CN-121994813-A - Welding spot defect detection and report generation system and method

CN121994813ACN 121994813 ACN121994813 ACN 121994813ACN-121994813-A

Abstract

The application discloses a welding spot defect detection and report generation system and method, wherein a control device controls an objective table to move, so that each welding spot on a circuit board to be detected is sequentially located in a shooting area of an image unit, further a mobile unit is controlled to move the image unit, so that the image unit can sequentially shoot images to be detected of each welding spot, and finally a control device can respectively identify whether each welding spot has defects according to the images to be detected of each welding spot, thereby realizing automatic defect detection of the welding spots on the circuit board to be detected. Therefore, the automatic defect detection of the welding spots is realized through the welding spot defect detection and report generation system, the defect detection efficiency and accuracy can be improved, and the defect missing detection can be prevented. The report generating device can acquire the defect detection data packet of the circuit board to be detected, and further generate a defect detection report of the circuit board to be detected according to the defect detection data packet, so that automatic and rapid generation of the report is realized, the step of report generation is effectively simplified, and the efficiency is improved.

Inventors

ZHANG PING
ZHANG GUYAO
FANG BAIKAI
SUN DAIYU
XU JUNSONG
ZHANG LINGZHONG
WANG QINGYUN
Deng Chuwei
CHEN RAN

Assignees

优尔鸿信检测技术(深圳)有限公司
富泰华工业（深圳）有限公司
富士康科技集团有限公司

Dates

Publication Date: 20260508
Application Date: 20260402

Claims (20)

1. A weld defect detection and report generation system, comprising: The device comprises an image device, a moving unit and an image unit, wherein the image device comprises an objective table, a moving unit and an image unit, the objective table is used for placing a circuit board to be tested which is subjected to color dip dyeing and separation treatment in advance, the moving unit is connected with the image unit and is used for moving the image unit, the image unit is arranged opposite to one surface of the objective table where the circuit board to be tested is placed, and the image unit is used for obtaining an image to be tested of a welding spot in the circuit board to be tested; The control device is used for controlling the object stage to move so that each welding spot on the circuit board to be tested sequentially moves to a shooting area of the image unit, controlling the moving unit to move the image unit and the image unit to shoot the image to be tested, receiving the image to be tested of each welding spot on the circuit board to be tested, identifying whether defects exist in the corresponding welding spot according to the image to be tested, storing defect identification data of the circuit board to be tested to form a defect detection data packet, and And the report generation device is connected with the control device and is used for acquiring the defect detection data packet and generating a defect detection report of the circuit board to be tested according to the defect detection data packet.
2. The welding spot defect detection and report generation system according to claim 1, wherein the report generation device comprises a data input unit, a core service unit and a report generation unit, the data input unit is connected with the control device and the core service unit, the core service unit is connected with the report generation unit in a communication mode, the data input unit is used for calling the defect detection data packet from the control device and sending the defect detection data packet to the core service unit, the core service unit is used for analyzing the defect detection data packet to obtain the defect identification data of each welding spot and sending the defect identification data to the report generation unit, and the report generation unit is used for generating the defect detection report according to the defect identification data.
3. The spot weld defect detection and report generation system of claim 2, wherein the data input unit is further configured to receive externally input spot weld data and send the spot weld data to the core service unit.
4. The spot weld defect detection and report generation system of claim 2, further comprising a data processing unit coupled to the data input unit, the core business unit, and the control device, the data processing unit configured to: Acquiring a low-magnification image and a high-magnification image of the circuit board to be tested; calculating the coordinate mapping relation of the high-magnification image in the low-magnification image, and generating a labeling image according to the coordinate mapping relation; the marked image is sent to the core service unit; The core business unit is further configured to send the labeling image to the report generating unit, and the report generating unit is further configured to generate the defect detection report according to the labeling image and the defect identification data.
5. The solder joint defect detection and report generation system of claim 1, wherein the control device is further configured to control the stage to move in a horizontal direction and to control the imaging unit to obtain a complete visual image of the circuit board under test.
6. The welding spot defect detection and report generation system according to claim 5, wherein the image unit comprises a first objective lens and a second objective lens, the magnification of the first objective lens is smaller than that of the second objective lens, the first objective lens is used for scanning and shooting the circuit board to be detected to obtain the complete visual image, and the second objective lens is used for shooting the image to be detected of each welding spot in the circuit board to be detected in the vertical direction.
7. The spot weld defect inspection and report generation system of claim 1, wherein the imaging device further comprises an optical diffraction unit disposed opposite the surface of the stage on which the circuit board under test is disposed, the optical diffraction unit configured to provide a colored light source for the circuit board under test.
8. The spot weld defect detection and report generation system of claim 7, wherein the imaging device further comprises an intelligent light source for providing illumination for the imaging unit.
9. The welding spot defect detection and report generation system of claim 1, wherein the imaging unit is further configured to capture a plurality of images to be tested for a same welding spot, and wherein the control device comprises an AI vision processing unit configured to: Performing image synthesis processing on a plurality of images to be detected corresponding to the same welding spot to obtain an image to be identified corresponding to the welding spot; Performing defect identification on the image to be identified, and confirming the cross section area and the dyeing area of the welding spot; And calculating the penetration and dyeing ratio of the welding spots according to the areas of the cross-section area and the dyeing area.
10. The weld defect detection and report generating system of any of claims 1 to 9, further comprising: And the quality tracking device is connected with the control device or the report generation device and is used for acquiring the defect identification data and generating a quality tracking report according to the defect identification data and the quality standard.
11. The welding spot defect detection and report generation system of claim 10, wherein the quality tracking device comprises a matching unit and a quality tracking unit, the matching unit is connected with the quality tracking unit, the matching unit is used for acquiring a defect detection data packet, searching whether a quality standard matched with the defect detection data packet exists in a quality standard database, and if so, sending the defect detection data packet to the quality tracking unit, wherein the defect detection data packet comprises the defect identification data, and the quality tracking unit is used for analyzing the defect detection data packet to obtain the defect identification data and generating a quality tracking report according to the defect identification data obtained by analysis and the quality standard.
12. A weld defect detection and report generation system, comprising: The device comprises an image device, a moving unit and an image unit, wherein the image device comprises an objective table, a moving unit and an image unit, the objective table is used for placing a circuit board to be tested which is subjected to color dip dyeing and separation treatment in advance, the moving unit is connected with the image unit and is used for moving the image unit, the image unit is arranged opposite to one surface of the objective table where the circuit board to be tested is placed, and the image unit is used for obtaining an image to be tested of a welding spot in the circuit board to be tested; The control device is used for controlling the object stage to move so that each welding spot on the circuit board to be tested sequentially moves to a shooting area of the image unit, controlling the moving unit to move the image unit and the image unit to shoot the image to be tested, receiving the image to be tested of each welding spot on the circuit board to be tested, identifying whether defects exist in the corresponding welding spot according to the image to be tested, storing defect identification data of the circuit board to be tested to form a defect detection data packet, and And the quality tracking device is connected with the control device and is used for acquiring the defect identification data and generating a quality tracking report according to the defect identification data and the quality standard.
13. The welding spot defect detection and report generation method is applied to a welding spot defect detection and report generation system and is characterized by comprising an image device, a control device and a report generation device, wherein the image device comprises a stage, a moving unit and an image unit, the stage is used for placing a circuit board to be detected which is subjected to color dip-dyeing and separation treatment in advance, the moving unit is connected with the image unit and is used for moving the image unit, the control device is connected with the moving unit and the image unit, the control device and the report generation device are used for executing the welding spot defect detection and report generation method, and the welding spot defect detection and report generation method comprises the following steps: Controlling the objective table to move so that each welding spot on the circuit board to be tested sequentially moves to a shooting area of the image unit; Controlling the moving unit to move the image unit and controlling the image unit to shoot an image to be detected of the welding spot; Identifying whether the welding spot has defects according to the image to be detected, and storing defect identification data of the circuit board to be detected to form a defect detection data packet; acquiring the defect detection data packet; and generating a defect detection report of the circuit board to be detected according to the defect identification data in the defect detection data packet.
14. The solder joint defect detection and report generation method of claim 13, wherein the generating a defect detection report of the circuit board under test based on the defect identification data in the defect detection packet comprises: Performing data analysis on the defect detection data packet to obtain the defect identification data of each welding spot of the circuit board to be tested; And generating the defect detection report according to the defect identification data of each welding spot.
15. The method for detecting and reporting defects of a solder joint according to claim 13, further comprising: Acquiring a low-magnification image and a high-magnification image of the circuit board to be tested; and calculating the coordinate mapping relation of the high-magnification image in the low-magnification image, and generating a labeling image according to the coordinate mapping relation.
16. The method of solder joint defect detection and report generation of claim 13, wherein the solder joint defect detection and report generation method further comprises: Controlling the objective table to move along the horizontal direction; In the moving process of the objective table, controlling the image unit to shoot the circuit board to be tested so as to acquire a complete visual image of the circuit board to be tested; acquiring the position coordinates of each welding point in the circuit board to be tested according to the complete visual image; The controlling the stage to move, so that each welding spot on the circuit board to be tested moves to the shooting area of the image unit in sequence, includes: and controlling the objective table to sequentially move each welding spot to the shooting area of the image unit according to the position coordinates of each welding spot.
17. The method for detecting and generating a report of a solder joint defect according to claim 16, wherein controlling the moving unit to move the image unit and controlling the image unit to capture an image to be detected of the solder joint comprises: Controlling the moving unit to move the image unit in a preset step along the vertical direction; And when the image unit is moved each time, controlling the image unit to automatically focus the welding spots, and shooting a plurality of images to be detected of the welding spots.
18. The method for detecting and generating a report of a solder joint defect according to claim 17, wherein said identifying whether the solder joint has a defect based on the image to be detected comprises: Confirming the stepping times when the image unit is focused successfully; and confirming the fracture level of the welding spot according to the step times.
19. The method for detecting and generating a report of a solder joint defect according to claim 18, wherein said identifying whether the solder joint has a defect based on the image to be detected, further comprises: Performing image synthesis processing on a plurality of images to be detected corresponding to the welding spots to obtain images to be identified; Performing defect identification on the image to be identified, and confirming the cross section area and the dyeing area of the welding spot; Calculating the penetration and dyeing ratio of the welding spots according to the areas of the cross section area and the dyeing area; and confirming whether the welding spots have defects or not according to the penetration ratio and the fracture level.
20. The method for detecting and generating a report of a solder joint defect according to any one of claims 16 to 19, wherein controlling the imaging unit to capture the circuit board to be tested during the movement of the stage to obtain the complete visual image of the circuit board to be tested comprises: in the moving process of the objective table, controlling the image unit to scan and shoot the circuit board to be tested to obtain a plurality of visual images; and carrying out fusion and splicing treatment on the visual images to obtain the complete visual image.

Description

Welding spot defect detection and report generation system and method Technical Field The application relates to the technical field of circuit board detection, in particular to a welding spot defect detection and report generation system and method. Background Defect detection of printed circuit board assemblies (Printed Circuit Board Assembly, PCBA) is a key element in the manufacturing process of electronic products. At present, a red ink test method is adopted for detecting the defects of welding spots on a printed circuit board, the circuit board is placed in red ink for dip dyeing, the circuit board is forcedly separated from electronic elements on the circuit board after being dried, then the dip dyeing condition of each welding spot is observed manually, and whether the welding spot is broken or not is judged according to the interface color state of a cracking part. The manual visual inspection mode is influenced by subjective factors, micron-sized fine defects are difficult to observe, the detection efficiency and accuracy of welding spot defects are low, and the omission ratio is high. And whether the welding spot is broken or not is judged manually, then the detection data of the welding spot is recorded manually, and the recorded data is tidied manually to generate a detection report, so that the process is complicated and the efficiency is low. Disclosure of Invention The application mainly aims to provide a welding spot defect detection and report generation system and method, and aims to solve the problems of low detection efficiency and accuracy, high omission rate, complicated sorting and report process and low efficiency of welding spot defects in the prior art. The first aspect of the present application provides a welding spot defect detection and report generation system, comprising: The imaging device comprises an objective table, a moving unit and an imaging unit; The device comprises an objective table, a moving unit, an image unit, a detection unit and a detection unit, wherein the objective table is used for placing a circuit board to be detected which is subjected to color dip dyeing and separation in advance; The control device is used for controlling the object stage to move so that each welding spot on the circuit board to be tested sequentially moves to a shooting area of the image unit, controlling the moving unit to move the image unit and the image unit to shoot the image to be tested, receiving the image to be tested of each welding spot on the circuit board to be tested, identifying whether defects exist in the corresponding welding spot according to the image to be tested, storing defect identification data of the circuit board to be tested to form a defect detection data packet, and And the report generation device is connected with the control device and is used for acquiring the defect detection data packet and generating a defect detection report of the circuit board to be tested according to the defect detection data packet. Therefore, the control device can control the object stage to move, so that each welding spot on the circuit board to be tested is sequentially located in the shooting area of the image unit, the moving unit is further controlled to move the image unit, the image unit can sequentially shoot the image to be tested of each welding spot, and finally the control device can respectively identify whether each welding spot has defects according to the image to be tested of each welding spot, so that automatic defect detection of the welding spots on the circuit board to be tested is realized. Therefore, the automatic defect detection of the welding spots is realized through the welding spot defect detection and report generation system, the defect detection efficiency and accuracy can be improved, and the defect missing detection can be prevented. The report generating device can acquire the defect detection data packet of the circuit board to be detected, and further generate a defect detection report of the circuit board to be detected according to the defect detection data packet, so that automatic and rapid generation of the report is realized, the step of report generation is effectively simplified, and the efficiency is improved. As an optional implementation manner of the first aspect, the report generating device includes a data input unit, a core service unit and a report generating unit, the data input unit is connected with the control device and the core service unit, the core service unit is connected with the report generating unit in a communication manner, the data input unit is used for calling the defect detection data packet from the control device and sending the defect detection data packet to the core service unit, the core service unit is used for analyzing the defect detection data packet to obtain the defect identification data of each welding spot and sending the defect identification data to the report generating unit, and t