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CN-121992406-A - Manufacturing method of metal mask plate and metal mask plate

CN121992406ACN 121992406 ACN121992406 ACN 121992406ACN-121992406-A

Abstract

The invention discloses a manufacturing method of a metal mask plate and the metal mask plate, and relates to the technical field of metal material preparation, comprising the following steps of etching a test strip with initial tension by using etching liquid to form a plurality of etching holes, wherein the test strip comprises a test metal substrate and a test mask pattern layer formed on the test metal substrate, the test mask pattern layer comprises a plurality of through holes, and the through holes correspond to the etching holes one by one; detecting the critical dimension of an etching hole formed on the test metal substrate, comparing the critical dimension with a design dimension, determining an etching parameter, wherein the etching parameter is related to the production tension applied by the production strip, and etching the production strip according to the etching parameter. The invention solves the problems of poor stability and low yield of the metal mask plate processing technology.

Inventors

  • HUANG CHAO
  • MO SONGTING
  • SHEN JIANGUO
  • XU ZONGYI
  • GU QIANGANG
  • MEI QIN
  • FU YUNCHANG
  • CHEN JUNSHUO

Assignees

  • 宁波寰采星科技股份有限公司

Dates

Publication Date
20260508
Application Date
20260401

Claims (10)

  1. 1. The manufacturing method of the metal mask plate is characterized by comprising the following steps of: Etching the test strip with the initial tension by using etching liquid to form a plurality of etching holes, wherein the test strip comprises a test metal substrate and a test mask pattern layer formed on the test metal substrate, the test mask pattern layer comprises a plurality of through holes, and the through holes are in one-to-one correspondence with the etching holes; Detecting the critical dimension of an etching hole formed on the test metal substrate; Comparing the critical dimension with a design dimension, and determining an etching parameter, wherein the etching parameter is related to the production tension applied by the production strip; And etching the production strip according to the etching parameters.
  2. 2. The method according to claim 1, wherein the test strip is disposed between an unreeling mechanism and a reeling mechanism, a liquid pool for storing the etching liquid is disposed between the unreeling mechanism and the reeling mechanism, at least one tension adjusting roller is disposed between the liquid pool and the unreeling mechanism and between the liquid pool and the reeling mechanism, the test strip passes through the liquid pool and each tension adjusting roller, and in the step of etching the test strip with the etching liquid, initial tension parameters are configured for the unreeling mechanism, the reeling mechanism and each tension adjusting roller to apply initial tension to the test strip; The etching parameters comprise production tension parameters for the unreeling mechanism, the reeling mechanism and the tension adjusting rollers, wherein in the step of etching the production strip according to the etching parameters, the production strip is arranged between the unreeling mechanism and the reeling mechanism, and passes through the liquid pool and the tension adjusting rollers.
  3. 3. The method according to claim 2, wherein in the step of configuring initial tension parameters for the unreeling mechanism, the reeling mechanism and the tension adjusting rollers, the initial tension parameters for the unreeling mechanism are 30-60 n, the initial tension parameters for the tension adjusting rollers are 40-80 n, and the initial tension parameters for the reeling mechanism are 20-50 n.
  4. 4. A method of fabricating a metal mask according to claim 2 or claim 3, wherein comparing the critical dimension with a design dimension to determine an etching parameter comprises: And compensating the initial tension parameter under the condition that the absolute difference between the critical dimension and the design dimension is larger than a preset threshold value, so as to obtain the corrected production tension parameter.
  5. 5. The method for manufacturing a metal mask plate according to claim 4, wherein compensating the initial tension parameter when the absolute difference between the critical dimension and the design dimension is greater than a preset threshold comprises: in the case where the critical dimension is smaller than the design dimension, the production tension parameter satisfies the formula (1): In the case where the critical dimension is greater than the design dimension, the production tension parameter satisfies equation (2): Wherein, the For the production tension parameter to be described, As a function of the initial tension parameter in question, Is a first compensation coefficient, and ; Is the second compensation coefficient, and ; For the etching liquid compensation coefficient, the etching liquid compensation coefficient satisfies the following formula (3): Wherein, the Is a calibration coefficient, and C is the concentration of the etching liquid.
  6. 6. The method of claim 4, wherein comparing the critical dimension with a design dimension to determine an etching parameter, further comprises: and determining the initial tension parameter as the production tension parameter under the condition that the absolute difference between the critical dimension and the design dimension is smaller than or equal to the preset threshold value.
  7. 7. The method for manufacturing a metal mask plate according to claim 6, wherein the preset threshold value satisfies the following relationship: Wherein, the And the preset threshold value is set.
  8. 8. The method of claim 4, wherein the length direction of the test metal substrate is the x-axis direction, the width direction of the test metal substrate is the y-axis direction, and the critical dimension satisfies the formula (4): Wherein, the For the critical dimensions of the etched holes, For the diameter of the opening of the etching hole in the x-axis direction, For the diameter of the etched hole in the y-axis direction, a is a first coefficient, b is a second coefficient, the value of a is larger than that of b, and the sum of a and b is 1.
  9. 9. The method for manufacturing a metal mask plate according to claim 8, wherein the value range of a is 0.6-0.8, and the value range of b is 0.2-0.4.
  10. 10. A metal mask plate manufactured by the manufacturing method according to any one of claims 1 to 9.

Description

Manufacturing method of metal mask plate and metal mask plate Technical Field The invention relates to the technical field of metal material preparation, in particular to a manufacturing method of a metal mask plate and the metal mask plate. Background At present, in the manufacturing process of the FMM roll-to-roll technology (FINE METAL MASK, fine metal mask plate), the problem of critical dimension deviation of etching holes easily occurs in the etching technology, so that the treatment effect of the subsequent critical process links is affected, and finally, the quality defect of the terminal product is caused. Disclosure of Invention The present invention aims to solve one of the technical problems in the related art to a certain extent. Therefore, the invention provides a manufacturing method of a metal mask plate and the metal mask plate. In order to achieve the above object, a first aspect of the present invention provides a method for manufacturing a metal mask, including the following steps: Etching the test strip with the initial tension by using etching liquid to form a plurality of etching holes, wherein the test strip comprises a test metal substrate and a test mask pattern layer formed on the test metal substrate, the test mask pattern layer comprises a plurality of through holes, and the through holes are in one-to-one correspondence with the etching holes; Detecting the critical dimension of an etching hole formed on the test metal substrate; Comparing the critical dimension with a design dimension, and determining an etching parameter, wherein the etching parameter is related to the production tension applied by the production strip; And etching the production strip according to the etching parameters. Optionally, the test strip is arranged between an unreeling mechanism and a reeling mechanism, a liquid pool for storing the etching liquid is arranged between the unreeling mechanism and the reeling mechanism, at least one tension adjusting roller is respectively arranged between the liquid pool and the unreeling mechanism and between the liquid pool and the reeling mechanism, and the test strip passes through the liquid pool and each tension adjusting roller; The etching parameters comprise production tension parameters for the unreeling mechanism, the reeling mechanism and the tension adjusting rollers, wherein in the step of etching the production strip according to the etching parameters, the production strip is arranged between the unreeling mechanism and the reeling mechanism, and passes through the liquid pool and the tension adjusting rollers. Optionally, in the step of configuring initial tension parameters for the unreeling mechanism, the reeling mechanism and the tension adjusting rollers, the initial tension parameters of the unreeling mechanism are configured to be 30-60 n, the initial tension parameters of the tension adjusting rollers are configured to be 40-80 n, and the initial tension parameters of the reeling mechanism are configured to be 20-50 n. Optionally, the comparing the critical dimension with the design dimension to determine the etching parameter includes: And compensating the initial tension parameter under the condition that the absolute difference between the critical dimension and the design dimension is larger than a preset threshold value, so as to obtain the corrected production tension parameter. Optionally, the compensating the initial tension parameter when the absolute difference between the critical dimension and the design dimension is greater than a preset threshold includes: in the case where the critical dimension is smaller than the design dimension, the production tension parameter satisfies the formula (1): In the case where the critical dimension is greater than the design dimension, the production tension parameter satisfies equation (2): Wherein, the For the production tension parameter to be described,As a function of the initial tension parameter in question,Is a first compensation coefficient, and;Is the second compensation coefficient, and; For the etching liquid compensation coefficient, the etching liquid compensation coefficient satisfies the following formula (3): Wherein, the Is a calibration coefficient, andC is the concentration of the etching liquid. Optionally, the comparing the critical dimension with the design dimension to determine the etching parameter further includes: and determining the initial tension parameter as the production tension parameter under the condition that the absolute difference between the critical dimension and the design dimension is smaller than or equal to the preset threshold value. Optionally, the preset threshold satisfies the following relationship: Wherein, the And the preset threshold value is set. Optionally, the length direction of the test metal substrate is taken as the x-axis direction, the width direction of the test metal substrate is taken as the y-axis direction, and in the step o