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CN-121994310-A - Sheet-shaped temperature and pressure integrated sensor

CN121994310ACN 121994310 ACN121994310 ACN 121994310ACN-121994310-A

Abstract

The application provides a sheet-shaped temperature and pressure integrated sensor, and belongs to the technical field of sensors. The sensor comprises a PCB board provided with a temperature acquisition circuit and a voltage acquisition circuit. The positive electrode and the negative electrode of the patch type thermistor are electrically connected with a positive temperature collecting welding spot and a negative temperature collecting welding spot, one end of the voltage collecting sheet is electrically connected with a pressure collecting welding spot, the other end of the voltage collecting sheet is used for being connected with an energy storage battery, and the outer lead comprises a temperature collecting outer lead and a voltage collecting outer lead which are respectively electrically connected with the positive temperature connecting welding spot and the negative temperature connecting welding spot. A partition area is arranged between the positive temperature and the negative temperature connecting welding spots on the PCB to realize physical isolation, and a blocking ink is arranged between the positive temperature and the negative temperature collecting welding spots to realize electrical isolation. The dual isolation effectively prevents the positive and negative poles of the temperature sensor from being out of order by short circuit, improves the reliability, integrates the voltage and the temperature acquisition, reduces the space occupation and is beneficial to the miniaturization and integration of the energy storage system.

Inventors

  • Lu Shuaichen
  • LIU WEI
  • WEI QINGYUN
  • MO CHANGJIAN
  • Qin Shousen
  • ZENG QIANG

Assignees

  • 深圳市科敏传感器有限公司

Dates

Publication Date
20260508
Application Date
20260408

Claims (10)

  1. 1. A sheet-like warm-pressing integrated sensor, comprising: The PCB (10) is provided with a temperature acquisition circuit (12) and a voltage acquisition circuit (13) on the front surface of the PCB (10), wherein the temperature acquisition circuit (12) comprises a positive temperature acquisition welding point (12 a), a positive connecting line (12 b) and a negative temperature connection welding point (12 c), and the voltage acquisition circuit (13) comprises a pressure acquisition welding point (13 a) and a pressure connection welding point (13 b); The positive and negative poles of the patch type thermistor (20) are respectively and electrically connected with the positive and negative poles of the positive and negative temperature acquisition welding spots (12 a); One end of the voltage acquisition sheet (30) is electrically connected with the pressure acquisition welding point (13 a), and the other end of the voltage acquisition sheet is electrically connected with an energy storage battery of the voltage to be tested; The outer lead (40) comprises a temperature acquisition outer lead (41) and a voltage acquisition outer lead (42), the temperature acquisition outer lead (41) is electrically connected with the positive and negative temperature connection welding spots (12 c), and the voltage acquisition outer lead (42) is electrically connected with the pressure connection welding spots (13 b); The voltage acquisition sheet (30) is provided with a hollowed-out area (31), after the voltage acquisition sheet (30) and the PCB (10) are packaged, the patch type thermistor (20) and the positive and negative temperature acquisition welding spots (12 a) are arranged in the hollowed-out area (31), the positive and negative temperature connection welding spots (12 c) are arranged outside the hollowed-out area (31), and the positive and negative connection wires (12 b) are not in contact with the voltage acquisition sheet (30); The PCB (10) is provided with a partition area (11), the partition area (11) is positioned between the positive temperature connection welding spots (12 c) and used for physically isolating the positive electrode and the negative electrode of the positive temperature connection welding spots (12 c), the PCB (10) is also provided with a blocking ink (14), and the blocking ink (14) is positioned between the positive temperature collection welding spots (12 a) and used for electrically isolating the positive electrode and the negative electrode of the positive temperature collection welding spots (12 a).
  2. 2. The sheet-like temperature and pressure integrated sensor according to claim 1, characterized in that the width of the blocking area (11) is 1±0.1mm, and the width of the blocking ink (14) is less than 0.8±0.1mm.
  3. 3. The sheet-like temperature and pressure integrated sensor according to claim 2, wherein the blocking ink (14) comprises a plurality of intermittently distributed ink dots, or the surface of the blocking ink (14) is provided with a diversion micro groove for guiding the volatilization of the soldering flux during reflow soldering and balancing the interfacial tension of the surface of the bonding pad, and/or, And two dispensing grooves or supporting protruding points corresponding to the bottom of the thermistor body of the patch type thermistor (20) are arranged on the PCB (10) below the patch type thermistor (20) and used for providing physical support during surface mounting and preventing element drift caused by uneven surface tension of molten tin in the reflow soldering process.
  4. 4. The sheet-like temperature and pressure integrated sensor according to claim 1, wherein the overall length of the PCB board (10) is L, the distance from the center of the positive and negative temperature connection pads (12 c) to the first edge of the PCB board (10) is L1, the distance from the center of the positive and negative temperature connection pads (12 c) to the second edge of the PCB board (10) is L2, wherein the first edge is the edge close to the outer lead (40) and satisfies that L is 12 +.0.3 mm +.16 +.0.3 mm, and L is 3:7 +.l1:l2 +.5:5.
  5. 5. The sheet-like temperature and pressure integrated sensor according to claim 4, wherein the temperature collecting outer lead (41) and the voltage collecting outer lead (42) comprise copper wires and wire skins, and the overlap length of the wire Pi Zaisuo on the PCB (10) is greater than 3mm.
  6. 6. The sheet-like warm-pressing integrated sensor according to claim 5, wherein a lead limiting groove is formed in the position, where the outer lead (40) is arranged, of the PCB (10), the bottom surface of the lead limiting groove is a plane or a concave cambered surface, the width of the lead limiting groove is larger than or equal to the outer diameter of a wire skin of the outer lead (40), the wire skin is embedded or attached in the lead limiting groove, dispensing and sealing are completed in the lead limiting groove, and/or, The wire skin is subjected to plasma treatment or is coated with a coupling agent layer at the contact part with the PCB (10) in advance, and is used for enhancing the chemical bonding force between the wire skin and the dispensing sealant.
  7. 7. The sheet-like temperature and pressure integrated sensor according to claim 1, further comprising a packaging glue (50) for packaging the junction of the outer lead (40) with the positive and negative temperature connection pads (12 c) and the pressure connection pad (13 b), and wherein the height of the packaging glue (50) is less than 3.2±0.3mm.
  8. 8. The sheet-like temperature and pressure integrated sensor according to claim 1, characterized in that the front side of the PCB board (10) is coated with green ink except for the temperature acquisition circuit (12), the voltage acquisition circuit (13), the blocking ink (14) and the blocking area (11).
  9. 9. The chip temperature and pressure integrated sensor according to claim 1, wherein the chip thermistor (20) is packaged with the PCB board (10) by surface mounting.
  10. 10. The sheet-like temperature and pressure integrated sensor according to claim 1, wherein the back surface welding position of the voltage acquisition sheet (30) is pre-tinned and is packaged with the PCB board (10) by surface mounting.

Description

Sheet-shaped temperature and pressure integrated sensor Technical Field The application relates to the technical field of sensors, in particular to a sheet temperature and pressure integrated sensor. Background The energy storage battery is used as a core energy device of the energy storage system, and the running state of the energy storage battery directly determines the efficiency, reliability and safety of the whole system. Among the many operating parameters of an energy storage battery, voltage and temperature are two of the most critical control indicators. Accurate voltage acquisition and control are the basis for guaranteeing the stability of the battery charging and discharging process and preventing overcharge or overdischarge, and accurate temperature monitoring is a necessary premise for guaranteeing the battery to be in a standard working temperature range and avoiding safety accidents such as thermal runaway. Therefore, the method has important significance for prolonging the service life of the battery and improving the overall performance of the energy storage system while accurately collecting the voltage and the temperature of the battery. In the prior art, for voltage and temperature monitoring of an energy storage battery, a split type design is generally adopted, that is, a voltage acquisition module and a temperature acquisition module are mutually independent and are respectively arranged and connected to a battery module. The traditional split type acquisition scheme can realize the basic monitoring function, but has the defects that firstly, the independent module needs to occupy more installation space on the battery module, which contradicts the increasingly-improved integrated and miniaturized design requirements of the energy storage system, and secondly, the split type design increases the number of internal wiring and connecting nodes, so that the assembly process is complex, more failure risk points are introduced due to the increase of wiring harnesses, and the overall reliability of the system is reduced. In order to solve the problem of space occupation, some attempts to integrate voltage acquisition with temperature acquisition are on the market. However, these existing integrated sensors still have a number of technical drawbacks in practical applications. For example, due to unreasonable structural design, the sensor is easy to fall off an outer lead, so that signals are interrupted, for example, in the long-term working process, particularly in the environment of temperature and humidity change, short circuit is easy to occur between the anode and the cathode of the temperature sensor due to electrochemical migration or impurity accumulation, so that a temperature sensing function is invalid, temperature monitoring data is distorted, in addition, the existing integrated sensor is insufficient in electrical isolation design, voltage breakdown is easy to occur, and the safe operation of an energy storage system is seriously threatened. In summary, there is a lack of a temperature and pressure integrated sensor solution in the prior art, which has a compact structure, reliable connection, and can effectively avoid the risk of short-circuiting of the positive and negative electrodes. Disclosure of Invention The application aims to provide a sheet temperature and pressure integrated sensor which is compact in structure, reliable in connection and capable of effectively avoiding the risk of short-circuiting of the anode and the cathode. The application provides a sheet-shaped temperature and pressure integrated sensor, which comprises: The PCB is provided with a temperature acquisition circuit and a voltage acquisition circuit on the front surface, wherein the temperature acquisition circuit comprises a positive temperature acquisition welding spot, a negative temperature acquisition welding spot, a positive connecting wire, a negative temperature acquisition welding spot, a positive temperature connection wire and a negative temperature connection welding spot; the positive and negative electrodes of the patch type thermistor are respectively and electrically connected with the positive and negative electrodes of the positive and negative temperature acquisition welding spots; One end of the voltage acquisition sheet is electrically connected with the pressure acquisition welding spot, and the other end of the voltage acquisition sheet is electrically connected with an energy storage battery of the voltage to be tested; The outer lead comprises a temperature acquisition outer lead and a voltage acquisition outer lead, the temperature acquisition outer lead is electrically connected with the positive and negative temperature connection welding spots, and the voltage acquisition outer lead is electrically connected with the pressure connection welding spots; The voltage acquisition sheet is provided with a hollowed-out area, after the voltage acquisition sheet and the PCB ar