CN-121994202-A - Monolithically integrated chip gyro

CN121994202ACN 121994202 ACN121994202 ACN 121994202ACN-121994202-A

Abstract

The invention relates to a single-chip integrated chip gyro, relates to the technical field of optical sensing, and solves the defect that the photonic integrated chip gyro cannot integrate all devices on a single substrate due to different waveguide materials of functional chips such as luminescence, transmission, modulation, detection and the like. The integrated chip module comprises an optical signal receiving and transmitting integrated chip module, a passive device integrated chip module, a modulator module and a control circuit, wherein the optical signal receiving and transmitting integrated chip module and the passive device integrated chip module realize hybrid integration in an end face coupling mode, the modulator module realizes hybrid integration on the passive device integrated chip module in a micro transfer printing mode, and the control circuit is used for supplying power to an active device in the optical signal receiving and transmitting integrated chip module and applying a debugging signal to the modulator module.

Inventors

YANG YIXING
MAO YUZHENG
YUAN SHICHENG
LI AILUN
YUAN JINMING
WAN XUAN
XIE LIANGPING
WU DAIXUAN

Assignees

中航捷锐(西安)光电技术有限公司

Dates

Publication Date: 20260508
Application Date: 20260409

Claims (10)

1. A monolithically integrated chip gyro comprising: The integrated chip module for receiving and transmitting optical signals, the integrated chip module for passive devices, the modulator module and the control circuit; the waveguide material of the optical signal receiving and transmitting integrated chip module, the waveguide material of the passive device integrated chip module and the material of the thin film of the modulator module are heterogeneous materials; the optical signal receiving and transmitting integrated chip module and the passive device integrated chip module realize hybrid integration in an end face coupling mode; the modulator module realizes hybrid integration on the passive device integrated chip module in a micro transfer printing mode; The control circuit is used for supplying power to an active device in the optical signal transceiver integrated chip module and applying a modulation signal to the modulator module.
2. The integrated chip gyro of claim 1, wherein the optical signal transceiver integrated chip module includes: the light source (1-1), the isolator (1-2), the No. 1 spot-size converter (1-3), the detector (1-4) first waveguide (1-5), the end face coupler (1-6), the 2X 2 coupler (1-9), the stray light absorber (1-10) and the No. 2 spot-size converter (1-11); The light signal is sent out by a light source (1-1) and then sequentially enters a first waveguide (1-5) through an isolator (1-2) and a No. 1 spot-size converter (1-3), then enters a 2X 2 coupler (1-9) through a first input end of the 2X 2 coupler (1-9), the light signal entering the 2X 2 coupler (1-9) is divided into two parts, one part of the light signal is absorbed by a stray light absorber (1-10), and the other part of the light signal enters the passive device integrated chip module through a No. 2 spot-size converter (1-11); wherein the second input of the 2X 2 coupler (1-9) is connected to the detector (1-4) via the end coupler (1-6).
3. The integrated chip gyro of claim 2, wherein the optical signal transceiver integrated chip module further comprises: a cascade of semiconductor optical amplifiers 1-7 and 2 (1-8); Wherein the No. 2 semiconductor optical amplifier (1-8) is between the No. 1 spot-size converter (1-3) and the first input of the 2X 2 coupler (1-9), and the No. 1 semiconductor optical amplifier (1-7) is between the detector (1-4) and the second input of the 2X 2 coupler (1-9).
4. The integrated chip gyro of claim 2, wherein the passive device integrated chip module comprises: The device comprises a No. 3 spot-size converter (2-8), a polarizer (2-1), a No.1 stray light absorbing structure (2-4), a No. 2 stray light absorbing structure (2-5), a second waveguide (2-3), a 1X 2 coupler (2-2) and an optical waveguide sensitive ring (2-7); The optical signal enters the passive device integrated chip module through a No. 3 spot-size converter (2-8), enters the polarizer (2-1) through a No. 3 spot-size converter (2-8), enters the input end of a 1X 2 coupler (2-2) after passing through a second waveguide (2-3), enters the two ends of an optical waveguide sensitive ring (2-7) after passing through the modulator module, and enters the optical signal transceiver integrated chip module through the 1X 2 coupler (2-2), the polarizer (2-1) and the No. 3 spot-size converter (2-8) in sequence; The No. 1 stray light absorbing structure (2-4) is used for absorbing stray light at the polarizer (2-1), and the No. 2 stray light absorbing structure (2-5) is used for absorbing stray light generated at the bent waveguide in the second waveguide (2-3).
5. The integrated chip gyro of claim 4, wherein the modulator module comprises: And the metal electrodes (3-1) are arranged at two ends of the waveguide of the modulator module and used for modulating the optical path by applying voltage.
6. The integrated chip gyro according to claim 1, wherein the waveguide material of the optical signal transmission/reception integrated chip module is indium phosphide, the waveguide material of the passive device integrated chip module is silicon nitride, and the material of the thin film of the modulator module is lithium niobate.
7. The integrated chip gyro according to claim 4, characterized in that the polarizer (2-1) adopts a curved waveguide cascade structure with a waveguide aspect ratio of more than 20.
8. The integrated chip gyro of claim 5, wherein the modulator module is prepared by the following method: Transferring the whole film to the passive device integrated chip module by micro transfer printing, covering the two waveguides of the 1×2 coupler (2-2) output, and A metal electrode (3-1) is deposited on the whole piece of said film by a thermal evaporation process.
9. The integrated chip gyro according to claim 4, wherein the No. 1 spot-size converter (1-3), the No. 2 spot-size converter (1-11), the No. 3 spot-size converter (2-8) have a reverse taper structure, and the end-face coupler (1-6) has a forward taper structure.
10. The integrated chip gyro according to claim 4, wherein the stray light absorber (1-10) is realized by forming a wide waveguide partition on the surface of the integrated chip module integrating optical signal transmission and reception by using a deep etching process and filling an optical damping material in the partition, and the No. 1 stray light absorbing structure (2-4) and the No. 2 stray light absorbing structure (2-5) are realized by using a deep etching process and filling an optical damping material on the chip surface of the integrated chip module of the passive device.

Description

Monolithically integrated chip gyro Technical Field The invention relates to the technical field of optical sensing, in particular to a single-chip integrated chip gyroscope. Background With the rapid development of technology, the market has put extremely high demands on the high precision, high stability, miniaturization and even low cost of gyroscopic sensors. The traditional fiber-optic gyroscope adopts a fiber-optic device which is large in size and is independently packaged and a sensitive fiber-optic ring which is thousands of meters in short time, which not only limits the further reduction of the cost, but also increases the difficulty of further miniaturization. The integrated optical chip is used for replacing a discrete optical device in the gyroscope, so that the on-chip integration of the optical path of the gyroscope can be realized. However, the optical devices in the gyroscope are divided into active devices and passive devices, wherein the active devices comprise a light source, a detector and a modulator, and the passive devices comprise a coupler, a polarizer and a sensitive ring. Due to the fact that waveguide materials of the functional chips such as luminescence, transmission, modulation and detection are different, integration of all devices of the gyroscope cannot be achieved on a single substrate. Disclosure of Invention In view of the above analysis, the embodiment of the invention aims to provide a single-chip integrated chip gyro scheme for solving the defect that the photonic integrated chip gyro cannot integrate all devices on a single substrate due to different waveguide materials of functional chips such as luminescence, transmission, modulation and detection. In a first aspect, an embodiment of the present invention provides a monolithically integrated chip gyro, including: The integrated chip module for receiving and transmitting optical signals, the integrated chip module for passive devices, the modulator module and the control circuit; the waveguide material of the optical signal receiving and transmitting integrated chip module, the waveguide material of the passive device integrated chip module and the material of the thin film of the modulator module are heterogeneous materials; the optical signal receiving and transmitting integrated chip module and the passive device integrated chip module realize hybrid integration in an end face coupling mode; the modulator module realizes hybrid integration on the passive device integrated chip module in a micro transfer printing mode; The control circuit is used for supplying power to an active device in the optical signal transceiver integrated chip module and applying a modulation signal to the modulator module. Based on the further improvement of above-mentioned monolithic integrated chip top, integrative integrated chip module of optical signal transceiver includes: The light source 1-1, the isolator 1-2, the No. 1 spot-size converter 1-3, the detector 1-4 first waveguide 1-5, the end face coupler 1-6, the 2X 2 coupler 1-9, the stray light absorber 1-10 and the No. 2 spot-size converter 1-11; The light signal is sent out by a light source 1-1 and then sequentially enters a first waveguide 1-5 through an isolator 1-2 and a No. 1 spot-size converter 1-3, then enters a 2X 2 coupler 1-9 through a first input end of the 2X 2 coupler 1-9, the light signal entering the 2X 2 coupler 1-9 is equally divided into two parts, one part of the light signal is absorbed by a stray light absorber 1-10, and the other part of the light signal enters the passive device integrated chip module through a No. 2 spot-size converter 1-11; wherein the second input of the 2 x 2 coupler 1-9 is connected to the detector 1-4 via the end coupler 1-6. Based on the further improvement of above-mentioned monolithic integrated chip top, integrative integrated chip module of optical signal transceiver still includes: Cascaded semiconductor optical amplifiers 1-7 and 2 1-8; Wherein the semiconductor optical amplifier No.2 1-8 is between the first input terminals of the spot-size converter No. 1-3 and the 2 x2 coupler 1-9, and the semiconductor optical amplifier No. 1-7 is between the second input terminals of the detector 1-4 and the 2 x2 coupler 1-9. Based on the further improvement of the above monolithic integrated chip gyro, the passive device integrated chip module includes: The device comprises a No. 3 mode spot converter 2-8, a polarizer 2-1, a No.1 stray light absorbing structure 2-4, a No. 2 stray light absorbing structure 2-5, a second waveguide 2-3, a 1X 2 coupler 2-2 and an optical waveguide sensitive ring 2-7; The optical signal enters the passive device integrated chip module through the No. 3 spot-size converter 2-8, enters the polarizer 2-1 through the No. 3 spot-size converter 2-8, enters the input end of the 1X 2 coupler 2-2 after passing through the second waveguide 2-3, enters the two ends of the optical waveguide sensitive ring 2-7 after pas