CN-121992358-A - Automatic temperature control system and method for sputter deposition device

CN121992358ACN 121992358 ACN121992358 ACN 121992358ACN-121992358-A

Abstract

The invention belongs to the technical field of sputtering deposition, and provides an automatic temperature control system and method for a sputtering deposition device, the system realizes accurate control of the cavity temperature in the sputtering deposition process by integrating components such as a vacuum gauge, a gas cylinder, a valve, a thermocouple temperature measuring element, a PID regulator and the like. The system monitors the temperature of the cavity in real time by utilizing the thermocouple, and automatically adjusts the power of the heating wire according to the comparison result of the set value and the actual value by the PID regulator, thereby maintaining the stability of the temperature of the cavity. In addition, the system also has the function of communicating with an upper computer, can carry out remote monitoring and control through a software layer, and improves the automation level and the temperature control precision of the sputtering deposition process. The invention solves the problems of low temperature control precision, insufficient automation degree and poor stability in the prior art, ensures the consistency of film performance through the linkage control of temperature, vacuum degree and gas flow, and is suitable for the large-scale production of high-precision films.

Inventors

LIU ZHIHUI
TIAN PENG
SHI WENYAN
QI XUE
ZHANG YIXUAN
PU HONGYU
LIU TAO
TAN QIULIN

Assignees

中北大学

Dates

Publication Date: 20260508
Application Date: 20260128

Claims (8)

1. An automatic temperature control system for a sputtering deposition device is characterized by comprising a cavity assembly, a temperature monitoring module, a heating module, a gas adjusting module, a control module and an upper computer; The cavity assembly is used for providing a closed vacuum environment for sputtering deposition, and an objective table is arranged in the cavity assembly; The temperature monitoring module comprises at least two thermocouple temperature measuring elements which are respectively embedded into the inner wall of the cavity assembly and the bottom of the objective table and are used for collecting the environmental temperature of the cavity and the temperature of the objective table in real time; the heating module comprises a heating wire arranged around the outer wall of the cavity assembly; The gas regulating module is used for inputting sputtering gas into the cavity assembly and regulating the gas flow and the vacuum degree in the cavity assembly; The control module is used for cooperatively adjusting heating power, gas flow and vacuum degree; the upper computer is connected with the control module through a communication interface.
2. The automatic temperature control system for the sputtering deposition device according to claim 1, wherein the gas adjusting module comprises a gas cylinder, a vacuum gauge, a gas inlet valve, a gas outlet valve and a gas flow controller, the gas cylinder is communicated with the cavity assembly through the gas inlet valve and the gas flow controller and is used for introducing sputtering gas of a preset type into the cavity assembly, the vacuum gauge is arranged at the top of the cavity assembly and is used for monitoring the vacuum degree in the cavity in real time, the gas outlet valve is used for adjusting the internal pressure of the cavity assembly, and the gas flow controller is used for controlling the flow of the sputtering gas.
3. The automatic temperature control system for the sputtering deposition device according to claim 2, wherein the control module comprises a PID regulator and a data processing unit, the data processing unit is respectively and electrically connected with the temperature monitoring module and the vacuum gauge and is used for filtering, amplifying and digitizing the temperature detection signal and the vacuum degree signal, and the PID regulator is respectively and electrically connected with the data processing unit, the heating driving unit, the air inlet valve, the air outlet valve and the gas flow controller and is used for outputting a control signal through a PID algorithm according to the deviation between a preset temperature value and an actual detection temperature so as to realize the cooperative adjustment of heating power, gas flow and vacuum degree.
4. An automated temperature control system and method for a sputter deposition apparatus, applied to the automated temperature control system for a sputter deposition apparatus of claim 3, comprising the steps of: step 1, initializing a system, and setting a preset temperature value through an upper computer Threshold vacuum degree Flow value of gas PID initial control parameters; Step 2, constructing a vacuum environment, controlling the opening of an exhaust valve by a control module, vacuumizing the cavity assembly, feeding back vacuum degree data in real time by a vacuum gauge, and when the vacuum degree reaches a preset threshold value When the exhaust valve is controlled to be closed, the air inlet valve is simultaneously opened, according to the set flow rate by a gas flow controller Introducing sputtering gas; step 3, temperature monitoring and deviation calculation, wherein the thermocouple temperature measuring element acquires the temperature of the cavity in real time And stage temperature The data processing unit processes the acquired temperature signals and calculates the average temperature value And get out the temperature deviation ; Step 4, PID closed-loop regulation, wherein the PID regulator calculates the output control quantity according to the temperature deviation through an improved PID control algorithm The expression of the improved PID control algorithm is: ; Wherein, the In order to output the control quantity, Is a coefficient of proportionality and is used for the control of the power supply, In order to integrate the time of the time, In order to differentiate the time of the time, Is the coupling coefficient of the vacuum degree, As a result of the dynamic weight coefficient, Is a noise suppression coefficient; According to the control quantity The output power of the heating wire is regulated, and simultaneously the opening of the air inlet valve and the air flow are regulated in a linkage way, so that the temperature of the cavity is stabilized at a preset temperature value ; Step 5, monitoring the process and optimizing parameters, wherein the upper computer displays temperature data, vacuum degree data and equipment running state in real time, if the temperature deviation continuously exceeds an allowable range, the PID regulator automatically starts a parameter setting program to optimize the parameters until the temperature deviation returns to within +/-0.3 ℃; And step 6, after the process is finished and the sputtering deposition is finished, the control module controls the heating wire to stop working, closes the air inlet valve, opens the air outlet valve to release the cavity pressure, and the system is restored to the initial state.
5. The automated temperature control system and method for a sputter deposition apparatus of claim 4, wherein in step 4, when In this case, the PID regulator reduces the output control amount Reducing the power of the heating wire and simultaneously reducing the opening of the air inlet valve when In this case, the output control amount is increased The power of the heating wire is improved, and simultaneously increasing the opening of the air inlet valve.
6. The automated temperature control system and method for a sputter deposition apparatus of claim 4, wherein in step 4, the vacuum degree coupling coefficient is The method meets the following conditions: ; Wherein, the In order to maximize the deviation of the degree of vacuum, The heating power corresponding to the temperature deviation is changed.
7. The automated temperature control system and method for a sputter deposition apparatus of claim 4, wherein in step 4, the dynamic weight coefficients are The value is as follows: And (3) heating: ; constant temperature stage: ; And (3) a cooling stage: 。
8. the automated temperature control system and method for a sputter deposition apparatus of claim 4, wherein in step 4, the noise suppression coefficient is =2°C。

Description

Automatic temperature control system and method for sputter deposition device Technical Field The invention belongs to the technical field of sputter deposition, and particularly relates to an automatic temperature control system and method for a sputter deposition device. Background The sputtering deposition technology is used as one of the core technologies of physical vapor deposition, and is widely applied to the manufacturing process of high-end products such as semiconductor chips, optical devices, electronic elements and the like due to the advantages of high film density, strong adhesive force, good film forming uniformity and the like. In the sputtering deposition process, the cavity temperature is a key parameter affecting the quality of the film, and the stability of the cavity temperature directly determines the core indexes such as refractive index, crystallinity, thickness uniformity, mechanical property and the like of the film. In the prior art, the temperature control of a sputtering deposition device mostly adopts a traditional manual regulation or simple constant temperature control mode, and has the defects that firstly, the temperature monitoring precision is low, dynamic change of the temperature in a cavity is difficult to capture in real time, so that the temperature control is lagged, secondly, an automatic closed loop regulation mechanism is lacking, the heating power is regulated depending on manual experience, the temperature fluctuation is easy to cause, the consistency of film performance is influenced, thirdly, the linkage control of the temperature, the vacuum degree, the gas flow and other technological parameters is not realized, and the system stability is poor, so that the requirement of high-precision film preparation cannot be met. Particularly in the preparation of optical films and semiconductor functional films, the refractive index of the films is extremely sensitive to temperature change, and small temperature deviation can lead to deviation of the refractive index of the films from a design value, so that the usability of the device is finally affected. Therefore, developing an automatic temperature control system capable of realizing accurate monitoring, automatic closed-loop adjustment and multi-parameter cooperative control of cavity temperature becomes a key for solving the bottleneck of the prior art. Disclosure of Invention In order to solve the technical problems, the invention provides an automatic temperature control system and method for a sputtering deposition device, so as to solve the problems in the prior art, and the technical scheme adopted by the invention is as follows: An automatic temperature control system for a sputtering deposition device comprises a cavity assembly, a temperature monitoring module, a heating module, a gas adjusting module, a control module and an upper computer; The cavity assembly is used for providing a closed vacuum environment for sputtering deposition, and an objective table is arranged in the cavity assembly; The temperature monitoring module comprises at least two thermocouple temperature measuring elements which are respectively embedded into the inner wall of the cavity assembly and the bottom of the objective table and are used for collecting the environmental temperature of the cavity and the temperature of the objective table in real time; the heating module comprises a heating wire arranged around the outer wall of the cavity assembly; The gas regulating module is used for inputting sputtering gas into the cavity assembly and regulating the gas flow and the vacuum degree in the cavity assembly; The control module is used for cooperatively adjusting heating power, gas flow and vacuum degree; the upper computer is connected with the control module through a communication interface. Further, the gas regulating module comprises a gas cylinder, a vacuum gauge, a gas inlet valve, a gas outlet valve and a gas flow controller, wherein the gas cylinder is communicated with the cavity assembly through the gas inlet valve and the gas flow controller and is used for introducing sputtering gas of a preset type into the cavity assembly, the vacuum gauge is arranged at the top of the cavity assembly and is used for monitoring the vacuum degree in the cavity in real time, the gas outlet valve is used for regulating the internal pressure of the cavity assembly, and the gas flow controller is used for controlling the flow of the sputtering gas. The control module comprises a temperature monitoring module, a vacuum gauge, a temperature detection module, a temperature control module, a heating driving unit, an air inlet valve, an air outlet valve, a gas flow controller, a temperature detection signal, a vacuum degree signal, a temperature control module, a vacuum degree signal, a temperature control module and a data processing unit, wherein the data processing unit is respectively electrically connected with the temperature monit