Search

CN-121992348-A - Water-cooling conducting ring structure and magnetron sputtering film deposition equipment

CN121992348ACN 121992348 ACN121992348 ACN 121992348ACN-121992348-A

Abstract

The invention discloses a water-cooling conducting ring structure and magnetron sputtering film deposition equipment, wherein the water-cooling conducting ring structure comprises a rectangular frame, an electric joint and a water-cooling conducting ring, wherein the rectangular frame comprises four splicing strips and four splicing parts, two adjacent splicing strips are fixedly connected through the splicing parts, a cooling water channel is arranged in the splicing strips along the length direction of the splicing strips, a transition water channel is arranged in the splicing parts and is communicated with the cooling water channels of the two adjacent splicing strips, so that an annular circulating water channel is formed, the electric joint is connected with the rectangular frame, and the electric joint is provided with an inlet water channel and an outlet water channel which are communicated with the circulating water channel. According to the water-cooling conductive ring structure, the four splicing strips are arranged and spliced by the splicing parts, so that the water-cooling conductive ring structure is in a spliced structure, and compared with integral processing, the water-cooling conductive ring structure is more convenient to process and manufacture and lower in cost.

Inventors

  • XIAO RONGFENG
  • ZHU XINHUA
  • YANG HONGSHENG
  • ZHANG XIAOJUN

Assignees

  • 深圳市矩阵多元科技有限公司

Dates

Publication Date
20260508
Application Date
20241101

Claims (10)

  1. 1. A water-cooled conductive ring structure, comprising: The rectangular frame comprises four splicing strips and four splicing parts, two adjacent splicing strips are fixedly connected through the splicing parts, a cooling water channel is arranged in the splicing strips along the length direction of the splicing strips, a transition water channel is arranged in the splicing parts, and the transition water channel is communicated with the cooling water channels of two adjacent splicing strips, so that an annular circulating water channel is formed; the electric connector is connected to the rectangular frame and is provided with a water inlet channel and a water outlet channel which are communicated with the circulating water channel.
  2. 2. The water-cooled conductive ring structure of claim 1, wherein at least one of the splicing part and the splicing strip is provided with an extension part along the length direction of the splicing strip, and the extension part is connected with the upper end and/or the lower end of the other one in a fitting way.
  3. 3. The water-cooling conducting ring structure of claim 2, wherein the splicing part is provided with two extending parts near one end of the splicing strip, and the two extending parts are respectively attached to the upper end and the lower end of the splicing strip.
  4. 4. The water-cooled conducting ring structure of claim 3, wherein a first positioning protrusion is arranged at one end of the extending part attached to the splicing strip, the splicing strip is provided with a first positioning concave position, and the first positioning protrusion is matched with the first positioning concave position and is used for at least limiting the movement of the splicing part relative to the splicing strip along the length direction of the splicing strip.
  5. 5. The water-cooled conductive ring structure of claim 3, wherein the splice comprises: The two ends of the corner fitting are abutted against the end parts of the two adjacent splicing strips; the two fixing plates are arranged at the upper end and the lower end of the corner fitting, and the two ends of each fixing plate extend to the upper end or the lower end of the adjacent two splicing strips and are used for forming the extending parts.
  6. 6. The water-cooled conductive ring structure of claim 5, wherein the opposite sides of the corner fitting and the fixing plate are respectively provided with a second positioning protrusion and a second positioning recess.
  7. 7. The water-cooling conducting ring structure of claim 1, wherein a first arc-shaped transition surface is arranged on the outer side of the splicing part, a second arc-shaped transition surface is arranged on the inner side of the splicing part, the first arc-shaped transition surface is connected with the outer end surfaces of two adjacent splicing strips in a flush manner, and the second arc-shaped transition surface is connected with the inner end surfaces of two adjacent splicing strips in a flush manner.
  8. 8. The water-cooled conductive ring structure of claim 7, wherein the transition water channel comprises a first section and a second section along the length direction, the first section and the second section are respectively communicated with an adjacent cooling water channel, and the first section and the second section are distributed at an obtuse angle.
  9. 9. The water-cooling conducting ring structure of claim 1, wherein a sealing ring is arranged at the joint of the transition water channel and the cooling water channel.
  10. 10. A magnetron sputtering thin film deposition apparatus, comprising: A collimator; The water-cooled conductive ring structure of any one of claims 1 to 9, which is provided on a peripheral side of the collimator.

Description

Water-cooling conducting ring structure and magnetron sputtering film deposition equipment Technical Field The invention relates to the field of magnetron sputtering, in particular to a water-cooling conducting ring structure and magnetron sputtering thin film deposition equipment. Background Magnetron sputtering coating is widely applied to the vacuum coating industries of semiconductors, photovoltaics and the like as a high-efficiency film deposition technology. The magnetron sputtering coating is realized by that electrons collide with argon atoms in the process of accelerating the electrons to fly to the substrate under the action of an electric field through the interaction of the electric field and a magnetic field, so that a large amount of argon ions and electrons are ionized, and the electrons fly to the substrate. The argon ions are accelerated to bombard the target under the action of an electric field, a large amount of target atoms and ions are sputtered, and the target atoms and ions are deposited on a substrate to form a film. In semiconductors, as the circuit density of each generation of devices increases, it is necessary to coat the surface of a substrate having high aspect ratio holes, the walls of the holes. When coating a substrate with a deep hole, the direction of coating atoms and ions from the target surface to the substrate surface is expected to be close to the vertical substrate surface, so that the problems of poor coating and the like caused by that the bottom of the deep hole of the substrate is not fully coated with the coating, and the hole is sealed are avoided. Therefore, the magnetic fields generated by the upper coil and the lower coil are required to correct the motion track of the ions. The atoms are not affected by magnetic field and electric field, so that collimator is needed to screen, and the atoms which do not meet the direction requirement are filtered. And in some processes, the collimator turns on the pulsed power supply, which also corrects the ion trajectories. In the prior art, the collimator is indirectly electrified and water-cooled through the water-cooled conducting ring, but the existing water-cooled conducting ring is usually machined by an integrated machine, so that the machining difficulty is high, and the cost is very high. Disclosure of Invention The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides a water-cooling conducting ring structure which is convenient to process and low in cost. The invention also provides magnetron sputtering thin film deposition equipment with the water-cooling conducting ring structure. According to an embodiment of the first aspect of the present invention, a water-cooled conductive ring structure includes: The rectangular frame comprises four splicing strips and four splicing parts, two adjacent splicing strips are fixedly connected through the splicing parts, a cooling water channel is arranged in the splicing strips along the length direction of the splicing strips, a transition water channel is arranged in the splicing parts, and the transition water channel is communicated with the cooling water channels of two adjacent splicing strips, so that an annular circulating water channel is formed; the electric connector is connected to the rectangular frame and is provided with a water inlet channel and a water outlet channel which are communicated with the circulating water channel. The water-cooling conducting ring structure provided by the embodiment of the invention has at least the following beneficial effects: Through setting up four concatenation strips to utilize splice with four concatenation strips concatenation, thereby make the structure of concatenation formula with water-cooling conducting ring structure, so set up, for integrative processing, not only processing preparation is more convenient, and the cost is lower. According to some embodiments of the invention, at least one of the splicing part and the splicing strip is provided with an extension part along the length direction of the splicing strip, and the extension part is connected with the upper end and/or the lower end of the other one in a fitting way. According to some embodiments of the invention, the splicing part is provided with two extending parts near one end of the splicing strip, and the two extending parts are respectively connected with the upper end and the lower end of the splicing strip in a fitting way. According to some embodiments of the invention, a first positioning protrusion is disposed at one end of the extension portion attached to the splicing strip, the splicing strip is provided with a first positioning recess, and the first positioning protrusion is matched into the first positioning recess and is used for at least limiting movement of the splicing portion relative to the splicing strip along the length direction of the splicing strip. A