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CN-121991616-A - Single-component epoxy adhesive for thermosensitive components and preparation and use methods thereof

CN121991616ACN 121991616 ACN121991616 ACN 121991616ACN-121991616-A

Abstract

The invention relates to the technical field of packaging materials of electric components and discloses a single-component epoxy adhesive for heat-sensitive components, which comprises, by mass, 5-25 parts of flexible resin, 1-5 parts of high-temperature resistant resin, 30-50 parts of epoxy resin, 0-5 parts of pigment, 0-3 parts of additive, 30-50 parts of filler, 0-3 parts of rheological additive and 5-15 parts of curing agent. The invention also discloses a preparation and application method of the single-component epoxy adhesive. The adhesive has moderate viscosity, and the formed adhesive cured product has high temperature resistance and high insulating strength.

Inventors

  • LU WEI
  • ZOU JIANPING
  • Ge Sujian
  • LU JINSONG

Assignees

  • 上海闰龙电子材料有限公司

Dates

Publication Date
20260508
Application Date
20260212

Claims (5)

  1. 1. The single-component epoxy adhesive for the thermosensitive element is characterized by comprising the following components of, by mass, 5-25 parts of flexible resin, 1-5 parts of high-temperature resistant resin, 30-50 parts of epoxy resin, 0-5 parts of pigment, 0-3 parts of additive, 30-50 parts of filler, 0-3 parts of rheological additive and 5-15 parts of curing agent.
  2. 2. The one-component epoxy adhesive for thermosensitive components as claimed in claim 1, wherein: The flexible resin is one or more of core-shell modified epoxy resin, rubber modified epoxy resin and sulfur rubber modified epoxy resin; The high-temperature resistant resin is one or more of phenolic aldehyde modified epoxy resin, trifunctional epoxy resin, tetrafunctional epoxy resin, multifunctional epoxy resin and naphthalene ring type epoxy resin; the epoxy resin is one or two of bisphenol A epoxy resin and bisphenol F epoxy resin; The pigment is one or more of red, yellow, blue, white and black; The additive is one or two of an organosilicon defoamer and a silane coupling agent; the filler is one or two of alumina and silica micropowder; The rheological additive is one or two of thixotropic rheological additive and fumed silica; the curing agent is one or two of imidazole addition product, 3-grade amine addition product and modified amine curing agent.
  3. 3. The one-component epoxy adhesive for thermosensitive elements as claimed in claim 1 or 2, wherein the thermosensitive element is PTC, PPTC or NTC.
  4. 4. A method for producing the one-component epoxy adhesive for thermosensitive components as claimed in any one of claims 1 to 3, characterized in that: comprises the following steps of the method, (A) Sequentially adding flexible resin, high-temperature resistant resin, epoxy resin, pigment and additive into a stirring kettle according to the mass parts of the components, and stirring for 30-60 minutes; (b) Sequentially adding the filler and the rheological additive according to the mass parts, and stirring for 2 hours; (c) Then cooling to below 40 ℃; (d) Sequentially adding the curing agent according to the mass parts, stirring for 10 minutes, and controlling the temperature below 40 ℃; (e) Dispersing for 5 times by a three-roller machine, and controlling the temperature below 40 ℃; (f) Stirring for 10 minutes, wherein the temperature is controlled below 40 ℃; (g) Vacuum defoamation for 60 minutes; (h) The single-component epoxy adhesive is obtained.
  5. 5. A method of using the one-component epoxy adhesive for heat-sensitive components as claimed in any one of claims 1 to 3, characterized in that: the single-component epoxy adhesive is coated or screen printed on a thermosensitive element, and is cured for 20-60 minutes at the temperature of 90-120 ℃ to form a single-component epoxy adhesive cured product.

Description

Single-component epoxy adhesive for thermosensitive components and preparation and use methods thereof Technical Field The invention relates to the technical field of packaging materials of electric components, in particular to a single-component epoxy adhesive for thermosensitive components and a preparation and use method thereof. Background PPTC and PTC are also positive temperature coefficient thermistors, except PPTC is a large current, small voltage, PTC is a small current, large voltage. The PTC is a novel overcurrent protection and overtemperature protection component, namely a self-recovery fuse, and plays roles of overcurrent protection and overtemperature protection. Organic high molecular polymers PPTC and ceramic PTC can be classified according to manufacturing materials. In contrast to PTC, NTC thermistors, which decrease in resistance with increasing temperature, can be used for surge suppression and temperature measurement. In order to protect the thermosensitive element, the adhesive needs to be coated to play the roles of protection such as water resistance and insulation. The existing adhesive is not resistant to high temperature, is easy to crack after reflow soldering (240-260 ℃ for 10 minutes), cannot well play the roles of protection such as water resistance and insulation, and causes the failure of heat-sensitive components, thereby causing the failure risk of electronic products. The Chinese patent discloses an epoxy acrylate polymer mixture for packaging NTC temperature sensors and a preparation process thereof (publication number: CN 121203352A), wherein the epoxy acrylate polymer mixture enables the temperature sensors to withstand high temperatures of up to 200 ℃, and the packaging of the sensor by resin is completed through a multi-stage curing process of UV curing and thermal curing. It can be seen that the high temperature resistance of the encapsulation layer is not ideal and the curing process is complex. Disclosure of Invention The invention aims to solve the problems and provide a single-component epoxy adhesive for a thermosensitive element and a preparation and application method thereof, wherein the adhesive has moderate viscosity, and the formed adhesive cured product has high temperature resistance and high insulating strength. The technical scheme adopted by the invention is as follows: the single-component epoxy adhesive for the thermosensitive element is characterized by comprising the following components of, by mass, 5-25 parts of flexible resin, 1-5 parts of high-temperature resistant resin, 30-50 parts of epoxy resin, 0-5 parts of pigment, 0-3 parts of additive, 30-50 parts of filler, 0-3 parts of rheological additive and 5-15 parts of curing agent. Further, the flexible resin is one or more of core-shell modified epoxy resin, rubber modified epoxy resin and sulfur rubber modified epoxy resin; The high-temperature resistant resin is one or more of phenolic aldehyde modified epoxy resin, trifunctional epoxy resin, tetrafunctional epoxy resin, multifunctional epoxy resin and naphthalene ring type epoxy resin; the epoxy resin is one or two of bisphenol A epoxy resin and bisphenol F epoxy resin; The pigment is one or more of red, yellow, blue, white and black; The additive is one or two of an organosilicon defoamer and a silane coupling agent; the filler is one or two of alumina and silica micropowder; The rheological additive is one or two of thixotropic rheological additive and fumed silica; the curing agent is one or two of imidazole addition product, 3-grade amine addition product and modified amine curing agent. Further, the thermosensitive element is PTC, PPTC or NTC. A method for preparing a single-component epoxy adhesive for thermosensitive components is characterized in that, Comprises the following steps of the method, (A) Sequentially adding flexible resin, high-temperature resistant resin, epoxy resin, pigment and additive into a stirring kettle according to the mass parts of the components, and stirring for 30-60 minutes; (b) Sequentially adding the filler and the rheological additive according to the mass parts, and stirring for 2 hours; (c) Then cooling to below 40 ℃; (d) Sequentially adding the curing agent according to the mass parts, stirring for 10 minutes, and controlling the temperature below 40 ℃; (e) Dispersing for 5 times by a three-roller machine, and controlling the temperature below 40 ℃; (f) Stirring for 10 minutes, wherein the temperature is controlled below 40 ℃; (g) Vacuum defoamation for 60 minutes; (h) The single-component epoxy adhesive is obtained. The application method of the single-component epoxy adhesive for the thermosensitive element is characterized in that the single-component epoxy adhesive is coated or screen-printed on the thermosensitive element, and the single-component epoxy adhesive is cured for 20-60 minutes at the temperature of 90-120 ℃ to form a single-component epoxy adhesive cured product. The beneficial ef