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CN-121993623-A - Valve plate structure of transmission valve

CN121993623ACN 121993623 ACN121993623 ACN 121993623ACN-121993623-A

Abstract

The application provides a valve plate structure of a transmission valve, which relates to the technical field of semiconductor equipment and comprises a valve plate, a compression piece, a sealing piece and a heating component, wherein the valve plate is provided with a connecting surface, the compression piece is connected with the connecting surface, the heating component is detachably connected with the compression piece and is in contact with the connecting surface, a first wire in the heating component penetrates through the compression piece, and the sealing piece is arranged at the joint of the heating component and the compression piece and is used for sealing the first wire in the compression piece. According to the application, on one hand, the heating efficiency and the temperature uniformity of the valve plate are ensured, on the other hand, the reliability of electric connection is ensured, the influence on the vacuum sealing performance or the generation of particle pollution caused by the exposure of the lead is also prevented, and meanwhile, the valve plate is very convenient to detach and replace by plug-in lead connection, and the maintenance reliability is improved.

Inventors

  • ZHOU QIZHENG

Assignees

  • 上海汇芯拓半导体技术有限公司

Dates

Publication Date
20260508
Application Date
20260313

Claims (10)

  1. 1. The valve plate structure of the transmission valve is characterized by comprising a valve plate, a pressing piece, a sealing piece and a heating component; the valve plate is provided with a connecting surface; The pressing piece is connected with the connecting surface; The heating component is detachably connected with the pressing piece and is in contact with the connecting surface, and a first wire in the heating component penetrates through the pressing piece; The sealing piece is arranged at the joint of the heating component and the pressing piece and is used for sealing the first lead in the pressing piece.
  2. 2. The valve plate structure of a transfer valve according to claim 1, wherein the heating assembly includes a fixture and a heating element disposed inside the fixture; the fixing piece is detachably connected with the pressing piece and is contacted with the connecting surface; The heating element is arranged at one side of the inner part of the fixing piece, which is close to the valve plate; the first lead is electrically connected with the heating element, and one end of the first lead penetrates out of the fixing piece and penetrates into the pressing piece; The sealing element is positioned at the joint of the fixing element and the pressing element.
  3. 3. The valve plate structure of claim 2, wherein a plurality of heating elements are provided, the heating elements are distributed in a spaced array along a length direction and a width direction of the fixing member, and a center distance between two adjacent heating elements is equal.
  4. 4. The valve plate structure of the transmission valve according to claim 3, wherein a plurality of embedded cavities are formed in the fixing piece, the embedded cavities are distributed at intervals along the length direction and the width direction of the fixing piece, and each embedded cavity is correspondingly provided with one heating element; The embedded cavity is of a blind hole structure, and extends from one side close to the valve plate to one side far away from the valve plate along the thickness direction of the fixing piece.
  5. 5. The valve plate structure of a transfer valve according to claim 4, wherein the fixing member includes a heat insulating layer and a heat diffusion layer stacked in a thickness direction; The heat preservation layer is provided with the embedded cavity; the thermal diffusion layer covers the embedded cavity and is in contact with the connecting surface.
  6. 6. The valve plate structure of the transmission valve according to claim 4, wherein a wire passage communicated with the outside is provided in the fixing member, the wire passage is communicated with the embedded cavity, an outlet end of the wire passage is provided with a first connection terminal, and the first connection terminal is detachably connected with the pressing member; the first lead is led out from the embedded cavity, penetrates into the lead channel and is electrically connected with the first connecting terminal; The seal is provided on the connection terminal to seal the wire passage.
  7. 7. The valve plate structure of a transfer valve according to claim 6, wherein a lateral passage along a length direction of the pressing member and a longitudinal passage communicating with the lateral passage are formed inside the pressing member; The two ends of the transverse channel are respectively provided with a first electric interface, the outlet of the longitudinal channel is provided with a second electric interface, and the second electric interface is correspondingly and electrically connected with the first electric interface through a second lead; The first connection terminal is inserted into the transverse channel and electrically connected with the first electrical interface.
  8. 8. The valve plate structure of a transfer valve according to claim 7, further comprising a driving shaft connected to the pressing member and driving the pressing member to open and close the valve plate; A second wiring terminal is arranged at the top of the driving shaft, penetrates into the longitudinal channel and is electrically connected with the second electric interface; the inside of drive shaft is equipped with along the cavity power supply channel of axial extension, the power supply channel is used for through outside power supply wire with second binding post electricity is connected.
  9. 9. The valve plate structure of a transmission valve according to claim 8, wherein there are two of said longitudinal passages, and two of said longitudinal passages are symmetrically provided on both sides of said drive shaft; The top of the driving shaft is provided with a connecting column and wiring channels positioned at two sides of the connecting column; The connecting column is detachably connected with the pressing piece; The wiring channel is communicated with the power supply channel and is inserted into the longitudinal channel; the two second wiring terminals are respectively arranged on the outlets of the two wiring channels; The power supply wire passes through the wiring channel and is electrically connected with the second wiring terminal.
  10. 10. The valve plate structure of a transfer valve according to claim 1, wherein the pressing member is connected to the valve plate through at least two rigid connection portions uniformly provided along a length direction of the valve plate; And a space is kept between the rest part of the pressing assembly and the valve plate except the rigid connection part.

Description

Valve plate structure of transmission valve Technical Field The invention relates to the technical field of semiconductor equipment, in particular to a valve plate structure of a transmission valve. Background In semiconductor manufacturing equipment, transfer valves are typically placed between different vacuum chambers to effect isolation between the chambers and transfer of wafers between the chambers. The transfer valve generally includes a valve plate movable between open and closed conditions, with a rubber seal disposed on a sealing surface of the valve plate for achieving a high vacuum seal in the closed condition. When the transfer valve is directly connected to the process reaction chamber, the valve plate directly contacts the process gas and its reaction byproducts during operation. Because the process gas often contains components easy to deposit, condensation or deposition is easy to occur when the temperature of the surface of the valve plate is low, and then attachments are formed on the surface of the valve plate. These attachments may fall off during the valve opening or closing process, thereby causing particle contamination in the cavity and affecting the yield of the semiconductor device. To reduce the deposition phenomenon, the valve plate temperature is usually maintained above a certain temperature by increasing the valve plate temperature so as to inhibit deposition of reaction byproducts on the surface of the valve plate. However, in the prior art, the valve body of the transmission valve is integrally heated, so that heat is indirectly transmitted to the valve plate through the structural member. However, due to the long heat conduction path, the valve plate temperature is difficult to raise to a high temperature, the temperature distribution is uneven, and the power supply wires of the heater are usually exposed to a vacuum environment, so that the vacuum sealing is easily hindered, and the risk of particle pollution is caused. Disclosure of Invention The application aims to solve the technical problem of providing a valve plate structure and a system which can avoid the problem that the temperature of a valve plate is difficult to rise to a higher temperature due to long heat conduction path and can overcome the risk of particle pollution. The technical scheme adopted for solving the technical problems is as follows: The application provides a valve plate structure of a transmission valve, which comprises a valve plate, a pressing piece, a sealing piece and a heating component, wherein the valve plate is provided with a connecting surface, the pressing piece is connected with the connecting surface, the heating component is detachably connected with the pressing piece and is contacted with the connecting surface, a first wire in the heating component penetrates through the pressing piece, and the sealing piece is arranged at the joint of the heating component and the pressing piece and is used for sealing the first wire in the pressing piece. The heating assembly comprises a fixing piece and a heating element arranged in the fixing piece, wherein the fixing piece is detachably connected with the pressing piece and is in contact with the connecting surface, the heating element is arranged on one side, close to the valve plate, in the fixing piece, the first conducting wire is electrically connected with the heating element, one end of the first conducting wire penetrates out of the fixing piece and penetrates into the pressing piece, and the sealing piece is located at the joint of the fixing piece and the pressing piece. Optionally, the heating elements are multiple, the heating elements are distributed in an array at intervals along the length direction and the width direction of the fixing piece, and the center distances between two adjacent heating elements are equal. Optionally, a plurality of embedded cavities are formed in the fixing piece, the embedded cavities are distributed at intervals along the length direction and the width direction of the fixing piece, each embedded cavity is correspondingly provided with one heating element, the embedded cavities are of blind hole structures, and the embedded cavities extend from one side close to the valve plate to one side far away from the valve plate along the thickness direction of the fixing piece. Optionally, the fixing piece comprises a heat insulation layer and a heat diffusion layer which are stacked along the thickness direction, the heat insulation layer is provided with the embedded cavity, and the heat diffusion layer covers the embedded cavity and is in contact with the connecting surface. Optionally, a wire channel communicated with the outside is arranged in the fixing piece, the wire channel is communicated with the embedded cavity, a first connecting terminal is arranged at the outlet end of the wire channel and detachably connected with the pressing piece, the first wire is led out from the embedded cavity, pe