CN-121992354-A - Substrate resistance heating device and pulse laser deposition system

Abstract

The invention discloses a substrate resistance heating device and a pulse laser deposition system, wherein the substrate resistance heating device comprises a base, a resistance heating structure and a pulse laser deposition system, wherein the base is provided with an installation position with an opening at the front side, conductive parts are respectively arranged at the left side and the right side of the installation position, the conductive parts are connected with copper wires, the resistance heating structure comprises an installation part and a substrate, the installation part is inserted into the installation position, the installation part can move forwards and backwards and can be taken out from the front side of the installation position, the substrate is arranged at the installation part, the substrate is made of conductive materials, and a conductive path is formed between the substrate and the conductive parts at the left side and the right side when the installation part is inserted into the installation position. The invention has simple structure, low cost, less energy loss, high heating speed and convenient installation and operation.

Inventors

• SUN SHOUXIANG
• Ling Rikang
• LI BINGKUN
• ZHANG XIAOJUN
• ZHANG SHILING

Assignees

• 深圳市矩阵多元科技有限公司

Dates

Publication Date

20260508

Application Date

20241108

Claims (10)

1. 1. A substrate resistance heating apparatus, comprising: The base is provided with an installation position with an opening at the front side, the left side and the right side of the installation position are respectively provided with a conductive part, and the conductive parts are connected with copper wires; The resistance heating structure comprises a mounting part and a substrate, wherein the mounting part is inserted in the mounting position, the mounting part can move forwards and backwards and can be taken out from the front side of the mounting position, the substrate is arranged on the mounting part and is made of a conductive material, and when the mounting part is inserted in the mounting position, a conductive path is formed between the substrate and the conductive parts on the left side and the right side.
2. 2. The substrate resistance heating apparatus according to claim 1, wherein said base is provided with two electrode pads, and said conductive portions on the left and right sides are connected to said two electrode pads through said copper wires, respectively.
3. 3. The substrate resistance heating apparatus according to claim 1, wherein the conductive portion is provided with an elastic portion having elasticity, and the elastic portion abuts downward against the mounting portion to restrict forward and backward movement of the mounting portion.
4. 4. The substrate resistance heating apparatus according to claim 3, wherein said elastic portion comprises a first section and a second section, said first section extending obliquely downward rearward, said second section being connected to a rear end of said first section and extending obliquely upward rearward.
5. 5. The resistive heating device for substrates according to claim 1, wherein the mounting portion is provided with clamping assemblies on both sides of the substrates, respectively, the clamping assemblies include a lower clamping plate and an upper clamping plate, the lower clamping plate is horizontally disposed, and the upper clamping plate is detachably disposed on an upper side of the lower clamping plate and can cooperate with the lower clamping plate to clamp and fix the substrates.
6. 6. The substrate resistance heating device of claim 5, wherein the mounting portion is provided with a bottom plate, a set of mounting posts are respectively arranged on the left side and the right side of the upper surface of the bottom plate, the set of mounting posts comprises at least two mounting posts which are arranged at intervals front and back, through holes matched with the mounting posts are respectively arranged on the upper clamping plate and the lower clamping plate, the mounting posts are sleeved on the same set of mounting posts through the through holes, a first insulating sleeve is sleeved on the lower side of the lower clamping plate, and locking nuts are connected on the upper side of the upper clamping plate in a threaded manner.
7. 7. The resistive heating apparatus of claim 5, wherein the upper clamping plate and the lower clamping plate are made of conductive materials, the conductive portion is provided with an elastic portion, the elastic portion has elasticity, and the elastic portion abuts against the upper surface of the lower clamping plate.
8. 8. The substrate resistance heating device according to claim 1, wherein the mounting portion has a limit groove formed on each of left and right sides thereof, the limit groove extends forward and backward and has an opening at a front end, the mounting portion has a limit protrusion formed on a rear side thereof, the mounting portion has left and right ends respectively fitted into the limit grooves formed on the left and right sides thereof, and the rear end of the mounting portion abuts against the limit protrusion.
9. 9. The substrate resistance heating apparatus of claim 8, wherein the front end of the limiting groove is provided with a chamfer.
10. 10. A pulsed laser deposition system comprising a substrate resistance heating apparatus according to any one of claims 1 to 9.

Description

Substrate resistance heating device and pulse laser deposition system Technical Field The invention relates to the technical field of coating equipment, in particular to a substrate resistance heating device and a pulse laser deposition system. Background The pulse laser film plating system is used as a novel film plating device, has wide application, and can be used for preparing various substance films such as metal, semiconductor, oxide, nitride, carbide, boride, silicide, sulfide, fluoride and the like. The laser emitted by the laser enters the coating cavity through a laser window in the pulse laser coating system to bombard the target material, so that the target material is evaporated and even ionized to move towards the substrate, and a film material is formed. In the pulse laser coating process, the substrate table generally needs to be heated to a very high temperature (such as 700 ℃), and a common substrate heating mode mainly uses a heater to heat the substrate, wherein the heating modes comprise radiation heating and contact conduction heating, and the heating modes all need to use the heater, are heat transfer, have heat loss, have high manufacturing cost and complex structure and have higher technical requirements on assembly staff. Disclosure of Invention The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides the substrate resistance heating device which has the advantages of less energy loss, high heating speed, low cost and convenience in use and installation. The invention also provides a pulse laser deposition system with the substrate resistance heating device. According to an embodiment of the first aspect of the present invention, a substrate resistance heating apparatus includes: The base is provided with an installation position with an opening at the front side, the left side and the right side of the installation position are respectively provided with a conductive part, and the conductive parts are connected with copper wires; The resistance heating structure comprises a mounting part and a substrate, wherein the mounting part is inserted in the mounting position, the mounting part can move forwards and backwards and can be taken out from the front side of the mounting position, the substrate is arranged on the mounting part and is made of a conductive material, and when the mounting part is inserted in the mounting position, a conductive path is formed between the substrate and the conductive parts on the left side and the right side. The substrate resistance heating device provided by the embodiment of the invention has at least the following beneficial effects: In the embodiment, the substrate is made of conductive materials, so that a conductive path is formed between the substrate and the left and right conductive parts on the base by only inserting the mounting part into the mounting position on the base, and then a power supply is connected through a copper wire, so that the substrate can be directly subjected to resistance heating by using current, and high temperature is generated. According to some embodiments of the invention, the base is provided with two electrode female heads, and the conductive parts on the left and right sides are respectively connected with the two electrode female heads through the copper wires. According to some embodiments of the invention, the conductive portion is provided with an elastic portion having elasticity, and the elastic portion abuts downward against the mounting portion to restrict the forward and backward movement of the mounting portion. According to some embodiments of the invention, the elastic portion includes a first section extending obliquely downward rearward and a second section connected to a rear end of the first section and extending obliquely upward rearward. According to some embodiments of the invention, the mounting portion is provided with clamping assemblies on the left and right sides of the substrate, the clamping assemblies include a lower clamping plate and an upper clamping plate, the lower clamping plate is horizontally arranged, and the upper clamping plate is detachably arranged on the upper side of the lower clamping plate and can be matched with the lower clamping plate to clamp and fix the substrate. According to some embodiments of the invention, the mounting portion is provided with a bottom plate, a set of mounting posts are respectively arranged on the left side and the right side of the upper surface of the bottom plate, the set of mounting posts comprises at least two mounting posts which are arranged at intervals from front to back, through holes matched with the mounting posts are formed in the upper clamping plate and the lower clamping plate, the mounting posts are sleeved on the same set of mounting posts through the through holes, a first insulating sleeve is sleeved on the lower side of the lower clamping pl