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CN-121994050-A - Three-dimensional temperature equalizing plate with isolated gap structure

CN121994050ACN 121994050 ACN121994050 ACN 121994050ACN-121994050-A

Abstract

The invention discloses a three-dimensional temperature equalizing plate with an isolated gap structure, which comprises a bottom temperature equalizing plate, a vertical temperature equalizing unit and a vertical temperature equalizing unit, wherein the bottom temperature equalizing plate is provided with a bottom plate and a top plate, the top plate is provided with a vertical wall extending up and down, the bottom of a shell is provided with a vertical section extending downwards, a gap is formed between the vertical wall and the vertical section, the vertical section and the vertical wall are in at least partial tight fit relation, a plurality of fused parts which are solidified after fusion are formed by welding without welding, the fused parts are positioned at the bottom of the gap, and at least one of the tight fit relation and the fused parts isolates the top capillary material from the outside in a capillary phenomenon.

Inventors

  • LAI YAOHUI

Assignees

  • 赖耀惠

Dates

Publication Date
20260508
Application Date
20250819
Priority Date
20241106

Claims (8)

  1. 1. A three-dimensional temperature equalizing plate with an isolated gap structure comprises: The bottom temperature equalizing plate is provided with a bottom plate and a top plate combined with the bottom plate, an accommodating space is formed between the bottom plate and the top plate, a bottom capillary material is arranged on the bottom plate and positioned in the accommodating space, the top plate is provided with a top capillary material positioned in the accommodating space, the bottom capillary material is separated from the top capillary material by a preset distance, the bottom capillary material upwards extends a plurality of capillary columns to prop against the top capillary material, the top plate is provided with a connecting port, and the top capillary material is provided with a perforation which is opposite to the connecting port in the up-down direction and is communicated with the space; A vertical temperature equalizing unit having a housing with a bottom opening and a bottom connected to the top plate, and a vertical space spatially communicated with the accommodating space via the bottom opening, the connecting port and the through hole, wherein an upper capillary layer is provided in the vertical temperature equalizing unit, and A working fluid is placed in the accommodating space; Wherein the top capillary material and the upper capillary layer are connected or contacted and communicated in capillary phenomenon so as to be capable of circulating the working fluid; the method is characterized in that: the top plate is provided with a vertical wall extending up and down along the periphery of the connecting port in a bending way, the bottom of the shell is provided with a vertical section extending downwards along the periphery of the bottom opening, the vertical wall is sleeved outside the vertical section, and a gap surrounding the bottom opening is formed between the vertical wall and the vertical section; At least part of the vertical section and the vertical wall are in close fit relation, the bottom end of one of the vertical section and the vertical wall is higher than or flush with the bottom end of the other of the vertical section and the vertical wall, a plurality of fused parts which are solidified after fusion are formed between the vertical section and the vertical wall through non-welding flux fusion, the fused parts are positioned at the bottom of the gap, and the top capillary material covers the bottom of the vertical wall, the bottom of the vertical section and the fused parts; the top of the vertical wall is provided with an upward and outward extending flaring section, a socket which is gradually opened from bottom to top is formed between the flaring section and the vertical section, the socket is spatially communicated with the gap, and a welding flux is contained in the socket; At least one of the above-mentioned close-fitting relation and the above-mentioned several melting parts is used for completely sealing said gap, when the above-mentioned close-fitting relation is used for completely sealing said gap, it can be used for completely tightly matching the vertical section and vertical wall to seal said gap, so that the socket and top capillary material can be isolated from communicating with each other in capillary phenomenon, and when the above-mentioned several melting parts are used for completely sealing said gap, it can be used for completely connecting the above-mentioned melting parts, and isolating the gap from the top capillary material from communicating with each other in capillary phenomenon.
  2. 2. The three-dimensional temperature equalization plate with an isolated gap structure of claim 1, wherein the top plate is bent inwards and downwards along the periphery of the connecting port to form the flaring section, and then extends downwards to form the vertical wall, and the bottom end of the vertical section is level with the bottom end of the vertical wall.
  3. 3. The three-dimensional temperature equalization plate with an isolated gap structure of claim 1, wherein the top plate is bent inwards and downwards along the periphery of the connecting port to form the flaring section, and then extends downwards to form the vertical wall, and the bottom end of the vertical section is higher than the bottom end of the vertical wall.
  4. 4. The three-dimensional temperature equalization plate with an isolated gap structure of claim 1, wherein the top plate is bent inwards and downwards along the periphery of the connecting port to form the flaring section, and then extends downwards to form the vertical wall, and the bottom end of the vertical section is lower than the bottom end of the vertical wall.
  5. 5. The three-dimensional temperature equalization plate with an isolated gap structure of claim 1, wherein the vertical wall is formed by bending and extending the top plate upwards, the flaring section is formed by extending the top end of the vertical wall upwards and outwards, and the bottom end of the vertical section is lower than the bottom end of the vertical wall.
  6. 6. The three-dimensional temperature equalization plate with an isolated gap structure according to claim 1, wherein the vertical temperature equalization unit is a vertical temperature equalization plate, the housing has two vertical plates separated by a predetermined distance and combined by edges, the upper capillary layer is attached to the two vertical plates, and a portion of the upper capillary layer attached to the two vertical plates is defined as two vertical capillary layers, the two vertical capillary layers are separated by a predetermined distance, a plurality of supporting capillary columns are arranged between the two vertical capillary layers, and the two vertical capillary layers are communicated with the plurality of supporting capillary columns in capillary phenomenon to allow the working fluid to circulate.
  7. 7. The three-dimensional temperature equalization plate with an isolated gap structure of claim 1, further comprising a plurality of fins, wherein one side of the fins is attached to the housing of the vertical temperature equalization unit, and the fins are stacked horizontally.
  8. 8. The three-dimensional temperature equalization plate with an isolated gap structure of claim 1, wherein said vertical temperature equalization unit is a heat pipe.

Description

Three-dimensional temperature equalizing plate with isolated gap structure Technical Field The invention relates to a temperature-equalizing plate for temperature equalizing and heat dissipating, in particular to a three-dimensional temperature-equalizing plate with an isolated gap structure. Background Chinese CN 106288891B discloses a three-dimensional heat conducting structure and a method for manufacturing the same, and the technical key of the present invention is that a heat pipe with an open end is disposed on a temperature equalizing plate with a jack, the open end is inserted into the jack, a supporting ring is provided, the supporting ring is sleeved and fixed at the adjacent position of the heat pipe and the temperature equalizing plate, and fig. 6 of the present invention particularly discloses that a chamfer is formed on one side of the adjacent heat pipe by using the supporting ring, so that solder can be left between the chamfer and the outer surface of the heat pipe, and not overflow to the surface of the temperature equalizing plate, and better bonding effect is provided. However, the above-described technique can retain solder, but has two major problems that cannot be overcome. Firstly, the heat pipe is inserted into the position of the jack, a gap is easy to exist between the heat pipe and the wall of the jack, and the gap is the optimal channel of capillary phenomenon, so that under the condition that the heat pipe and the wall of the jack are not completely sealed, the molten solder during welding is likely to flow into the temperature equalizing plate due to the capillary phenomenon and be absorbed by the capillary structure of the temperature equalizing plate, and further the solder cannot be kept in place, so that the welding result is failed, and the capillary structure is blocked and destroyed. Secondly, the support ring is used, one more element is used, assembly tolerance exists, and assembly cost and part cost are increased by one more part. Therefore, the conventional technique is easy to produce defective products and has a high cost. Therefore, it is an object of the present invention to develop a three-dimensional temperature-equalizing plate structure that is not likely to cause clogging by solder flowing into the temperature-equalizing plate during soldering and being sucked into the capillary structure, and that is easy to manufacture. Disclosure of Invention The main purpose of the present invention is to provide a three-dimensional temperature equalizing plate with an isolated gap structure, which can seal the gap to generate an isolated effect, so that solder can not flow to the capillary structure through the gap to be absorbed during welding, and defective products are not easy to generate in manufacturing. In order to achieve the above-mentioned objective, the present invention provides a three-dimensional temperature equalization plate with an isolated gap structure, comprising a bottom temperature equalization plate, a top plate, a plurality of capillary columns, a plurality of connecting holes and a plurality of connecting holes, wherein the bottom temperature equalization plate is provided with a bottom plate and a top plate combined with the bottom plate, a containing space is formed between the bottom plate and the top plate, a bottom capillary material is arranged on the bottom plate and is positioned in the containing space, the top plate is provided with a top capillary material which is positioned in the containing space, the bottom capillary material is separated from the top capillary material by a preset distance, the bottom capillary material extends upwards to a plurality of capillary columns to prop against the top capillary material, the top plate is provided with a connecting hole, and the through hole is vertically opposite to the connecting hole and is spatially communicated with the connecting hole; the vertical temperature equalizing unit is provided with a shell, a vertical space is formed inside the shell, the bottom of the shell is provided with a bottom opening, the bottom of the shell is connected with the top plate, the vertical space is communicated with the accommodating space in space through the bottom opening, the connecting port and the through hole, the vertical temperature equalizing unit is internally provided with an upper capillary layer, and a working fluid is arranged in the accommodating space, wherein the top capillary material and the upper capillary layer are connected or contacted and communicated with each other on the capillary phenomenon so as to enable the working fluid to circulate, the top plate is provided with a vertical wall which extends up and down along the periphery of the connecting port in a bending way, the bottom of the shell is provided with a vertical section which extends downwards along the periphery of the bottom opening, the vertical wall is sleeved outside the vertical section, a gap which surrou