CN-121994570-A - Sample processing device and LIBS detection device

CN121994570ACN 121994570 ACN121994570 ACN 121994570ACN-121994570-A

Abstract

The invention discloses a sample processing device and an LIBS detection device, which relate to the technical field of mechanical automation, wherein the sample processing device comprises a bearing component, a dropping component, a heating device, a taking and placing component and a control system, when the device works, the taking and placing component places a clean silicon wafer substrate at an initial station of a turntable, the turntable sequentially conveys the clean silicon wafer substrate to the dropping, heating and detecting station, the dropping component automatically completes quantitative extraction, mixing and dripping of liquid to be detected and a thickening agent, the heating device is used for solidifying, a solidified sample is detected by an LIBS spectrometer, and finally, the silicon wafer substrate is placed back by the taking and placing component to form a closed loop.

Inventors

LIU FEI
KOU YUN
Cao Liuye
YE LONGFEI
MA YUXI
PAN TIANTIAN
LI GANG

Assignees

浙江大学

Dates

Publication Date: 20260508
Application Date: 20260320

Claims (10)

1.A sample processing device, comprising: The bearing assembly comprises a rotatable bearing turntable, an initial station, a liquid dropping station, a heating station and a detection station which are sequentially arranged around the circumference of the bearing turntable, wherein the bearing turntable is used for fixing a silicon wafer substrate and sequentially conveying the silicon wafer substrate to each station for processing by rotation; the liquid dropping component is used for completing quantitative extraction and mixing of the liquid to be detected and the thickener, and dripping the mixed liquid onto the silicon wafer substrate on the liquid dropping station; The heating device is used for heating the silicon wafer substrate on the heating station; A pick-and-place assembly for transferring the silicon wafer substrate between a substrate storage area and the initial station, and And the control system is in communication connection with the bearing assembly, the drip assembly, the heating device and the picking and placing assembly and is used for controlling the actions of all the components.
2. The sample processing device according to claim 1, wherein the drip assembly comprises a first storage unit, a second storage unit, a first delivery unit, a second delivery unit, a third delivery unit, a mixing unit and a drip unit, wherein the first storage unit is used for storing liquid to be measured, the second storage unit is used for storing thickening agent, an inlet of the first delivery unit is communicated with the first storage unit, an outlet of the first delivery unit is communicated with the mixing unit and is used for delivering liquid to be measured in the first storage unit to the mixing unit, an inlet of the second delivery unit is communicated with the second storage unit, an outlet of the second delivery unit is communicated with the mixing unit and is used for delivering thickening agent in the second storage unit to the mixing unit, an inlet of the third delivery unit is communicated with the mixing unit and is used for delivering mixed liquid to the drip unit, the mixing unit is used for receiving and mixing the liquid to be measured with the silicon wafer, and the liquid to be measured can be dripped on the substrate after the liquid is dripped on the substrate.
3. The sample processing device of claim 2, wherein the drip unit comprises: the injection assembly is used for dripping liquid to the silicon wafer substrate at the liquid dripping station; The fluid pipeline comprises a main pipeline and a four-way joint, wherein the main pipeline is communicated with an outlet of the third conveying unit and a first connector of the four-way joint, a second connector of the four-way joint is communicated with the injection assembly, and The cleaning assembly comprises a liquid cleaning valve and a gas purging valve, wherein the liquid cleaning valve is connected with a third interface of the four-way joint and is used for controlling the inflow of cleaning liquid to flush the fluid pipeline, the injection assembly and the mixing unit; Wherein the control system is configured to coordinate control of the liquid purge valve and the gas purge valve to perform a preset line purge operation.
4. A sample processing device according to claim 3, wherein the injection assembly comprises: an injection needle and an injection tube are communicated with each other, and the injection tube is communicated with a second interface of the four-way joint; a fixing device for fixing the injection tube, and And the rotary driving mechanism is connected with the fixing device at the rotary output end and is used for driving the injection needle to switch between a liquid dropping position facing the liquid dropping station and a liquid discharging position facing a waste liquid collecting container.
5. The sample processing device according to claim 4, wherein a heating plate is provided on the second storage unit for heating the thickener.
6. The sample processing device of claim 1, wherein said pick-and-place assembly comprises: A rotation driving mechanism for providing a horizontal rotation movement; the lifting driving mechanism is arranged at the output end of the rotary driving mechanism and used for providing vertical lifting movement; A telescopic driving mechanism arranged at the output end of the lifting driving mechanism and used for providing horizontal telescopic movement, and And the vacuum adsorption component is arranged at the output end of the telescopic driving mechanism and is used for picking up and releasing the silicon wafer substrate.
7. The sample processing device according to claim 1, wherein the carrying turntable is provided with a clamping groove or a vacuum adsorption structure for positioning and fixing the silicon wafer substrate.
8. The sample processing device of claim 7, wherein the substrate storage area comprises a first storage area and a second storage area, wherein the first storage area and the second storage area are respectively provided with a plurality of independent storage bits, the storage bits of the first storage area are used for storing unused clean silicon wafer substrates, the storage bits of the second storage area are used for storing detected silicon wafer substrates, and the control system is further used for marking and informationized management of the state of the silicon wafer substrates on each storage bit.
9. The sample processing device of claim 8, further comprising a photographing station disposed around the carrying turntable, wherein the photographing station is disposed subsequent to the inspection station for image recording of the inspected silicon wafer substrate.
10. A LIBS detection device comprising a sample processing device according to any one of claims 1 to 9.

Description

Sample processing device and LIBS detection device Technical Field The invention relates to the technical field of mechanical automation, in particular to a sample processing device and a LIBS detection device. Background In facility agriculture and precise agriculture, the method realizes accurate and quick on-line monitoring of the components of agricultural water such as soilless culture nutrient solution and the like, is a key requirement for improving the production management level, and has the advantages of multi-element synchronous detection, high analysis speed and the like in the Laser-induced breakdown spectroscopy (Laser-induced breakdown spectroscopy, LIBS) technology, and has application potential in the field. However, when the LIBS technology directly detects a liquid sample, the detection accuracy is affected by factors such as liquid fluidity, splashing, and surface tension. To overcome this problem, a liquid-solid conversion pretreatment method (dry drop method) is widely adopted, and a liquid sample is mixed with a thickener to form a solid film on a silicon wafer substrate, so that liquid detection is converted into more stable solid detection, and the LIBS analysis performance is improved. At present, the closest implementation mode of dry-drop pretreatment of a liquid sample in LIBS detection depends on manual operation by using discrete tools such as a liquid-transferring gun, a mixing container, a heating plate and the like, and comprises the steps of manually preparing mixed liquid, dripping, heating and solidifying, transferring samples, cleaning and the like. Disclosure of Invention The invention aims to provide a sample processing device and a LIBS detection device, which are used for solving the problems in the prior art, can automatically and efficiently finish the sample preparation process of a dry drop method, and have high consistency. In order to achieve the above object, the present invention provides the following solutions: The invention provides a sample processing device which comprises a bearing assembly, a dropping assembly, a heating device, a taking and placing assembly and a control system, wherein the bearing assembly comprises a rotatable bearing turntable, an initial station, a dropping station, a heating station and a detection station which are sequentially arranged around the circumference of the bearing assembly, the bearing turntable is used for fixing a silicon wafer substrate and sequentially conveying the silicon wafer substrate to each station for processing through rotation, the dropping assembly is used for completing quantitative extraction and mixing of liquid to be detected and a thickening agent and dripping the mixture onto the silicon wafer substrate on the dropping station, the heating device is used for heating the silicon wafer substrate on the heating station, the taking and placing assembly is used for transferring the silicon wafer substrate between a substrate storage area and the initial station, and the control system is in communication connection with the bearing assembly, the dropping assembly, the heating device and the taking and placing assembly and is used for controlling actions of all parts. In some embodiments, the dropping assembly comprises a first storage unit, a second storage unit, a first conveying unit, a second conveying unit, a third conveying unit, a mixing unit and a dropping unit, wherein the first storage unit is used for storing liquid to be tested, the second storage unit is used for storing thickening agent, an inlet of the first conveying unit is communicated with the first storage unit, an outlet of the first conveying unit is communicated with the mixing unit and used for conveying liquid to be tested in the first storage unit to the mixing unit, an inlet of the second conveying unit is communicated with the second storage unit, an outlet of the second conveying unit is communicated with the mixing unit and used for conveying thickening agent in the second storage unit to the mixing unit, an outlet of the third conveying unit is communicated with the dropping unit and used for conveying mixed liquid to the dropping unit, the mixing unit is used for receiving and mixing the liquid to be tested and the thickening agent, and the mixed liquid can be dropped onto a substrate by the silicon wafer after the dropping unit is added to the mixed liquid. In some embodiments, the dropping unit comprises an injection assembly for dropping liquid to a silicon wafer substrate at the dropping station, a fluid pipeline comprising a main pipeline and a four-way joint, wherein the main pipeline is communicated with an outlet of the third conveying unit and a first interface of the four-way joint, a second interface of the four-way joint is communicated with the injection assembly, and a cleaning assembly comprising a liquid cleaning valve and a gas purging valve, wherein the liquid cleaning valve is connected with the third