Search

CN-121994820-A - Packaged chip top detection device and working method thereof

CN121994820ACN 121994820 ACN121994820 ACN 121994820ACN-121994820-A

Abstract

The invention belongs to the technical field of electrical elements, and particularly relates to a test in a manufacturing process, in particular to a packaged chip top detection device and a working method thereof, wherein the packaged chip top detection device is provided with a heat dissipation strip on a step surface corresponding to a red light array, a plurality of through holes are formed in the side wall of the heat dissipation strip, deformation pieces are arranged in the through holes, and the deformation pieces are heated and deformed to adjust the internal section shape of the heat dissipation strip so as to enhance the heat dissipation effect, so that the heat dissipation effect at the position is improved after the temperature of the red light array is increased, and the problem that the luminous performance of the red light array is influenced due to overhigh temperature is solved.

Inventors

  • LU GUANGXIANG
  • CAI YUBO
  • LI PENGJIE

Assignees

  • 赛密特思半导体技术(苏州)有限公司

Dates

Publication Date
20260508
Application Date
20260410

Claims (10)

  1. 1. A packaged chip top inspection device, comprising: A light source mechanism (1), and a heat dissipation mechanism (2) disposed on the light source mechanism (1), the heat dissipation mechanism (2) being configured to enhance a heat dissipation effect of the red light array (14) in the light source mechanism (1); The heat dissipation mechanism (2) comprises a heat dissipation strip (21) with an open top; the radiating strips (21) are arranged on the step surfaces (12) corresponding to the red light arrays (14); A plurality of through holes (22) are formed in the side wall of the radiating strip (21), and deformation pieces (23) are arranged in the through holes (22); The deformation piece (23) is suitable for being deformed by heat to adjust the internal cross-sectional shape of the heat dissipation strip (21) so as to enhance the heat dissipation effect.
  2. 2. The packaged chip top detection apparatus of claim 1, wherein: the deformation members (23) are made of memory metal, and the deformation directions of adjacent deformation members (23) are opposite; the deformation piece (23) protrudes to the inside or the outside of the heat dissipation strip (21) during deformation; the deformation piece (23) is connected with the inner wall of the through hole (22) through a flexible material (24) so as to seal the through hole (22).
  3. 3. The packaged chip top detection apparatus of claim 2, wherein: When part of the deformation piece (23) is heated to bulge towards the inside of the heat dissipation strip (21), the shape of the section of the inside of the heat dissipation strip (21) is changed, and the width of the inside of the heat dissipation strip (21) at the corresponding position is reduced, so that the gas flow rate at the corresponding position is improved, and the heat dissipation effect is enhanced.
  4. 4. The packaged chip top detection apparatus of claim 2, wherein: the number of deformation pieces (23) protruding towards the inside of the heat dissipation strip (21) is the same as the number of deformation pieces (23) protruding towards the outside of the heat dissipation strip (21), so that the volume of the inner space of the heat dissipation strip (21) is kept unchanged when the deformation pieces (23) deform.
  5. 5. The packaged chip top detection apparatus of claim 2, wherein: When the deformation piece (23) protrudes to the outside of the heat dissipation strip (21) and contacts with the side wall of the second-layer bench surface (12) in the light source mechanism (1), if the internal temperature of the heat dissipation strip (21) is higher than the temperature of the second-layer bench surface (12), heat is transferred to the second-layer bench surface (12), and if the internal temperature of the heat dissipation strip (21) is lower than the temperature of the second-layer bench surface (12), heat in the second-layer bench surface (12) is absorbed.
  6. 6. The packaged chip top detection apparatus of claim 1, wherein: the light source mechanism (1) comprises a mounting frame (11); the bottom surface of the mounting frame (11) is arranged in an open manner; Three layers of step surfaces (12) are arranged on the outer wall of the mounting frame (11), annular mounting areas (13) are arranged at corresponding positions of the step surfaces (12) on the inner wall of the mounting frame (11), and red light arrays (14), green light arrays (15) and blue light arrays (16) are sequentially arranged in the three layers of annular mounting areas (13) from bottom to top.
  7. 7. The packaged chip top detection apparatus of claim 6, wherein: The mounting frame (11) is connected with the shell (3); A shooting module is arranged in the shell (3), and the shooting module is positioned above the mounting frame (11); The shooting module, the red light array (14), the green light array (15) and the blue light array (16) are electrically connected with the control module; The control module is configured to control the red light array (14), the green light array (15) and the blue light array (16) to provide corresponding light sources according to a required detection chip packaging form, and to control the shooting module to shoot images so as to detect the chip packaging according to the images.
  8. 8. The packaged chip top detection apparatus of claim 7, wherein: A plurality of heat dissipation holes (31) are formed in the side wall of the shell (3); a fan electrically connected with the control module is arranged in the shell (3); The fan is positioned in the space above the mounting frame (11) in the shell (3); The control module is configured to control the fan to work for heat dissipation.
  9. 9. A method of operation employing the packaged chip top inspection apparatus of claim 1, comprising: the deformation piece (23) is deformed by heating to adjust the internal cross-sectional shape of the heat dissipation strip (21) so as to enhance the heat dissipation effect; When part of the deformation piece (23) is heated and protrudes towards the inside of the heat dissipation strip (21), the shape of the section of the inside of the heat dissipation strip (21) is changed, and the width of the inside of the heat dissipation strip (21) at the corresponding position is reduced, so that the gas flow rate at the corresponding position is improved, and the heat dissipation effect is enhanced; When the deformation piece (23) protrudes to the outside of the heat dissipation strip (21) and contacts with the side wall of the second-layer bench surface (12) in the light source mechanism (1), if the internal temperature of the heat dissipation strip (21) is higher than the temperature of the second-layer bench surface (12), heat is transferred to the second-layer bench surface (12), and if the internal temperature of the heat dissipation strip (21) is lower than the temperature of the second-layer bench surface (12), heat in the second-layer bench surface (12) is absorbed.
  10. 10. The method of operation of claim 9, wherein: The red light array (14), the green light array (15) and the blue light array (16) are controlled by the control module to provide corresponding light sources according to the required detection chip packaging form, and the shooting module is controlled to shoot images so as to detect the chip packaging according to the images.

Description

Packaged chip top detection device and working method thereof Technical Field The invention belongs to the technical field of electrical elements, in particular relates to a test in a manufacturing process, and particularly relates to a packaged chip top detection device and a working method thereof. Background In the field of semiconductor manufacturing and package inspection, BGA (ball grid array), QFP (quad flat package), and QFN (leadless quad flat package) are the most widely used three types of chip packages, and the top package quality directly determines the electrical performance, mechanical reliability, and service life of the chip, so that stringent requirements are put on high-precision visual inspection of the chip top package. The core requirement of chip top package inspection is to accurately identify scratches, dirt, cracks on the surface of the package body, and morphological defects of solder Balls (BGA), pins (QFP), and pads (QFN), which requires that an RGB three-color lighting system be relied on to provide uniform, stable, and adaptable light source support of different package materials. The RGB three-color illumination is a core component for chip top packaging visual detection because the brightness ratio of red light, green light and blue light can be used for adapting to the reflection characteristics of different chip packaging materials, wherein the reflection contrast of red light to metal solder balls and bonding pads is strongest, and the red light is the dominant light for BGA and QFN detection, the green light is used for adapting to packaging resin and a silicon substrate, and the QFP pins and the packaging body are both detected, and the blue light is used for identifying micro defects such as micro scratches, dirt and the like. Based on the above, the detection device generally needs to set three independent red light, green light and blue light groups, and the number of the lamp beads of each group of modules needs to be reasonably configured according to the detection requirements of three chips, wherein the red light is used as the dominant light, and the maximum number of the lamp beads needs to be configured to ensure the detection contrast and brightness. Meanwhile, for adapting to the structural layout of equipment, three groups of modules are generally arranged in a vertical lamination mode, and the radiators are arranged at the uppermost layer, so that the red light module serving as the dominant light is always at the lowermost layer, is farthest from the radiator, has the worst radiating condition, and is easy to cause the problems of heat accumulation and light pearl attenuation acceleration. In addition, the red light LED has the worst heat resistance, and can cause light power drift and wavelength deviation in a high-temperature environment for a long time, so that the detection contrast and accuracy are directly affected, and if the heat dissipation is excessively enhanced, for example, a high-power fan and the like are directly adopted to enhance the heat dissipation effect, the temperature of the red light module is excessively low, the temperature drift is caused, and the detection stability is also damaged. Therefore, due to the technical problem that the light emission of the red light module is affected by temperature in the detection process, so that the detection stability is affected, a top detection device of the packaged chip and a working method thereof are required to be designed. It should be noted that the above information disclosed in this background section is only for understanding the background of the inventive concept and therefore the above description is not to be construed as constituting prior art information. Disclosure of Invention The embodiment of the disclosure at least provides a packaged chip top detection device and a working method thereof. In a first aspect, an embodiment of the present disclosure provides a packaged chip top detection apparatus, including: The LED lamp comprises a light source mechanism and a heat dissipation mechanism arranged on the light source mechanism, wherein the heat dissipation mechanism is configured to enhance the heat dissipation effect of a red light array in the light source mechanism; the heat dissipation mechanism comprises a heat dissipation strip with an open top; the radiating strips are arranged on the step surfaces corresponding to the red light arrays; a plurality of through holes are formed in the side wall of the radiating strip, and deformation pieces are arranged in the through holes; The deformation piece is suitable for being heated and deformed to adjust the internal cross section shape of the radiating strip so as to enhance the radiating effect. In an alternative embodiment, the deformation members are made of memory metal, and the deformation directions of adjacent deformation members are opposite; The deformation piece protrudes to the inside or the outside of the heat