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CN-121991508-A - High-heat-conductivity PEEK/PEI super-tough composite insulating material and preparation method and application thereof

CN121991508ACN 121991508 ACN121991508 ACN 121991508ACN-121991508-A

Abstract

The invention belongs to the field of heat-conducting polymer composite materials, and particularly relates to a high-heat-conducting PEEK/PEI super-tough composite insulating material, a preparation method and application thereof. The PEEK/PEI super-tough composite insulating material with high heat conductivity comprises polyether-ether-ketone, polyether-imide, a heat conducting agent, a compatilizer, an optional toughening agent, an optional antioxidant and an optional lubricant, wherein the heat conducting agent comprises nanoscale alumina, micron-sized alumina and coated carbon fibers, and the coated carbon fibers comprise carbon fibers and a hydroxyethyl methacrylate-dimethylaminoethyl acrylate copolymer coated on the surfaces of the carbon fibers. The PEEK/PEI super-tough composite insulating material provided by the invention has high toughness and heat conductivity and insulativity.

Inventors

  • ZHU SHIPING
  • QIAO ZHILONG
  • CHEN QINGYONG
  • WEN YUFEI

Assignees

  • 深圳先进高分子材料研究院

Dates

Publication Date
20260508
Application Date
20260228

Claims (10)

  1. 1. The high-heat-conductivity PEEK/PEI super-tough composite insulating material is characterized by comprising polyether-ether-ketone, polyetherimide, a heat-conducting agent, a compatilizer, an optional toughening agent, an antioxidant and a lubricant, wherein the heat-conducting agent comprises nanoscale aluminum oxide, micron-sized aluminum oxide and coated carbon fibers, and the coated carbon fibers comprise carbon fibers and a hydroxyethyl methacrylate-dimethylaminoethyl acrylate copolymer coated on the surfaces of the carbon fibers.
  2. 2. The high thermal conductivity PEEK/PEI super tough composite insulating material according to claim 1, wherein the polyether ether ketone content is 5-50 parts by weight, the polyetherimide content is 20-50 parts by weight, the heat conducting agent content is 30-60 parts by weight, the compatilizer content is 2-5 parts by weight, the toughening agent content is 2-8 parts by weight, the antioxidant content is 0.1-2 parts by weight, and the lubricant content is 0.1-2 parts by weight.
  3. 3. The high-heat-conductivity PEEK/PEI super-tough composite insulating material according to claim 1, wherein the mass ratio of nano-scale alumina to micro-scale alumina to coated carbon fiber in the heat conducting agent is (2-10): (2-10): 1.
  4. 4. The PEEK/PEI super-tough composite insulating material with high heat conductivity according to claim 1 is characterized in that the coated carbon fiber is prepared by placing the carbon fiber in a polymerization reaction solution containing hydroxyethyl methacrylate, dimethylaminoethyl acrylate and an initiator, so that the hydroxyethyl methacrylate and the dimethylaminoethyl acrylate complete polymerization reaction on the surface of the carbon fiber, after the reaction is finished, carrying out solid-liquid separation, washing the obtained solid product with alcohol, and drying to obtain the coated carbon fiber; preferably, the carbon fibers have an average length of 1mm to 10mm and an average diameter of 5 μm to 10 μm; preferably, the mass ratio of the carbon fiber to the polymerization reaction solution is (10-30): 100; Preferably, the concentration of the hydroxyethyl methacrylate in the polymerization reaction solution is 8-12mol/L, and the concentration of the dimethylaminoethyl acrylate is 3-6mol/L; Preferably, the conditions of the polymerization reaction include a reaction temperature of 50 ℃ to 70 ℃ and a reaction time of 5 hours to 10 hours.
  5. 5. The high thermal conductivity PEEK/PEI super tough composite insulation material according to claim 1, wherein the nano-sized alumina has a particle size D90 of 0.1 μm-1 μm; preferably, the micron-sized alumina has a particle size D90 of 60 μm to 80 μm; preferably, the mass ratio of the nano-scale alumina to the micro-scale alumina is (0.5-2): 1; preferably, the nano-scale alumina and the micro-scale alumina are respectively modified nano-scale alumina and modified micro-scale alumina obtained by surface modification by adopting a carbonate coupling agent.
  6. 6. The high thermal conductivity PEEK/PEI super tough composite insulation material according to any of claims 1-5, wherein the compatilizer is ethylene-acrylate-glycerol acrylate copolymer and/or ethylene-methyl methacrylate copolymer.
  7. 7. The high thermal conductivity PEEK/PEI super tough composite insulating material according to any one of claims 1-5, wherein the toughening agent is thermoplastic polyester elastomer and/or polydodecyl lactam, the antioxidant is phosphite antioxidant, and the lubricant is silicone powder.
  8. 8. The method for preparing the high-heat-conductivity PEEK/PEI super-tough composite insulating material according to any one of claims 1 to 7, which is characterized by comprising the following steps: s1, uniformly mixing nano-scale alumina and micro-scale alumina to obtain composite alumina, and extruding and granulating polyetherimide and at least part of the composite alumina by adopting a double-screw extruder I to obtain a master batch A; s2, uniformly mixing polyether-ether-ketone, a master batch A, a compatilizer, an optional toughening agent, an antioxidant and a lubricant, adding into a main feeding port of a double-screw extruder II, adding the rest of composite alumina and modified carbon fiber into the main feeding port of the double-screw extruder II, and extruding and granulating all materials through the double-screw extruder II to obtain the PEEK/PEI super-tough composite insulating material with high heat conductivity.
  9. 9. The preparation method of the high-heat-conductivity PEEK/PEI super-tough composite insulating material according to claim 8, wherein the double-screw extruder I comprises seven areas, wherein the temperature of one area is controlled to be 80-120 ℃, the temperature of the other area is controlled to be 140-160 ℃, the temperature of the other area is controlled to be 340-360 ℃, the temperature of the other area is controlled to be 360-380 ℃, and the temperature of the machine head is controlled to be 370-390 ℃; The twin-screw extruder II comprises seven areas, wherein the temperature of the first area is controlled between 110 ℃ and 130 ℃, the temperature of the second area is controlled between 170 ℃ and 190 ℃, the temperature of the third area is controlled between 350 ℃ and 370 ℃, the temperature of the fourth area is controlled between 380 ℃ and 400 ℃, the temperature of the fifth area is controlled between 380 ℃ and 400 ℃, the temperature of the sixth area is controlled between 370 ℃ and 390 ℃, the temperature of the seventh area is controlled between 370 ℃ and 390 ℃, and the temperature of the machine head is controlled between 390 ℃ and 410 ℃.
  10. 10. The use of the high thermal conductivity PEEK/PEI super-tough composite insulating material according to any one of claims 1-7 in the field of electronics.

Description

High-heat-conductivity PEEK/PEI super-tough composite insulating material and preparation method and application thereof Technical Field The invention belongs to the field of heat-conducting polymer composite materials, and particularly relates to a high-heat-conducting PEEK/PEI super-tough composite insulating material, a preparation method and application thereof. Background With the comprehensive upgrade of the technology of artificial intelligence AI calculation, new energy batteries, humanoid robots and the like, the requirements of key components on heat dissipation are increased in geometric progression. Efficient thermal management has become a prerequisite to release the full potential of these technologies. The heat conducting polymer composite plays an important role, and the traditional heat conducting material can not meet the application requirements of safety, reliability and stability under the condition of high temperature. The heat-conducting engineering plastic can meet the heat-conducting requirement through functional modification, and can be applied to more complex working conditions such as high temperature, high humidity, high chemical corrosion and the like. In addition, a heat conducting polymer material is often filled between the heat source and the radiator to improve heat transfer efficiency. In many electronic devices, the heat source (e.g., chip) and the heat sink may be at different electrical potentials, and if the thermal interface material has poor insulation properties, conductive paths may be formed, resulting in electrical leakage and short circuits. Therefore, development of an insulating material with high heat conductivity is urgently required. In addition, the structure of the electronic device is increasingly complex, and the shapes of the internal components thereof are also diversified. The heat-conducting insulating polymer composite material needs to have good toughness, so that the heat-conducting insulating polymer composite material can be well adapted to the complex shapes, and close fitting is realized. In the installation process, the composite material with good toughness can be more easily filled into various gaps and corners, so that the continuity of a heat conduction path is ensured, and the heat dissipation effect is improved. For example, in some electronic devices with special-shaped structures, if the toughness of the heat conducting material is insufficient, it is difficult to completely attach to the surface of the device, so that an air gap is formed at the contact surface, and the heat conducting coefficient of air is extremely low, which can significantly increase the thermal resistance and reduce the heat dissipation efficiency. Polyether ether ketone (PEEK) is a special engineering plastic with excellent comprehensive performance and is known as plastic gold. The aromatic ring and ketone bond in the main chain structure of the polyether-ether-ketone and ether bond endow the polyether-ether-ketone with excellent heat resistance, mechanical strength and chemical stability. Although the advantages of polyetheretherketone are very evident, when the material formed therefrom has gaps or defects, the mechanical properties are significantly reduced, resulting in material failure. In addition, the polyether-ether-ketone has low heat conductivity coefficient, and in the application scene needing rapid heat dissipation, such as electronics, aerospace and the like, additional heat dissipation measures are needed. Polyetherimide (PEI) is thermoplastic polyimide, which not only maintains the advantages of high strength, high temperature resistance, good dielectric property and the like of the traditional polyimide, but also has excellent processability. The polyether imide is added into the polyether-ether-ketone material, so that the toughness of the polyether-ether-ketone material can be improved, the stress concentration at a notch or defect can be reduced, the risk of crack propagation can be reduced, and the notch sensitivity can be improved. However, polyetherimides do not improve the thermal conductivity of polyetheretherketone and may even weaken the electrical network of polyetheretherketone due to the lower thermal conductivity of the polyetherimide than polyetheretherketone, thereby reducing the overall thermal conductivity. At present, in order to improve the heat conducting property of the polyether-ether-ketone material, a high heat conducting filler such as an inorganic nonmetal heat conducting filler, a metal heat conducting material, a carbon material and the like is generally required to be added. However, although the inorganic nonmetallic heat conducting material has good insulativity and certain heat conductivity, the inorganic nonmetallic heat conducting material is difficult to achieve high heat conducting requirement when being used alone, and the inorganic nonmetallic heat conducting material has poor compatibility with a high