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CN-121992267-A - Liquid metal with high thermal conductivity and preparation process thereof

CN121992267ACN 121992267 ACN121992267 ACN 121992267ACN-121992267-A

Abstract

The application relates to a liquid metal with high thermal conductivity and a preparation process thereof, and relates to the field of metal materials, wherein the preparation raw materials comprise, by mass, 58-62 parts of indium, 8-10 parts of tin, 28-32 parts of bismuth and 4-6 parts of modified heat conducting filler. The preparation method comprises the steps of smelting indium, tin and bismuth in a protective atmosphere to obtain a metal mixed solution, cooling the metal mixed solution to 80-90 ℃, pouring the metal mixed solution into a mold, cooling to obtain solid metal, heating and melting the solid metal to obtain liquid metal, adding a modified heat conducting filler in the protective atmosphere, stirring, carrying out ultrasonic treatment and vacuum defoaming to obtain the liquid metal with high heat conductivity. The application improves the heat conduction performance of the material, reduces the leakage risk caused by excessive material flowing in the application process, and improves the use quality of the material.

Inventors

  • DAI SHUGAO
  • WANG KUN

Assignees

  • 昆山市硕鸿电子科技有限公司

Dates

Publication Date
20260508
Application Date
20260122

Claims (10)

  1. 1. The liquid metal with high thermal conductivity is characterized by comprising the following raw materials in parts by mass: 58-62 parts of indium Tin 8-10 parts 28-32 Parts of bismuth 4-6 Parts of modified heat conducting filler; The modified heat-conducting filler is prepared by the following steps: Mixing the modified liquid with the heat conducting filler, stirring, carrying out ultrasonic treatment, drying, ball milling and sieving to obtain the modified heat conducting filler; the heat conductive filler comprises micro-alumina and nano-zinc.
  2. 2. A liquid metal with high thermal conductivity according to claim 1, wherein the mass ratio of micro alumina to nano zinc in said heat conductive filler is 1 (0.25-0.4).
  3. 3. A liquid metal with high thermal conductivity according to claim 2, wherein the mass ratio of said heat conductive filler to modifier is 1 (0.01-0.02).
  4. 4. A liquid metal with high thermal conductivity according to claim 3, wherein said modifier comprises cetyltrimethylammonium bromide and sorbitan oleate.
  5. 5. A liquid metal with high thermal conductivity according to claim 4, wherein said cetyltrimethylammonium bromide and sorbitan oleate are present in a mass ratio of 1 (1.4-1.8).
  6. 6. A liquid metal with high thermal conductivity according to claim 5, wherein said modifier further comprises 2- (3, 4-epoxycyclohexane) ethyltrimethoxysilane.
  7. 7. A liquid metal with high thermal conductivity according to claim 6, wherein the mass ratio of cetyltrimethylammonium bromide, sorbitan oleate and 2- (3, 4-epoxycyclohexane) ethyltrimethoxysilane is 1:1.5 (0.3-0.4).
  8. 8. A process for preparing a liquid metal having a high thermal conductivity according to any one of claims 1 to 7, comprising the steps of: s1, smelting indium, tin and bismuth in a protective atmosphere to obtain a metal mixed solution; S2, cooling the metal mixed solution to 80-90 ℃, pouring the metal mixed solution into a mold, and cooling to obtain solid metal; And S3, heating and melting the solid metal to obtain liquid metal, adding the modified heat conducting filler in the protective atmosphere, and stirring, carrying out ultrasonic and vacuum defoaming to obtain the liquid metal with high heat conductivity.
  9. 9. The process for preparing liquid metal with high thermal conductivity according to claim 8, wherein the smelting temperature in the step S1 is 340-380 ℃ and the heat preservation time is 2-3h.
  10. 10. The process for preparing a liquid metal having high thermal conductivity according to claim 8, wherein the vacuum degassing treatment is followed by a heat-preserving stirring treatment in step S3, wherein the temperature is raised to 90-100 ℃ under a protective atmosphere, and the stirring is carried out at a speed of 50-100rpm for 30-60min.

Description

Liquid metal with high thermal conductivity and preparation process thereof Technical Field The application relates to the field of metal materials, in particular to a liquid metal with high thermal conductivity and a preparation process thereof. Background In the continuous development process of modern industry and electronic technology, the problem of thermal management is increasingly prominent, and high-efficiency thermal interface materials are important for guaranteeing stable operation and performance improvement of equipment. Liquid metal, as a material with unique heat transfer properties, is increasingly used in the thermal management field. The high heat conduction characteristic of the heat-conducting material can quickly and effectively transfer heat, and the heat-conducting material has huge application potential in the fields of electronic equipment heat dissipation, aerospace and the like, provides a new way for solving the heat dissipation problem under complex working conditions, and promotes the technical progress of related industries. In the conventional preparation of a liquid metal thermal interface material, low-melting-point metals such as gallium, indium, tin, bismuth and the like and alloys thereof are generally used. These alloys are capable of assuming a liquid state at room temperature or slightly elevated temperatures and retain the high thermal conductivity characteristics of the metal. The general preparation process may involve smelting or the like to obtain the desired alloy composition. However, in practical applications, to ensure the performance and quality of the material, it is often necessary to use complex equipment and processes, such as some operations under specific vacuum environments, or to use electroless plating or other processes to improve the performance of the material. However, the prior art has obvious drawbacks. On one hand, the liquid metal has the problem of overlarge surface tension, which leads to the phenomena of flow and leakage at high temperature in the use process, and seriously influences the use quality of the liquid metal, so the liquid metal needs to be improved. Disclosure of Invention In order to solve the problems, the application provides a liquid metal with high thermal conductivity and a preparation process thereof. The application provides a liquid metal with high thermal conductivity and a preparation process thereof, which adopts the following technical scheme: In a first aspect, the present application provides a liquid metal with high thermal conductivity, which adopts the following technical scheme: the preparation raw materials of the liquid metal with high thermal conductivity comprise the following components in parts by weight: 58-62 parts of indium Tin 8-10 parts 28-32 Parts of bismuth 4-6 Parts of modified heat conducting filler; The modified heat-conducting filler is prepared by the following steps: Mixing the modified liquid with the heat conducting filler, stirring, carrying out ultrasonic treatment, drying, ball milling and sieving to obtain the modified heat conducting filler; the heat conductive filler comprises micro-alumina and nano-zinc. The nano zinc can be used as a high-efficiency heat conduction node, bridging dispersed micrometer alumina particles, constructing a more complete and low-resistance three-dimensional heat conduction network in a cooperative way, improving the wettability and dispersibility of the filler in an alloy melt by modifying the surface of the filler, facilitating the uniform and stable distribution of the filler in the matrix, and ensuring the good heat conduction performance of the material, and meanwhile, properly regulating the rheological property of the system by particle interaction, so that the nano zinc can keep necessary fluidity at the application temperature to facilitate construction filling, has a certain internal structure and shape keeping capability, thereby reducing the risk of leakage caused by excessive flow in the working state, and improving the practicability and reliability of the material. Preferably, the mass ratio of the micro alumina to the nano zinc in the heat conducting filler is 1 (0.25-0.4). The nano zinc particles can be effectively distributed in gaps of the micro aluminum oxide and on the surfaces of the gaps, and bridge a plurality of aluminum oxide particles through good compatibility of the nano zinc particles and a liquid metal matrix, so that a more compact and continuous three-dimensional heat conduction network is constructed, the heat conduction efficiency of the composite material is effectively improved, meanwhile, the optimized proportion is also beneficial to regulating and controlling the rheological behavior of the composite system, high heat conduction performance is given to the material, moderate internal structural strength is maintained through interaction among the particles, good morphological stability of the material is maintain