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CN-121992468-A - Preparation method of transfer printing mold, imprinting mold, cover plate, preparation method and terminal

CN121992468ACN 121992468 ACN121992468 ACN 121992468ACN-121992468-A

Abstract

The application provides a preparation method of a transfer printing mold, an imprinting mold, a cover plate, a preparation method and a terminal. The preparation method of the transfer printing mold comprises the steps of providing a metal plate, performing first anodic oxidation on the metal plate to enable the surface of the metal plate to form a porous structure, performing chemical etching on the metal plate to remove the porous structure to enable the surface of the metal plate to form a plurality of nanometer pits which are distributed at intervals, performing second anodic oxidation on the metal plate to perform pore forming, and reaming the metal plate to obtain the transfer printing mold, wherein the transfer printing mold comprises a plurality of first concave portions which are distributed on the surface of the transfer printing mold at intervals, and the distribution period d1 of the plurality of first concave portions is in the range of d 1-200 nm. The transfer printing mold prepared by the preparation method of the transfer printing mold can be used for preparing the cover plate, and the prepared cover plate has higher light transmittance and lower light reflectance.

Inventors

  • WU ZHONGZHENG
  • CHEN SONG
  • Yun Tinghe
  • CHEN SHIFENG

Assignees

  • OPPO广东移动通信有限公司

Dates

Publication Date
20260508
Application Date
20241107

Claims (19)

  1. 1. A method of making a transfer mold, the method comprising: Providing a metal plate; Performing first anodic oxidation on the metal plate to form a porous structure on the surface of the metal plate; carrying out chemical etching on the metal plate to remove the porous structure, so that a plurality of nanometer pits which are distributed at intervals are formed on the surface of the metal plate; Performing a second anodic oxidation on the metal plate to perform pore-forming, and Reaming the metal plate to obtain a transfer printing die, wherein the transfer printing die comprises a plurality of first concave parts which are distributed on the surface of the transfer printing die at intervals, and the distribution period d1 of the plurality of first concave parts is in the range of d1 to be less than or equal to 200nm.
  2. 2. The method of manufacturing a transfer mold according to claim 1, wherein the providing a metal plate includes: and carrying out electrochemical polishing on the metal plate so as to enable the surface roughness of the metal plate to be less than or equal to 5nm.
  3. 3. The method of manufacturing a transfer mold according to claim 1, wherein the first anodic oxidation of the metal plate to form a porous structure on the surface of the metal plate comprises: And carrying out first anodic oxidation on the metal plate in a first electrolyte so as to form a porous structure on the surface of the metal plate, wherein the first electrolyte comprises 0.015mol/L to 0.05mol/L sulfuric acid, 0.1mol/L to 0.5mol/L oxalic acid and 0.1g/L to 1g/L aluminum sulfate.
  4. 4. The method of manufacturing a transfer mold according to claim 3, wherein the first anodizing the metal plate in the first electrolyte to form a porous structure on the surface of the metal plate comprises: immersing the metal plate in a first electrolyte, wherein the first temperature T1 of the first electrolyte is in the range of-3 ℃ to-T1 to-3 ℃, and And under the condition that the first voltage U1 is 60V or more and U1 or less than 120V, performing first anodic oxidation to form a porous structure on the surface of the metal plate.
  5. 5. The method of manufacturing a transfer mold according to claim 1, wherein the metal plate is chemically etched to remove the porous structure, a plurality of nano pits formed on a surface of the metal plate, comprising: Immersing the metal plate in a first etching solution to perform chemical etching so as to remove the porous structure, so that a plurality of nano pits are formed on the surface of the metal plate, wherein the first etching solution comprises 4-10% of phosphoric acid, 1-3% of chromic acid and 3-5% of nitric acid by mass fraction.
  6. 6. The method for preparing a transfer printing mold according to claim 5, wherein the arrangement period n of the nano pits is in the range of n≤200 nm, the width w of the nano pits is in the range of 10 nm≤w≤50 nm, and the depth h of the nano pits is in the range of 10 nm≤h≤50 nm.
  7. 7. The method of manufacturing a transfer mold according to claim 5, wherein immersing the metal plate in a first etching solution to perform chemical etching to remove the porous structure, a plurality of nano-pits formed on a surface of the metal plate, comprises: immersing the metal plate in a first etching solution, and performing chemical etching at a second temperature T2 of 50 ℃ to less than or equal to T2 of less than or equal to 80 ℃ to remove the porous structure, so that a plurality of nano pits are formed on the surface of the metal plate.
  8. 8. The method of manufacturing a transfer mold according to claim 1, wherein the performing the second anodic oxidation on the metal plate comprises: And (3) carrying out second anodic oxidation on the metal plate in a second electrolyte, wherein the second electrolyte comprises 0.01 to 0.05mol/L sulfuric acid, 0.2 to 0.5mol/L phosphoric acid and 0.1 to 1g/L aluminum sulfate.
  9. 9. The method of manufacturing a transfer mold according to claim 8, wherein the second anodizing the metal plate in the second electrolyte comprises: Immersing the metal plate in a second electrolyte, wherein a third temperature T3 of the second electrolyte is in a range of 16 ℃ to less than or equal to T3 to less than or equal to 24 ℃, and And performing second anodic oxidation under the condition that the second voltage U2 is 60V or more and U2 or less than 100V.
  10. 10. The method of manufacturing a transfer mold according to claim 1, wherein reaming the metal plate comprises: the metal plate is immersed in a second etching solution for reaming, wherein the second etching solution comprises 0.4mol/L to 0.8mol/L phosphoric acid and 0.1mol/L to 0.5mol/L nitric acid.
  11. 11. The method of manufacturing a transfer mold according to claim 10, wherein immersing the metal plate in a second etching liquid for reaming comprises: immersing the metal plate into the second etching solution, and reaming at the fourth temperature T4 of 60 ℃ to 80 ℃.
  12. 12. The method of manufacturing a transfer mold according to claim 1, wherein the second anodic oxidation is performed on the metal plate and the reaming is performed on the metal plate alternately a plurality of times.
  13. 13. The method according to any one of claims 1 to 12, wherein the width of the first concave portion is in a range of 40 nm≤a1≤200nm, and the depth h1 of the first concave portion is in a range of 100 nm≤h1≤500nm.
  14. 14. The imprinting mold is characterized in that the imprinting mold is prepared by adopting the transfer mold prepared by the preparation method of the transfer mold according to any one of claims 1-13 through twice transfer printing, wherein the imprinting mold comprises a plurality of second concave parts which are arranged on the surface of the imprinting mold at intervals, the first concave parts and the second concave parts have the same structure, the arrangement period d2 of the second concave parts is less than or equal to 200nm, the width a2 of the second concave parts is less than or equal to 40nm and less than or equal to 200nm, and the depth h2 of the second concave parts is less than or equal to 100nm and less than or equal to 500nm.
  15. 15. A method of making a cover sheet, the method comprising: Providing a substrate; forming a photoresist layer on the surface of the substrate; imprinting a texture on a surface of the photoresist layer using the imprint template of claim 14, wherein the texture is complementary to a structure of the second plurality of recesses of the imprint template, and And performing dry etching to obtain a cover plate, wherein the cover plate comprises a plurality of protruding parts which are arranged on the surface of the cover plate at intervals, the arrangement period d3 of the protruding parts is in the range of d 3-200 nm, and the protruding parts are complementary with the structures of the second concave parts of the stamping die.
  16. 16. A cover plate is characterized by comprising a plurality of protruding parts which are arranged on the surface of the cover plate at intervals, wherein the arrangement period d3 of the protruding parts is in the range of d 3-200 nm.
  17. 17. The cover plate of claim 16, wherein the width a3 of the protrusion ranges from 40nm to 200nm.
  18. 18. The cover plate according to claim 16 or 17, wherein the height h3 of the protrusions ranges from 100nm to 500nm.
  19. 19. A terminal, comprising: The display screen is provided with a display surface; The cover sheet according to any one of claims 16 to 18, which is laminated to the display surface of the display panel for protecting the display panel, and And the processor is electrically connected with the display screen and used for controlling the display screen to display.

Description

Preparation method of transfer printing mold, imprinting mold, cover plate, preparation method and terminal Technical Field The application relates to the field of electronics, in particular to a preparation method of a transfer printing die, an imprinting die, a cover plate, a preparation method and a terminal. Background In order to improve the service life of a display screen of a terminal such as a mobile phone, a protective cover plate is generally arranged on a display surface of the display screen of the terminal so as to improve the performances of impact resistance, drop resistance and the like of the display screen. However, the existing protective cover plate has high reflectivity and insufficient transmissivity, and influences the display effect of the terminal. Disclosure of Invention The embodiment of the application provides a preparation method of a transfer printing mold, the prepared transfer printing mold can be used for preparing a cover plate, and the prepared cover plate has higher light transmittance and lower light reflectance. In a first aspect, an embodiment of the present application provides a method for preparing a transfer mold, the method comprising: Providing a metal plate; Performing first anodic oxidation on the metal plate to form a porous structure on the surface of the metal plate; carrying out chemical etching on the metal plate to remove the porous structure, so that a plurality of nanometer pits which are distributed at intervals are formed on the surface of the metal plate; Performing a second anodic oxidation on the metal plate to perform pore-forming, and Reaming the metal plate to obtain a transfer printing die, wherein the transfer printing die comprises a plurality of first concave parts which are distributed on the surface of the transfer printing die at intervals, and the distribution period d1 of the plurality of first concave parts is in the range of d1 to be less than or equal to 200nm. In a second aspect, an embodiment of the present application further provides an imprint mold, where the imprint mold is made by performing twice transfer printing on the transfer mold made by using the method for making a transfer mold according to the embodiment of the first aspect of the present application, where the imprint mold includes a plurality of second concave portions arranged on a surface of the imprint mold at intervals, the plurality of first concave portions and the plurality of second concave portions have a structure identical to each other, an arrangement period d2 of the plurality of second concave portions is equal to or less than 200nm, a width a2 of the second concave portions is equal to or less than 40nm and equal to or less than 200nm, and a depth h2 of the second concave portions is equal to or less than 100nm and equal to or less than 500nm. In a third aspect, an embodiment of the present application further provides a method for preparing a cover plate, where the method includes: Providing a substrate; forming a photoresist layer on the surface of the substrate; Imprinting a texture structure on a surface of the photoresist layer using an imprint mold of the second aspect of the present application, wherein the texture structure is complementary to a structure of the plurality of second recesses of the imprint mold, and And performing dry etching to obtain a cover plate, wherein the cover plate comprises a plurality of protruding parts which are arranged on the surface of the cover plate at intervals, the arrangement period d3 of the protruding parts is in the range of d 3-200 nm, and the protruding parts are complementary with the structures of the second concave parts of the stamping die. In a fourth aspect, the embodiment of the application also provides a cover plate, which comprises a plurality of protruding parts which are arranged on the surface of the cover plate at intervals, wherein the arrangement period d3 of the protruding parts is in the range of d 3-200 nm. In a fifth aspect, an embodiment of the present application further provides a terminal, including: The display screen is provided with a display surface; According to a fourth aspect of the present application, a cover sheet is provided on the display surface of the display panel in a stacked manner for protecting the display panel, and And the processor is electrically connected with the display screen and used for controlling the display screen to display. The preparation method of the transfer printing mold is characterized in that the transfer printing mold is prepared by sequentially carrying out the process steps of first anodic oxidation, chemical etching, second anodic oxidation, reaming and the like on the metal plate, and the preparation method is not only suitable for preparing the transfer printing mold with small size, but also suitable for preparing the transfer printing mold with large size (for example, the size is larger than 8 inches), and in addition, the pr