits the diffusion of harmful substances, so that the risk of sensitization continues to build up. In addition, although the curing speed of the traditional resin is high, the pungent components are not optimized synchronously, so that maintenance personnel bear health risks while working efficiently. The problem not only affects the safety of workers, but also can indirectly reduce the maintenance efficiency due to the increase of personnel protection requirements, thereby forming double constraints of health and efficiency. Therefore, development of a low-allergic hand lay-up epoxy resin composition has become a problem to be solved at present. Disclosure of Invention In order to solve the technical problems, the invention provides a low-allergy hand lay-up epoxy resin composition, and a preparation method and application thereof. The low-allergy hand lay-up epoxy resin composition does not contain a diluent, has the advantages of low allergy and high temperature resistance while ensuring good mechanical properties, can effectively solve the allergy phenomenon of the epoxy resin composition in the hand lay-up molding process technology, and has strong practicability. To achieve the purpose, the invention adopts the following technical scheme: in a first aspect, the present invention provides a low-allergic hand lay-up epoxy resin composition, the low-allergic hand lay-up epoxy resin composition being free of diluents, the low-allergic hand lay-up epoxy resin composition comprising a resin component and a hardener component; the resin component includes bisphenol a type epoxy resin (BPA epoxy resin) and bisphenol F type epoxy resin (BPF epoxy resin); the preparation raw materials of the curing agent component comprise isophorone diamine (IPDA), polyether amine and epoxy resin. The low-allergy hand lay-up epoxy resin composition provided by the invention does not contain a diluent, and the resin component adopts the combination of BPA epoxy resin and BPF epoxy resin, so that the obtained resin component has lower viscosity, thereby effectively avoiding the allergy caused by the use of the diluent, the epoxy modified amine curing agent is prepared by taking polyether amine, isophorone diamine and epoxy resin as raw materials, and the low-molecular-weight isophorone diamine is applied to the preparation of the high-molecular-weight epoxy modified amine curing agent, so that the volatility and skin allergy of the curing agent can be effectively reduced. Through the collocation of the resin component without the diluent and the curing agent component with isophorone diamine, the molecular structure design of the epoxy resin composition after the curing reaction is realized, so that the epoxy resin composition has lower anaphylaxis and high temperature resistance and strong practicability while ensuring good mechanical properties. The hypoallergy in the invention refers to light irritation or lower after curing the paste epoxy resin composition according to GB/T21604-