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CN-121991613-A - Adhesive film for chip carrier plate and preparation method of stacked film

CN121991613ACN 121991613 ACN121991613 ACN 121991613ACN-121991613-A

Abstract

The invention discloses a glue film for a chip carrier plate, wherein glue solution of the glue film comprises epoxy resin, thermoplastic resin, a toughening agent, a curing agent, inorganic filler, modified nano crystalline cellulose, a leveling agent, an anti-settling agent and a solvent, wherein the inorganic filler comprises coupling agent modified silicon dioxide and organic phosphonic acid doped polyaniline modified zirconia, the organic phosphonic acid doped polyaniline modified zirconia is modified by 2-hydroxyphosphorylacetic acid doped polyaniline modified zirconia, and the modified nano crystalline cellulose is modified by carboxymethyl nano cellulose through octadecyl trimethyl ammonium chloride. The organic phosphonic acid doped polyaniline modified zirconia is compounded with the coupling agent modified silica, and the modified nanocrystalline cellulose is uniformly dispersed in the adhesive film to form a compact adhesive film, so that the expansion coefficient of the adhesive film is small, the water vapor barrier property is improved, the adhesive force with the carrier plate in application is good, the reliability of the carrier plate is improved, the film surface of the adhesive film is uniform and flat, and the preparation of the carrier plate with fine lines and smaller aperture is facilitated.

Inventors

  • DU DONGHAI
  • WANG YUJIE
  • DONG QIAN

Assignees

  • 江阴骏驰新材料科技有限公司

Dates

Publication Date
20260508
Application Date
20251225

Claims (10)

  1. 1. The adhesive film for the chip carrier plate is characterized in that the adhesive solution of the adhesive film comprises epoxy resin, thermoplastic resin, a toughening agent, a curing agent, inorganic filler, modified nanocrystalline cellulose, a leveling agent, an anti-settling agent and a solvent; the inorganic filler comprises coupling agent modified silicon dioxide and organic phosphonic acid doped polyaniline modified zirconium oxide; The organic phosphonic acid doped polyaniline modified zirconia is prepared by doping polyaniline modified zirconia with 2-hydroxyphosphoryl acetic acid; The modified nanocrystalline cellulose is modified by carboxymethylated nanocellulose through octadecyl trimethyl ammonium chloride.
  2. 2. The adhesive film for a chip carrier according to claim 1, wherein the adhesive solution of the adhesive film comprises, by mass, 20-40 parts of an epoxy resin, 5-10 parts of a thermoplastic resin, 10-20 parts of a toughening agent, 0.5-2 parts of a curing agent, 60-90 parts of an inorganic filler, 5-10 parts of modified nanocrystalline cellulose, 0.5-3 parts of a leveling agent, 0.5-2 parts of an anti-settling agent and 40-100 parts of a solvent.
  3. 3. The adhesive film for a chip carrier according to claim 1 or 2, wherein the epoxy resin comprises naphthalene ring epoxy resin and o-cresol formaldehyde epoxy resin in a mass ratio of (1-10): 1.
  4. 4. The adhesive film for a chip carrier according to claim 1 or 2, wherein the thermoplastic resin comprises any one or a combination of at least two of phenoxy resin, polyvinyl acetal resin, polyolefin resin, polybutadiene resin, polyimide resin, polyamideimide resin, polyetherimide resin, polysulfone resin, polyethersulfone resin, polyphenylene oxide resin, polycarbonate resin, polyetheretherketone resin, polyester resin, and acrylic resin, and the toughening agent is epoxy-modified nitrile rubber or core-shell rubber.
  5. 5. The adhesive film for a chip carrier according to claim 2, wherein the curing agent comprises a phenolic curing agent and a latent curing agent, the mass ratio of the phenolic curing agent to the latent curing agent is (8-10): 1, and the latent curing agent comprises dicyandiamide and dicyandiamide accelerator in a mass ratio of 2:1.
  6. 6. The adhesive film for chip carrier boards according to claim 1 or 2, wherein the mass ratio of the coupling agent modified silica to the organic phosphonic acid doped polyaniline modified zirconia in the inorganic filler is (4-10): 1.
  7. 7. The adhesive film for a chip carrier according to claim 6, wherein the modifier of the coupling agent modified silica is gamma-glycidoxypropyl trimethoxysilane or gamma-aminopropyl triethoxysilane.
  8. 8. The adhesive film for chip carrier plates according to claim 1 or 2, wherein the preparation of the modified nanocrystalline cellulose is characterized in that fiber raw materials are first defiberized through sodium hydroxide solution, then added with mixed solution of sodium chloroacetate, water and ethanol for dissolution and dilution after heating, washed after heat preservation reaction to obtain preliminary carboxymethyl nanocellulose, then the preliminary carboxymethyl nanocellulose is dissolved in deionized water, ammonium persulfate is added, oxidation reaction is carried out after heating to obtain carboxymethyl nanocellulose, then octadecyl trimethyl ammonium chloride is dissolved in ethanol, and then the carboxymethyl nanocellulose is added for reaction.
  9. 9. A method for producing a stacked film, comprising the steps of: S1, configuring a release film, glue solution of a glue film and a BOPP cover film; S2, coating glue solution on the surface of the release film, and drying to form an uncured glue film; s3, heating and laminating the adhesive film and the BOPP cover film to obtain a stacked film; the drying temperature is 50-120 ℃ and is set in a partition mode; the temperature of the heating lamination is 80-100 ℃; the solvent of the glue solution is butanone and/or ethyl acetate.
  10. 10. The method according to claim 9, wherein the thickness of the adhesive film is 5 to 50 μm, the thickness of the release film is 25 to 100 μm, and the thickness of the BOPP film is 15 to 50 μm.

Description

Adhesive film for chip carrier plate and preparation method of stacked film Technical Field The invention relates to the technical field of electronic sizing materials, in particular to a glue film for a chip carrier plate and a preparation method of a stacked film. Background Epoxy resins are used in various fields such as electric and electronic materials and film materials because of their excellent adhesion, flexibility, heat resistance, chemical resistance, insulation, and curing reactivity. In recent years, miniaturization and higher performance of information devices have been advanced at a high speed, and along with this, materials used in the field of electronic components are required to have higher performance than ever before. In particular, the epoxy resin composition as a material for electric and electronic parts is required to be thinned with the reduction of the thickness of the substrate. However, epoxy resin contains hydroxyl groups and ether bonds with stronger polarity in the molecular structure, and the groups easily form hydrogen bonds with water molecules, so that the material has higher moisture absorption rate. If the multilayer arrangement comprises a barrier layer, the thinning is difficult to achieve, the process is complicated, and the performance of the composite adhesive film is negatively affected by repeated high-temperature curing. Disclosure of Invention The invention aims to overcome the defects in the prior art, provides a glue film for a chip carrier plate, wherein the glue film is formed by compounding organic phosphonic acid doped polyaniline modified zirconia and coupling agent modified silica and uniformly dispersing modified nanocrystalline cellulose in the glue film, the expansion coefficient of the obtained glue film is small, the water vapor barrier property is improved, the adhesive force between the glue film and the carrier plate is good, the reliability of the carrier plate is improved, the film surface of the obtained glue film is uniform and flat, and the glue film is also more beneficial to the manufacture of fine circuits and carrier plates with smaller apertures. In order to realize the technical effects, the technical scheme of the invention is that the adhesive film for the chip carrier plate comprises epoxy resin, thermoplastic resin, a toughening agent, a curing agent, inorganic filler, modified nano crystalline cellulose, a leveling agent, an anti-settling agent and a solvent; the inorganic filler comprises coupling agent modified silicon dioxide and organic phosphonic acid doped polyaniline modified zirconium oxide; The organic phosphonic acid doped polyaniline modified zirconia is prepared by doping polyaniline modified zirconia with 2-hydroxyphosphoryl acetic acid; The modified nanocrystalline cellulose is modified by carboxymethylated nanocellulose through octadecyl trimethyl ammonium chloride. According to the preferred technical scheme, the glue solution of the glue film comprises, by mass, 20-40 parts of epoxy resin, 5-10 parts of thermoplastic resin, 10-20 parts of toughening agent, 0.5-2 parts of curing agent, 60-90 parts of inorganic filler, 5-10 parts of modified nanocrystalline cellulose, 0.5-3 parts of leveling agent, 0.5-2 parts of anti-settling agent and 40-100 parts of solvent. Further, the glue solution of the glue film comprises, by mass, 25-35 parts of epoxy resin, 5-10 parts of thermoplastic resin, 10-20 parts of toughening agent, 0.5-2 parts of curing agent, 65-85 parts of inorganic filler, 7-10 parts of modified nanocrystalline cellulose, 0.5-3 parts of leveling agent, 0.5-2 parts of anti-settling agent and 45-100 parts of solvent. Further, the glue solution of the glue film comprises, by mass, 28-35 parts of epoxy resin, 6-10 parts of thermoplastic resin, 12-18 parts of toughening agent, 0.5-2 parts of curing agent, 70-80 parts of inorganic filler, 7-10 parts of modified nanocrystalline cellulose, 0.5-2.5 parts of leveling agent, 0.5-2 parts of anti-settling agent and 50-100 parts of solvent. The preferable technical scheme is that the epoxy resin comprises naphthalene ring epoxy resin and o-cresol formaldehyde epoxy resin with the mass ratio of (1-10): 1. The preferable technical scheme is that the thermoplastic resin comprises any one or a combination of at least two of phenoxy resin, polyvinyl acetal resin, polyolefin resin, polybutadiene resin, polyimide resin, polyamide imide resin, polyether imide resin, polysulfone resin, polyether sulfone resin, polyphenyl ether resin, polycarbonate resin, polyether ether ketone resin, polyester resin and acrylic resin, and the toughening agent is epoxy modified nitrile rubber or core-shell rubber. The preferable technical scheme is that the curing agent comprises a phenolic curing agent and a latent curing agent, the mass ratio of the phenolic curing agent to the latent curing agent is (8-10): 1, and the latent curing agent comprises dicyandiamide and dicyandiamide accelerator in a