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CN-121994403-A - Packaging structure of differential pressure sensitive element

CN121994403ACN 121994403 ACN121994403 ACN 121994403ACN-121994403-A

Abstract

The invention provides a packaging structure of a differential pressure sensitive element, which comprises a packaging base, a pressure conduit and a column array structure, wherein the central axes of the column array structure, a first pipeline of the pressure conduit and the differential pressure sensitive element are overlapped and parallel to the central axis of the packaging base, the column array structure comprises a plurality of column units which encircle the periphery of the first pipeline, and the differential pressure sensitive element is fixed on a first pipeline opening of the pressure conduit and a second array surface of the column array structure. The invention isolates the stress of static pressure load on the differential pressure sensitive element by arranging the column array structure, including arranging the length, the position height and the shape of the column unit and arranging the size relation between the column array structure and the differential pressure sensitive element and the pressure guide pipe, reduces the influence of high static pressure on the differential pressure sensitive element, inhibits static pressure deviation and improves the measurement accuracy and repeatability of the differential pressure sensitive element.

Inventors

  • FENG FEI
  • ZHU XIANGYI

Assignees

  • 中国科学院上海微系统与信息技术研究所

Dates

Publication Date
20260508
Application Date
20241108

Claims (10)

  1. 1. The packaging structure of the differential pressure sensitive element is characterized by comprising a packaging base, a pressure conduit and a column array structure, wherein the packaging structure is used for packaging the sensitive element; the pressure guide pipe comprises a first part, wherein the pipeline direction of the first part is parallel to the central axis direction of the packaging base; The sensitive elements packaged by the packaging structure comprise a static pressure sensitive element and a temperature sensitive element besides a differential pressure sensitive element; The column array structure comprises a plurality of column units, the central axis direction of each column unit is parallel to the pipeline direction of the first part of the pressure conduit, the column array structure is circumferentially distributed on the periphery of the pipeline of the first part of the pressure conduit, the packaging base is respectively a first end face, a second end face and a third end face from bottom to top along the central axis direction, the second end face is a groove bottom face sinking from the third end face, the column array structure comprises a first array face and a second array face which are perpendicular to the central axis direction of the packaging base, and the differential pressure sensitive element is fixed on the first pipeline opening of the pressure conduit and the second array face of the column array structure.
  2. 2. The differential pressure sensor package structure of claim 1, further comprising a ceramic spacer circumferentially fixed on the second end surface of the package base, wherein the ceramic spacer comprises a first surface and a second surface which are oppositely arranged and perpendicular to the central axis direction of the package base, the first surface is attached to the second end surface, the second surface is close to the third end surface, the first array surface of the column array structure is close to the first end surface, the second array surface is far away from the first end surface, and the second array surface is higher or lower than the second end surface, or is flush with the second end surface.
  3. 3. The packaging structure of a differential pressure sensor according to claim 2, wherein a length of the pillar array structure along a central axis direction of the pillar unit is 1mm or more when the first array surface is flush with the second end surface.
  4. 4. The packaging structure of a differential pressure sensor according to claim 2, wherein when the first array surface is lower than the second end surface, a length of the pillar array structure along a central axis direction of the pillar unit is 2 mm or more.
  5. 5. The structure according to any one of claims 1 to 4, wherein a plurality of merging column units are formed by communicating part of adjacent column units in the column array structure, the column array structure is formed by a plurality of merging column units and column units together, and a projection area of each merging column unit on a plane perpendicular to a central axis direction of the package base is larger than a projection area of the column unit before communicating on a plane perpendicular to the central axis direction of the package base.
  6. 6. The package structure of differential pressure sensor according to any one of claims 1-4, wherein a plurality of merging column units are formed by mutually communicating adjacent column units of the column array structure, the column array structure is composed of a plurality of merging column units, and the projection area of each merging column unit on a plane perpendicular to the central axis direction of the package base is larger than the projection area of the column unit before communicating on a plane perpendicular to the central axis direction of the package base.
  7. 7. The packaging structure of a differential pressure sensor according to claim 1, wherein the column units in the column array structure are arranged in a zigzag array comprising an inner column surface and an outer column surface, the projection profile of the inner column surface on a plane perpendicular to the central axis direction of the packaging base is rectangular or circular, the projection profile of the outer column surface on a plane perpendicular to the central axis direction of the packaging base is rectangular or circular, the projection profile of the differential pressure sensor on a plane perpendicular to the central axis direction of the packaging base is located within the projection profile of the outer column surface on a plane perpendicular to the central axis direction of the packaging base, and the distance between the projection profile of the outer column surface on a plane perpendicular to the central axis direction of the packaging base and the projection profile of the differential pressure sensor on a plane perpendicular to the central axis direction of the packaging base is greater than 0.8 mm.
  8. 8. The packing structure of a differential pressure sensor according to claim 1, wherein the column units in the column array structure are arranged in a zigzag array including an inner column surface and an outer column surface, a projection profile of the inner column surface on a plane perpendicular to a central axis direction of the packing base is rectangular or circular, a projection profile of the outer column surface on a plane perpendicular to a central axis direction of the packing base is rectangular or circular, a projection profile of the first portion of the pressure conduit on a plane perpendicular to a central axis direction of the packing base is located within a projection profile of the inner column surface on a plane perpendicular to a central axis direction of the packing base, and a projection profile of the first portion of the pressure conduit on a plane perpendicular to a central axis direction of the packing base is not in contact with a projection profile of the inner column surface on a plane perpendicular to a central axis direction of the packing base.
  9. 9. The packing structure of a differential pressure sensor according to claim 1, wherein the projection of the column units in the column array structure on a plane perpendicular to the central axis direction of the packing base is circular or rectangular.
  10. 10. The packaging structure of a differential pressure sensor according to claim 1, wherein the column array structure, the first pipeline opening of the pressure conduit and the central axis of the differential pressure sensor are all coincident, and a differential pressure sensor opening for exposing a sensitive film of the differential pressure sensor is provided on a surface of the differential pressure sensor close to the first pipeline opening of the pressure conduit.

Description

Packaging structure of differential pressure sensitive element Technical Field The invention belongs to the technical field of semiconductor integrated circuit manufacturing, and particularly relates to a packaging structure of a differential pressure sensitive element. Background The packaging structure of the silicon pressure sensitive element is an important component of the silicon-based pressure sensor and mainly plays roles of bearing the sensitive element, conducting pressure and leading out an electric signal. In the prior art, a silicon pressure sensitive element is directly bonded and fixed on a packaging structure by epoxy resin, so that the pressure sensor is prepared and is mainly used for measuring parameters such as pressure, flow, liquid level and the like in the process industry. However, the demands of complexity, large-scale and automation of the industrial process flow place higher demands on the accuracy, stability, reliability and intellectualization of the pressure sensor. Ideally, the output value of the differential pressure sensor is required to be independent of the static pressure born by the differential pressure sensing element, and is only related to the input differential pressure value, but in actual situations, the output value of the differential pressure sensing element changes along with the static pressure change. Particularly, at high static pressure, the differential pressure sensor is greatly affected by static pressure, and thus static pressure deviation is generated. The linear calibration process of the differential pressure sensor is usually carried out under the condition that the static pressure is one atmosphere when the differential pressure sensor is produced, but when the differential pressure under high static pressure is actually detected, the differential pressure sensor can bear high static pressure, and a certain deviation occurs between zero position output and full position output of the differential pressure sensor. The error between the output value of the differential pressure sensor at high static pressure and the output value at the time of verification through the atmosphere is called static pressure deviation, and the static pressure deviation can seriously affect the detection accuracy and repeatability of the differential pressure sensor. In order to realize accurate measurement of differential pressure signals under high static pressure, special design is needed for the packaging structure of the differential pressure sensitive element, so that stress isolation is realized, and the influence of the high static pressure on differential pressure signal measurement is reduced. Therefore, it is desirable to provide a packaging structure for a differential pressure sensor that can effectively suppress static pressure deviations. It should be noted that the foregoing description of the background art is only for the purpose of providing a clear and complete description of the technical solutions of the present application and is thus convenient for a person skilled in the art to understand, and it should not be construed that the above technical solutions are known to the person skilled in the art merely because these solutions are described in the background art section of the present application. Disclosure of Invention In view of the above drawbacks of the prior art, an object of the present invention is to provide a packaging structure of a differential pressure sensor, which is used for solving the problem of static pressure deviation of the differential pressure sensor in the prior art. In order to achieve the aim, the invention provides a packaging structure of a differential pressure sensitive element, which comprises a packaging base, a pressure conduit and a column array structure, wherein the packaging structure is used for packaging the sensitive element; the pressure guide pipe comprises a first part, wherein the pipeline direction of the first part is parallel to the central axis direction of the packaging base; The sensitive elements packaged by the packaging structure comprise a static pressure sensitive element and a temperature sensitive element besides a differential pressure sensitive element; the column array structure comprises a plurality of column units, the central axis direction of each column unit is parallel to the pipeline direction of the first part of the pressure conduit, and the column array structure is circumferentially distributed on the periphery of the pipeline of the first part of the pressure conduit; The packaging base is provided with a first end face, a second end face and a third end face from bottom to top along the central axis direction, the second end face is a groove bottom face sinking from the third end face, the column array structure comprises a first array face and a second array face which are perpendicular to the central axis direction of the packaging base, and the differential pressure sen