Search

CN-121993920-A - Peltier effect-based solid-state thermoelectric heat pump heating device and method

CN121993920ACN 121993920 ACN121993920 ACN 121993920ACN-121993920-A

Abstract

The invention relates to a solid-state thermoelectric heat pump heating device and method based on Peltier effect, belonging to the technical field of thermoelectric devices and temperature control. The device comprises a thermoelectric module, a hot end heat exchange structure, a cold end heat dissipation structure and a power supply control module. And the heat pump heating with total heat supply larger than input electric energy is realized by leading a preset current into the thermoelectric module to enable the hot end to generate heat supply formed by superposition of joule heat and peltier effect and simultaneously enabling the cold end to absorb low-grade heat from the environment. According to the invention, the heating stability and the energy utilization rate are improved by optimizing the hot end heat conduction path and the cold end heat dissipation efficiency, and the current can be adjusted according to the target load so as to obtain a higher heating coefficient. Compared with the traditional resistance heating, the invention has the advantages of simple structure, quick response, no mechanical parts, no working medium leakage risk, low energy consumption and the like, is suitable for various scenes such as instant heating, water heating, local temperature control, wearable heating and the like, and has good engineering application prospect.

Inventors

  • LI WEN
  • PEI YANZHONG
  • SHEN XINYI

Assignees

  • 同济大学

Dates

Publication Date
20260508
Application Date
20260309

Claims (10)

  1. 1. A peltier effect based solid-state thermoelectric heat pump heating apparatus, the apparatus comprising: The thermoelectric module comprises a hot end and a cold end which are oppositely arranged, and is made of thermoelectric materials, is of a single-stage or multi-stage structure and is used as an energy conversion core, wherein the thermoelectric materials comprise P-type thermoelectric materials and N-type thermoelectric materials which are connected by metal guide plates; One end of the hot end heat exchange structure is attached to the hot end, and the other end of the hot end heat exchange structure is used for transferring heat to an object to be heated, and the hot end heat exchange structure directly or indirectly contacts with the object to be heated when transferring heat; one end of the cold end radiating structure is attached to the cold end, the other end of the cold end radiating structure is used for exchanging heat with the external environment, absorbing low-grade heat from the environment and transmitting the low-grade heat into the thermoelectric module, and the heat exchanging mode comprises a direct heat exchanging mode and an indirect heat exchanging mode; the power supply control module is directly and electrically connected with the thermoelectric module through a wire and is used for applying constant current or controllable current to the thermoelectric module; The temperature sensor is arranged on the hot end, the cold end or the target object, is connected with the power control module through a signal wire in an electric signal manner, and is used for measuring temperature in real time and feeding back a signal to the power control module to adjust current so as to ensure heating stability; After power is turned on and off, joule heat is generated in the thermoelectric module due to the joule effect, meanwhile, carrier migration from the cold end to the hot end is realized based on the peltier effect, ambient low-grade heat absorbed by the cold end is carried to the hot end, total heat supply output by the hot end is the sum of the joule heat in the thermoelectric module and the ambient heat absorbed by the cold end, and the heating effect of the solid-state heat pump with the heating performance coefficient larger than 1 is realized.
  2. 2. The solid state thermoelectric heat pump heating device based on peltier effect as set forth in claim 1 wherein the hot side heat exchange structure is indirectly in contact with the load using copper block, aluminum block or microchannel heat exchange plate.
  3. 3. The peltier effect based solid-state thermoelectric heat pump heating device of claim 1, wherein the cold-end heat dissipation structure comprises an air-cooled heat sink, a water-cooled heat sink, a liquid cooling plate, a heat pipe heat sink or a phase change heat dissipation structure when an indirect heat exchange form is adopted, and the cold-end heat dissipation structure is a natural environment interface when a direct heat exchange form is adopted, and the natural environment interface comprises natural air, water surface, water body or other environment mediums capable of being used as cold sources.
  4. 4. The peltier effect based solid state thermoelectric heat pump heating device of claim 1 wherein when the cold side heat sink structure takes the form of direct heat exchange, the heat exchange of the cold side to the environment is further enhanced by a fan, circulating coolant or heat sink fins.
  5. 5. The peltier effect based solid-state thermoelectric heat pump heating device of claim 1 wherein the thermoelectric module is a single or multi-stage module based on Bi 2 Te 3 , pbTe, snSe, metal thermoelectric material or other material with thermoelectric effect.
  6. 6. The peltier effect based solid-state thermoelectric heat pump heating apparatus of claim 1 wherein the hot side heat exchange structure includes a water cooled plate having internal flow channels to allow the flowing body of water to be heated immediately and then output as it flows through the water cooled plate.
  7. 7. A thermoelectric heat pump heating method based on a peltier effect based solid-state thermoelectric heat pump heating apparatus as set forth in any one of claims 1-6, said method comprising: The solid thermoelectric heat pump heating device is installed, the hot end of the thermoelectric module is attached to the hot end heat exchange structure, the cold end of the thermoelectric module is attached to the cold end heat dissipation structure, the temperature sensor is arranged at a preset monitoring position, the power supply control module is connected with the thermoelectric module, and the current parameter, the current mode and the target heating temperature are preset; Applying preset current to the thermoelectric module through the power control module to enable the hot end to generate heat supply obtained by superposition of the Peltier effect and the Joule effect; The cold end radiating structure is utilized to continuously transfer low-grade heat in the environment to the cold end of the thermoelectric module through heat exchange, so that the total heat supply quantity of the hot end is improved, and the total heat productivity obtained by the hot end is larger than the heat pump heating effect of input electric energy; Continuously acquiring real-time temperature of a preset monitoring position through the temperature sensor, converting a temperature signal into an electric signal, and transmitting the electric signal to the power supply control module in real time, wherein the power supply control module compares the acquired real-time temperature with a target heating temperature in real time, judges temperature deviation, and adjusts the output current and current mode according to the temperature deviation; And continuing heating until the heated object reaches the target temperature and stabilizes for a preset time, or stopping the power supply control module without continuing heating.
  8. 8. The method of claim 7, wherein the current mode of the power control module for adjusting the output according to the temperature deviation comprises a constant current mode, a constant voltage mode, a pulsed current mode, or a closed loop control mode based on temperature feedback.
  9. 9. The method of claim 8, wherein when the real-time temperature is lower than a target heating temperature, increasing current, increasing carrier transfer rate, increasing heat generation efficiency of pump heat and joule heat, and increasing heat supply quantity of a hot end, when the real-time temperature is higher than the target heating temperature, decreasing current, decreasing carrier transfer rate, and reducing heat supply quantity, and when the real-time temperature fluctuation is higher than a preset fluctuation threshold, switching to a closed-loop control current mode based on temperature feedback, and fine-tuning current in real time, so that the actual temperature is stabilized within a target temperature range.
  10. 10. The method of claim 7, further comprising thermally insulating the non-hot/cold side of the thermoelectric module.

Description

Peltier effect-based solid-state thermoelectric heat pump heating device and method Technical Field The invention relates to the technical field of thermoelectric conversion and thermal management, in particular to a solid-state thermoelectric heat pump heating device and method based on the Peltier effect. Background In recent decades, global energy demands continue to rise with population growth and economic development, especially in the heating and cooling fields, with energy consumption accounting for nearly 50% of the total consumption of terminal energy. Wherein, the heat supply process takes the dominant role in links such as resident life, industrial processing, equipment temperature control and the like. The conventional resistance heating has been widely used in various heating apparatuses for a long time due to its simple structure, low cost and easy implementation. However, resistive heating relies on the joule effect, and its energy utilization efficiency is limited by the first law of thermodynamics, and the input electrical energy can only be converted to thermal energy in equal amounts, with a heating coefficient of performance (COPheating) always less than 1.0. On the other hand, global power structures still dominate fossil energy generation. From the viewpoint of the whole life cycle of energy, the resistance heating is usually only 30% -40% in the aspect of primary energy utilization efficiency, which not only causes energy waste, but also causes a large amount of carbon emission. Along with the promotion of the 'double carbon' target, the improvement of heating efficiency and the reduction of carbon emission become important directions of energy technology development. Heat pump heating is considered an important technical approach to break through the traditional heating efficiency limitations because it is able to extract low grade heat from the environment and raise it to a usable temperature level. The traditional vapor compression heat pump realizes heat transfer by using refrigerant circulation, has the advantages of high energy efficiency, capacity of simultaneously realizing heat supply and refrigeration, and the like, but has complex system, large volume, dependence on a compressor and a refrigerant, noise, frequent maintenance, potential environmental pollution and the like. The thermoelectric technology is based on the Peltier effect, when current passes through semiconductor junctions formed by different materials, controllable temperature difference can be formed at two ends of the device, and active extraction and release of heat are realized, so that a solid-state heat pump mechanism is formed. The thermoelectric module has the characteristics of compact structure, no mechanical parts, no refrigerant, accurate temperature control, quick response, high reliability and the like. At present, thermoelectric technology is used in refrigeration, electronic device temperature control, precision temperature control and other applications. However, in the prior art, the heating function of the thermoelectric module is not sufficiently studied. The hot end of the heat pump not only can generate heat through Joule heat, but also can absorb additional low-grade heat from the environment through the cold end, so that the total heat generated by the hot end is greater than the input of electric energy, and the heating effect of the heat pump with the heating performance coefficient greater than 1.0 is realized. Although this principle is clear, the refrigeration performance evaluation of thermoelectric modules is focused in the prior literature, so that the research on the thermoelectric modules as solid-state heat pumps for efficient heating is less, and the system design of a hot-end heat exchange structure, a cold-end heat dissipation structure, a current control strategy and a heating effect optimization mode is lacked. In addition, when the traditional thermoelectric module is used as a heating device, the problems of non-uniform energy efficiency evaluation method, insufficient coupling efficiency of a heating structure, limited heat pump effect due to cold-end heat dissipation and the like exist, so that the traditional thermoelectric module is difficult to fully utilize in the heating field. Therefore, it is necessary to provide a solid-state thermoelectric heat pump heating method based on peltier effect, by reasonably designing a hot end structure, a cold end heat dissipation path and a current control mode, stable and efficient heating is realized under the condition of simple structure, the energy utilization rate of the system is improved, the thermodynamic efficiency limit of traditional resistance heating is broken through, and the requirements of instant heating, local temperature control and miniaturized equipment are met. Disclosure of Invention The invention aims to overcome the defects of the prior art and provide a solid-state thermoelectric heat pump heating devi