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CN-121994714-A - Semiconductor package and physical quantity deriving device

CN121994714ACN 121994714 ACN121994714 ACN 121994714ACN-121994714-A

Abstract

The invention provides a semiconductor package and a physical quantity deriving device. The semiconductor package includes a first input terminal pair connected to a terminal pair of a first light receiving element that outputs a first current signal corresponding to a light receiving amount of light emitted from a light source and disposed adjacent to each other, a second input terminal pair connected to a terminal pair of a second light receiving element that outputs a second current signal corresponding to a light receiving amount of light emitted from the light source and disposed adjacent to each other, a third terminal disposed adjacent to one of the first input terminal pair and one of the second input terminal pair, and a generation unit that generates a digital signal based on the first current signal and the second current signal.

Inventors

  • GODA YUJI

Assignees

  • 旭化成微电子株式会社

Dates

Publication Date
20260508
Application Date
20251024
Priority Date
20241101

Claims (15)

  1. 1. A semiconductor package is provided with: A first input terminal pair connected to a terminal pair of a first light receiving element that outputs a first current signal corresponding to a light receiving amount of light emitted from a light source, and disposed adjacent to each other; a second input terminal pair connected to a terminal pair of a second light receiving element that outputs a second current signal corresponding to a light receiving amount of light emitted from the light source, and disposed adjacent to each other; a third terminal disposed adjacent to one of the first input terminals and one of the second input terminals of the first input terminal pair, and And a generating unit that generates a digital signal based on the first current signal and the second current signal.
  2. 2. The semiconductor package according to claim 1, wherein, The first input terminal pair, the second input terminal pair, and the third terminal are arranged along an outer periphery of the semiconductor package when viewed from a mounting surface of the semiconductor package.
  3. 3. The semiconductor package according to claim 1, wherein, The first input terminal pair, the second input terminal pair, and the third terminal are arranged along a first side of an outer periphery of the semiconductor package when viewed from a mounting surface of the semiconductor package.
  4. 4. The semiconductor package according to claim 1, wherein, The first input terminal pair, the second input terminal pair, and the third terminal are disposed on a first side of an outer periphery of the semiconductor package when viewed from a mounting surface of the semiconductor package.
  5. 5. The semiconductor package according to claim 1, wherein, The semiconductor package further includes: a first output terminal for outputting current to the third element, and And a fourth terminal provided between the first output terminal and the other of the pair of second input terminals and disposed adjacent to the other of the pair of second input terminals.
  6. 6. The semiconductor package according to claim 5, wherein, The first input terminal pair, the second input terminal pair, the third terminal, the first output terminal, and the fourth terminal are arranged along an outer periphery of the semiconductor package when viewed from a mounting surface of the semiconductor package.
  7. 7. The semiconductor package according to claim 5, wherein, The first input terminal pair, the second input terminal pair, and the third terminal are arranged along a first side of an outer periphery of the semiconductor package when viewed from a mounting surface of the semiconductor package, The first output terminal is arranged along a second side of an outer periphery of the semiconductor package, which is different from the first side, when viewed from the mounting surface of the semiconductor package.
  8. 8. The semiconductor package according to claim 5, wherein, The first input terminal pair, the second input terminal pair, and the third terminal are arranged on a first side of an outer periphery of the semiconductor package when viewed from a mounting surface of the semiconductor package, The first output terminal is disposed on a second side of an outer periphery of the semiconductor package, the second side being different from the first side, when viewed from the mounting surface of the semiconductor package.
  9. 9. The semiconductor package according to claim 5, wherein, The third element is the light source.
  10. 10. The semiconductor package according to claim 1, wherein, The third terminal is a voltage output terminal outputting a constant potential.
  11. 11. The semiconductor package according to claim 1, wherein, The second light receiving element is used for compensating the temperature change or the aging change of the first light receiving element.
  12. 12. A physical quantity deriving device, wherein, The physical quantity deriving device includes the semiconductor package according to any one of claims 1 to 11, The physical quantity is derived based on the digital signal.
  13. 13. The physical quantity deriving device according to claim 12, wherein, The physical quantity deriving device further includes the first light receiving element and the second light receiving element.
  14. 14. A physical quantity deriving device, wherein, The physical quantity deriving device includes: the semiconductor package according to claim 5, and The first light receiving element, the second light receiving element, and the light source as the third element, The physical quantity is derived based on the digital signal.
  15. 15. A semiconductor package, wherein, The semiconductor package includes: A first input terminal pair connected to a terminal pair of a first element outputting a first current signal; A second input terminal pair connected to the terminal pair of the second element outputting the second current signal, and And a third terminal disposed between the first input terminal pair and the second input terminal pair.

Description

Semiconductor package and physical quantity deriving device Technical Field The present invention relates to a semiconductor package and a physical quantity deriving device. Background Patent document 1 describes a gas sensor that performs a/D conversion of a measurement target gas signal depending on the concentration of the measurement target gas and a reference signal independent of the concentration of the measurement target gas, and estimates the concentration of the measurement target gas from the ratio of the signals. [ Prior Art literature ] [ Patent literature ] [ Patent document 1] Japanese patent application laid-open No. 2014-173896 Disclosure of Invention [ Problem to be solved by the invention ] In a semiconductor package having two input terminal pairs connected to respective terminal pairs of two elements outputting a current signal, it is desirable to reduce the size and suppress an increase in measurement error caused by leakage current flowing into or out of the input terminal pairs. [ Means for solving the problems ] The semiconductor package according to one embodiment of the present invention may include a first input terminal pair connected to a terminal pair of a first light receiving element that outputs a first current signal corresponding to a light receiving amount of light emitted from a light source, and having two terminals disposed adjacent to each other. The semiconductor package may include a second input terminal pair connected to a terminal pair of a second light receiving element that outputs a second current signal corresponding to a light receiving amount of light emitted from the light source, and having two other terminals disposed adjacent to each other. The semiconductor package may include a third terminal disposed adjacent to one of the two terminals constituting the first input terminal pair and one of the other two terminals constituting the second input terminal pair. The semiconductor package may include a generating unit that generates a digital signal based on the first current signal and the second current signal. In the semiconductor package, the first input terminal pair, the second input terminal pair, and the third terminal may be arranged along an outer periphery of the semiconductor package when viewed from a mounting surface of the semiconductor package. In any one of the semiconductor packages, the first input terminal pair, the second input terminal pair, and the third terminal may be arranged along a first side of an outer periphery of the semiconductor package when viewed from a mounting surface of the semiconductor package. In any one of the semiconductor packages, the first input terminal pair, the second input terminal pair, and the third terminal may be disposed on a first side of an outer periphery of the semiconductor package when viewed from a mounting surface of the semiconductor package. The semiconductor package may further include a first output terminal for outputting a current to the third element, and a fourth terminal provided between the first output terminal and the other of the other two terminals constituting the second input terminal pair and disposed adjacent to the other of the other two terminals constituting the second input terminal pair. In any one of the semiconductor packages, the first input terminal pair, the second input terminal pair, the third terminal, the first output terminal, and the fourth terminal may be arranged along an outer periphery of the semiconductor package when viewed from a mounting surface of the semiconductor package. In any one of the semiconductor packages, the first input terminal pair, the second input terminal pair, and the third terminal pair may be arranged along a first side of an outer periphery of the semiconductor package when viewed from a mounting surface of the semiconductor package, and the first output terminal may be arranged along a second side of the outer periphery of the semiconductor package different from the first side when viewed from the mounting surface of the semiconductor package. In any one of the semiconductor packages, the first input terminal pair, the second input terminal pair, and the third terminal pair may be disposed on a first side of an outer periphery of the semiconductor package when viewed from a mounting surface of the semiconductor package, and the first output terminal may be disposed on a second side of the outer periphery of the semiconductor package different from the first side when viewed from the mounting surface of the semiconductor package. In any of the semiconductor packages, the third element may be the light source. In any one of the semiconductor packages, the third terminal may be a voltage output terminal that outputs a constant potential. In any one of the semiconductor packages, the second light receiving element may be configured to compensate for a temperature change or an aging change of the first light receiving element. The ph