CN-121992660-A - Self-repairing non-woven fabric polishing pad and preparation method thereof

Abstract

The application relates to the field of polishing materials, in particular to a self-repairing non-woven fabric polishing pad and a preparation method thereof. The self-repairing non-woven fabric polishing pad is prepared by impregnating non-woven fabric with composite glue solution, wherein the composite glue solution is prepared from, by weight, 10-20% of aqueous polyurethane emulsion, 8-15% of aqueous organosilicon modified polyurethane emulsion, 5-10% of methyl acrylate/2-ethylhexyl acrylate copolymer resin emulsion, 5-10% of abrasive, 4-6% of repairing agent, 3-6% of emulsifying dispersant, 0.2-0.4% of curing agent and the balance of water. The self-repairing non-woven fabric polishing pad prepared by the application has good flexibility, rebound resilience and scratch self-repairing property, has good flatness when used under a long-term polishing condition, is not easy to wear and scratch, and is suitable for polishing high-precision parts.

Inventors

• GONG TING
• LIU CHAOYANG
• JIN QIANQIAN

Assignees

• 东莞励治研磨科技有限公司

Dates

Publication Date

20260508

Application Date

20260227

Claims (10)

1. 1. The self-repairing non-woven fabric polishing pad is characterized by being prepared by impregnating non-woven fabric with a composite glue solution, wherein the composite glue solution is prepared from the following raw materials in parts by weight: 10-20% of aqueous polyurethane emulsion 8-15% Of aqueous organosilicon modified polyurethane emulsion Methyl acrylate/2-ethylhexyl acrylate copolymer resin emulsion 5-10% 5 To 10 percent of abrasive material 4-6% Of repairing agent 3 To 6 percent of emulsifying dispersant Curing agent 0.2-0.4% The balance of water.
2. 2. The self-healing non-woven polishing pad according to claim 1, wherein the healer consists of (2-4) maleic modified castor oil and hydroxyl-terminated polydimethylsiloxane in a weight ratio of 1.
3. 3. The self-repairing non-woven polishing pad according to claim 1, wherein the emulsifying dispersant comprises polyglycerol-2 dimer hydroxystearate and sodium polyacrylate in a weight ratio of 1 (0.5-1.5).
4. 4. The self-repairing nonwoven fabric polishing pad according to claim 1, wherein the curing agent is composed of an isocyanate-based curing agent and an aziridine crosslinking agent in a weight ratio of (1-2): 1.
5. 5. The self-healing nonwoven polishing pad according to claim 1, wherein the nonwoven is a needled polyester nonwoven having a grammage of 180-200 g/m 2 .
6. 6. A method of making a self-healing nonwoven polishing pad according to any one of claims 1-5, comprising the steps of: S1, soaking non-woven fabrics in water, and draining; S2, dipping the drained non-woven fabric into the composite glue solution, rolling, and drying to obtain dipped non-woven fabric; s3, soaking the impregnated non-woven fabric in warm water; S4, performing heat setting, sanding, water washing and drying on the soaked impregnated non-woven fabric to obtain the self-repairing non-woven fabric polishing pad.
7. 7. The method for preparing a self-repairing non-woven polishing pad according to claim 6, wherein the soaking temperature in the step S1 is 40-60 ℃ and the soaking time is 5-15min.
8. 8. The method for preparing a self-repairing nonwoven fabric polishing pad according to claim 6, wherein the dipping temperature in the step S2 is 50-60 ℃ and the dipping time is 20-40min.
9. 9. The method for preparing a self-repairing non-woven polishing pad as claimed in claim 6, wherein the soaking temperature in the step S3 is 80-90 ℃ and the soaking time is 10-20min.
10. 10. The method of claim 6, wherein the heat setting temperature in the step S4 is 100-120 ℃.

Description

Self-repairing non-woven fabric polishing pad and preparation method thereof Technical Field The application relates to the field of polishing materials, in particular to a self-repairing non-woven fabric polishing pad and a preparation method thereof. Background The non-woven fabric polishing pad is used as a novel polishing material, compared with the traditional polyurethane polishing pad and flannelette polishing pad, the non-woven fabric polishing pad has the characteristic of controllable porous structure, and three-dimensional netlike fiber gaps formed inside can effectively contain polishing liquid, so that uniform permeation and circulation of the polishing liquid are realized, local overhigh temperature in the polishing process is avoided, meanwhile, the surface of a workpiece can be better attached, the generation of polishing scratches is reduced, the flatness and the smoothness of the surface of the workpiece after polishing are obviously improved, the severe requirements on surface quality in high-precision manufacturing are met, and the non-woven fabric polishing pad is widely applied to the high-precision manufacturing fields such as semiconductor wafer processing, optical glass polishing, surface treatment of precise metal parts and the like. At present, the existing non-woven fabric polishing pad is mainly prepared by a needling method, polymer short fibers are carded into a net to form a fiber net, the fiber net is repeatedly penetrated through needles of a needling machine to enable the fibers to be intertwined with each other, a non-woven fabric matrix with certain thickness and mechanical strength is formed, then, a binder (such as epoxy resin and phenolic resin) is coated on the surface of the non-woven fabric matrix or is permeated into fiber gaps in a dipping, spraying and other modes, and the structural stability and the wear resistance of the non-woven fabric matrix are enhanced after heating and solidification. The preparation method has the advantages of high production efficiency, controllable cost and good product consistency, and can realize the large-scale production of the non-woven fabric polishing pads with different thicknesses and different densities. However, in the polishing process, the surface of the non-woven fabric polishing pad is continuously subjected to the friction shearing force of polishing particles and a workpiece, the local pressure of a polishing head and the scraping effect of hard impurities (such as metal chips and quartz particles) possibly existing on the surface of the workpiece, so that the problems of mechanical abrasion of non-woven fabric fibers, surface fiber breakage and falling off are caused, irregular pits are formed, the flatness of the surface of the polishing pad is damaged, local scratches are formed on the surface of the polishing pad by the hard impurities, local retention or loss of polishing liquid occurs in the circulation process of the polishing pad due to the scratches, uneven distribution of polishing particles is caused, structural deformation is caused, the porous structure of the non-woven fabric is irreversibly compressed due to the local pressure concentration in the long-term polishing process, and the elasticity of the non-woven fabric is reduced, so that the polishing pressure cannot be uniformly transmitted. Therefore, in the long-term polishing process, the polishing pad needs to be replaced frequently, so that the production cost is increased, and the production efficiency is reduced due to the downtime in the replacement process. Disclosure of Invention The application provides a self-repairing non-woven fabric polishing pad and a preparation method thereof, and aims to solve the problem that the surface of the existing non-woven fabric polishing pad is easy to generate local unevenness, abrasion and scratch in the long-term polishing process, so that the polishing efficiency is reduced. In a first aspect, the present application provides a self-repairing nonwoven polishing pad, which adopts the following technical scheme: the self-repairing non-woven fabric polishing pad is prepared by impregnating non-woven fabric with a composite glue solution, wherein the composite glue solution is prepared from the following raw materials in parts by weight: 10-20% of aqueous polyurethane emulsion 8-15% Of aqueous organosilicon modified polyurethane emulsion Methyl acrylate/2-ethylhexyl acrylate copolymer resin emulsion 5-10% 5 To 10 percent of abrasive material 4-6% Of repairing agent 3 To 6 percent of emulsifying dispersant Curing agent 0.2-0.4% The balance of water. By adopting the technical scheme, the aqueous polyurethane emulsion, the aqueous organosilicon modified polyurethane emulsion and the methyl acrylate/2-ethylhexyl acrylate copolymer resin emulsion are used as main resin emulsion raw materials of the composite glue solution, the aqueous polyurethane emulsion has good elasticity and water resistance, the aqueous