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CN-121991555-A - Primer for connection between ETFE films

CN121991555ACN 121991555 ACN121991555 ACN 121991555ACN-121991555-A

Abstract

The invention belongs to the technical field of film surface treatment, and in particular relates to a primer for connecting an ETFE film and a film, which consists of 55-70% by mass of a first component, 12-20% by mass of a second component comprising bisphenol A epoxy resin and dicyandiamide, and 0-13% by mass of a third component comprising fluororubber micro powder and silicon dioxide powder. The invention solves the problems of insufficient bonding strength, poor environmental resistance, high toxicity and the like in the prior art by the synergistic effect of the fluorine-containing blending system and the specific crosslinking system, and has the characteristics of excellent bonding effect, damp and heat resistance, aging resistance, environmental protection, low toxicity and moderate cost.

Inventors

  • RONG QINGONG
  • RONG SHAOHONG

Assignees

  • 山东森荣新材料股份有限公司

Dates

Publication Date
20260508
Application Date
20260205

Claims (6)

  1. 1. A primer for use in the connection between ETFE films, characterized in that: The composite material consists of a first component, a second component and a third component according to mass percentage, wherein the mass percentage of the first component is 55-70%, and is a blend of ETFE powder and PFA powder, and the mass ratio of ETFE to PFA is 1.5-2.6:1-1.4; The second component is 12-20% by mass and comprises bisphenol A epoxy resin and dicyandiamide, wherein the mass of the dicyandiamide is 20% of that of the bisphenol A epoxy resin; the mass percentage of the third component is 0-13%, the third component comprises fluororubber micro powder and silicon dioxide powder, and the mass of the silicon dioxide powder accounts for 20-30% of the total mass of the third component.
  2. 2. A primer for use in the connection between ETFE films according to claim 1, characterized in that: the particle size of the fluororubber micropowder is 5-20 mu m, and the particle size of the silicon dioxide powder is 1-5 mu m.
  3. 3. A primer for use in the connection between ETFE films according to claim 1, characterized in that: The preparation method for preparing the primer comprises the following steps: Step (1), weighing ETFE powder and PFA powder of the component one according to a proportion, placing the mixture in a high-speed mixer, and stirring the mixture for 15-20min at 60-80 ℃ to obtain a uniform blend; step (2), weighing bisphenol A epoxy resin and dicyandiamide of the component II in proportion, mixing, adding the component II weighed in proportion into the blend of the step (1), heating to 80-100 ℃, and stirring for 20-30min; And (3) cooling to room temperature, and grinding to the particle size of less than or equal to 50 mu m to obtain the primer.
  4. 4. A primer for use in the connection between ETFE films according to claim 3, characterized in that: If the mass percentage of the third component is more than 0, adding the fluororubber micro powder and the silicon dioxide powder which are weighed in proportion into the system of the step (2) before the step (3) is cooled to the room temperature, and continuously stirring for 15-20min at 80-90 ℃.
  5. 5. A primer for use in the connection between ETFE films according to claim 1, characterized in that: The method for realizing the connection between the ETFE film and the film by the primer comprises the following steps: step 100, cleaning and drying the connection surface of the ETFE film; step 200, uniformly coating the primer on the treated connecting surface, wherein the coating thickness is 5-15 mu m, and airing for 10-20min at 25-30 ℃; Step 300, coating fluorine material adhesive on the surface of the dried primer, wherein the coating thickness is 10-20 mu m; and 400, after the other piece of the ETFE film is processed, the connecting surface of the ETFE film is attached to the surface coated with the adhesive, the pressure of 0.3-0.5MPa is applied, the ETFE film is cured for 24-48h at the temperature of 25-40 ℃, and finally the connection is completed.
  6. 6. A primer for use in the connection between ETFE films according to claim 5, wherein: The fluorine material adhesive is fluorine-containing polyurethane adhesive or fluorine-containing epoxy resin adhesive.

Description

Primer for connection between ETFE films Technical Field The invention belongs to the technical field of film surface treatment, and particularly relates to a primer for connection between ETFE films. Background As a high-performance fluorine-containing polymer material, the ETFE film has the advantages of light weight, high strength, good weather resistance, high light transmittance and the like, and is widely applied to scenes such as agricultural greenhouses, building roofs, building enclosures and the like. In practical application, a plurality of ETFE films are spliced into a complete structure through a connecting technology, the existing connecting method mainly comprises a mechanical clamping plate type connecting method, a hot-press welding method and an adhesive connecting method, but the existing connecting method has the defects that firstly, the mechanical clamping plate type connecting method is complex in structure and complex in mounting steps, stress concentration is easy to occur at the edges of the clamping plates, the wind resistance of film materials is weak, the problem of tearing of the film materials is easy to occur after long-term use, secondly, the toughness of a welding area of the hot-press welding method is obviously reduced after high-temperature treatment, the welding precision is difficult to control, the connecting quality is unstable, the service life of the whole structure is influenced, thirdly, the existing adhesive is difficult to form effective adhesive force due to extremely low surface energy of the ETFE films, the humidity and heat resistance is insufficient, meanwhile, part of the adhesive adopts organic solvents such as acetone and toluene, and the like, and the toxicity is large, and the environmental friendliness is poor. Therefore, there is a need for a primer for the connection between ETFE films and membranes to solve the above problems. Disclosure of Invention The application aims to achieve the aim, and the aim is achieved by the following technical scheme: the primer for the connection between the ETFE film and the film consists of a first component, a second component and a third component according to mass percent, wherein the mass percent of the first component is 55-70%, the primer is a blend of ETFE powder and PFA powder, and the mass ratio of the ETFE to the PFA is 1.5-2.6:1-1.4; The second component is 12-20% by mass and comprises bisphenol A epoxy resin and dicyandiamide, wherein the mass of the dicyandiamide is 20% of that of the bisphenol A epoxy resin; the mass percentage of the third component is 0-13%, the third component comprises fluororubber micro powder and silicon dioxide powder, and the mass of the silicon dioxide powder accounts for 20-30% of the total mass of the third component. Further, the particle size of the fluororubber micropowder is 5-20 mu m, and the particle size of the silicon dioxide powder is 1-5 mu m. Further, the preparation method for preparing the primer comprises the following steps: Step (1), weighing ETFE powder and PFA powder of the component one according to a proportion, placing the mixture in a high-speed mixer, and stirring the mixture for 15-20min at 60-80 ℃ to obtain a uniform blend; step (2), weighing bisphenol A epoxy resin and dicyandiamide of the component II in proportion, mixing, adding the component II weighed in proportion into the blend of the step (1), heating to 80-100 ℃, and stirring for 20-30min; And (3) cooling to room temperature, and grinding to the particle size of less than or equal to 50 mu m to obtain the primer. Further, if the mass percentage of the third component is more than 0, before the step (3) is cooled to room temperature, the method further comprises the steps of adding the fluororubber micro powder and the silicon dioxide powder which are weighed in proportion into the system of the step (2), and continuously stirring for 15-20min at 80-90 ℃. Further, a method of connecting ETFE film to film by the primer includes the steps of: step 100, cleaning and drying the connection surface of the ETFE film; step 200, uniformly coating the primer on the treated connecting surface, wherein the coating thickness is 5-15 mu m, and airing for 10-20min at 25-30 ℃; Step 300, coating fluorine material adhesive on the surface of the dried primer, wherein the coating thickness is 10-20 mu m; and 400, after the other piece of the ETFE film is processed, the connecting surface of the ETFE film is attached to the surface coated with the adhesive, the pressure of 0.3-0.5MPa is applied, the ETFE film is cured for 24-48h at the temperature of 25-40 ℃, and finally the connection is completed. Further, the fluorine material adhesive is a fluorine-containing polyurethane adhesive or a fluorine-containing epoxy resin adhesive. Compared with the prior art, the application has the beneficial effects that: 1. The primer in the application constructs a dual stable combination system of the ETFE film, the prime