CN-121994864-A - Heat exchange test device, preparation method thereof, measurement method and measurement system

CN121994864ACN 121994864 ACN121994864 ACN 121994864ACN-121994864-A

Abstract

The application relates to the technical field of enhanced heat transfer, and provides a heat exchange test device, a preparation method, a measurement method and a system thereof; the heat exchange metal layer is filled in the pipe hole gap, and the thickness of the heat exchange metal layer is 1-1000 mu m. According to the heat exchange test device provided by the application, the heat exchange metal layer made of metal is filled in the pore gap, so that the micro-scale pore gap is effectively filled, the contact thermal resistance of the gap is obviously reduced, the heat transfer efficiency in a high-temperature environment is improved, and the heat exchange test requirement of a high-temperature scene can be met.

Inventors

WANG TIANMI
XU JIANJUN
YOU ERSHENG
YUAN DEWEN
LI YIYI
HU QIANG

Assignees

中国核动力研究设计院

Dates

Publication Date: 20260508
Application Date: 20260209

Claims (10)

1. A heat exchange test device, comprising: The heat exchange piece is provided with at least one heat exchange hole, and the heat exchange hole is used for accommodating the heat pipe; the pipe hole gap is positioned between the heat pipe and the heat exchange hole; And the heat exchange metal layer is filled in the pore gap, and the thickness of the heat exchange metal layer is 1-1000 mu m.
2. The heat exchange test device according to claim 1, wherein the heat exchange metal layer comprises nickel and/or titanium.
3. A method for manufacturing a heat exchange test device according to claim 1 or 2, comprising the steps of: Inserting the heat pipe into the heat exchange hole of the heat exchange piece; and filling metal particles into the pipe hole gaps between the heat pipe and the heat exchange holes to obtain a heat exchange metal layer.
4. A method of manufacturing a heat exchange test device according to claim 3, wherein the step of filling metal particles into the tube hole gap between the heat tube and the heat exchange hole to obtain a heat exchange metal layer comprises: Filling first metal particles into pipe hole gaps between the heat pipe and the heat exchange holes at least once, and drying to obtain a first filling layer, wherein the first metal particles are nickel and/or titanium, and the particle size of the first metal particles is 5-200 nm; performing first heat treatment on the first filling layer under a first vacuum condition to obtain a first curing layer; Vacuumizing the first curing layer, and filling second metal particles into the first curing layer at least once to obtain a second filling layer, wherein the second metal particles are nickel and/or titanium, and the particle size of the second metal particles is 5-200 nm; and carrying out second heat treatment on the second filling layer under a second vacuum condition to obtain the heat exchange metal layer.
5. A method for measuring the heat exchange interface temperature characteristics of the heat exchange test device of claim 1 or 2, comprising the steps of: Placing the heat exchange test device in a heat preservation environment; heating the heat pipe to a preset temperature; Measuring the temperature in the tube wall of the heat tube and the temperature in the heat exchange wall of the heat exchange member; and determining the temperature characteristic of a heat exchange interface of the heat exchange test device according to the temperature in the pipe wall of the heat pipe, the temperature in the heat exchange wall of the heat exchange piece and the structural parameters of the heat exchange test device.
6. The method of measuring of claim 5, wherein the step of measuring the temperature in the tube wall of the heat tube and the temperature in the heat exchange wall of the heat exchange member comprises: A first temperature measuring point and a second temperature measuring point are arranged in the pipe wall of the heat pipe, and a third temperature measuring point and a fourth temperature measuring point are arranged in the heat exchange wall of the heat exchange piece; And measuring the temperatures of the first temperature measuring point, the second temperature measuring point, the third temperature measuring point and the fourth temperature measuring point.
7. The method of measuring according to claim 6, wherein the step of determining the heat exchange interface temperature characteristic of the heat exchange test device based on the temperature in the tube wall of the heat tube, the temperature in the heat exchange wall of the heat exchange member, and the structural parameters of the heat exchange test device comprises: according to the radius of the first temperature measuring point The temperature of the first temperature measuring point Radius of the second temperature measuring point The temperature of the second temperature measuring point Outer radius of the heat pipe Determining an outer wall temperature of the heat pipe The temperature of the outer wall of the heat pipe ; According to the radius of the third temperature measuring point The temperature of the third temperature measuring point Radius of the fourth temperature measuring point The temperature of the fourth temperature measuring point Radius of heat exchange hole Determining the temperature of the inner wall of the heat exchange piece The temperature of the inner wall of the heat exchange piece ; According to the temperature of the outer wall of the heat pipe And the temperature of the inner wall of the heat exchange piece And determining the temperature characteristic of the heat exchange interface.
8. The method of measuring of claim 7, wherein the heat exchange interface temperature characteristic comprises: The interface average temperature and the interface average temperature difference of the heat exchange metal layer, wherein, The average temperature of the interface is the temperature of the outer wall of the heat pipe And the temperature of the inner wall of the heat exchange piece Average value of (2); the average temperature difference of the interface is the temperature of the outer wall of the heat pipe And the temperature of the inner wall of the heat exchange piece Is a difference in (c).
9. The method according to claim 5, wherein the predetermined temperature is 800-1200 ℃.
10. A measurement system, comprising: the heat exchange test device according to claim 1 or 2; The heat preservation device is used for accommodating the heat exchange test device and providing a heat preservation environment; The heating piece is used for heating the heat pipe; A temperature measuring assembly for measuring a temperature in a tube wall of the heat pipe and a temperature in a heat exchange wall of the heat exchange member; And the temperature characteristic calculation module is used for determining the temperature characteristic of a heat exchange interface of the heat exchange test device according to the temperature in the pipe wall of the heat pipe, the temperature in the heat exchange wall of the heat exchange piece and the structural parameters of the heat exchange test device.

Description

Heat exchange test device, preparation method thereof, measurement method and measurement system Technical Field The application relates to the technical field of enhanced heat transfer, in particular to a heat exchange test device, a preparation method, a measurement method and a system thereof. Background With the rapid development of modern industrial technology to high precision, high power and extreme environment adaptation, the efficient heat transfer technology has become a core bottleneck restricting technological breakthroughs in a plurality of key fields. In the field of aerospace, a spacecraft is in an extremely high-temperature environment when entering the atmosphere, a reliable thermal control system is required to ensure structural safety, in the field of energy power, high heat flux density heat transfer requirements exist when equipment such as a heat pipe pile, an advanced engine and the like are operated, whether heat of a core component can be quickly and effectively transferred directly influences system efficiency and service life or not, in the field of electronic devices, the heat dissipation problem of equipment such as a high-integration chip, a high-power laser and the like is increasingly outstanding, and the performance and stability of the device can be seriously influenced by the excessive temperature. The micro-scale structure has great potential in enhancing heat transfer due to the unique geometric characteristics, and becomes a key technical direction for solving the problems of high heat flow density and extreme environmental thermal control. Microscale pore gaps generally refer to channel or pore structures with dimensions on the order of microns to millimeters, whose heat transfer mechanisms differ significantly from those of conventional dimensions. In a high-temperature environment, microscale effects (including surface effects, viscous dissipation, heat radiation enhancement, molecular free path effects and the like) have particularly prominent influence on heat transfer performance, so that the traditional heat transfer theory and method based on a macroscopic scale are difficult to directly apply. Under the non-vacuum condition, air is filled in gaps of the microscale pipe holes, when heat passes through, obvious temperature jump phenomenon occurs at the interfaces of the gaps, and the phenomenon can seriously obstruct heat transfer, namely gap contact thermal resistance is formed. The heat transfer efficiency can be greatly reduced due to the existence of the contact thermal resistance, so that heat is locally accumulated, and the normal operation of equipment is further influenced, and even potential safety hazards are caused. Disclosure of Invention In order to solve the problems in the prior art, the application provides a heat exchange test device, a preparation method, a measurement method and a system thereof. The technical problems to be solved by the application are realized by the following technical scheme: a first aspect of the present application provides a heat exchange test device comprising: the heat exchange piece is provided with at least one heat exchange hole, and the heat exchange hole is used for accommodating the heat pipe; the pipe hole gap is positioned between the heat pipe and the heat exchange hole; And the heat exchange metal layer is filled in the pore gaps, and the thickness of the heat exchange metal layer is 1-1000 mu m. In one implementation, the heat exchange metal layer comprises nickel and/or titanium. The second aspect of the application provides a method for preparing the heat exchange test device provided by the first aspect of the application, which comprises the following steps: Inserting the heat pipe into the heat exchange hole of the heat exchange piece; And filling metal particles into the pipe hole gaps between the heat pipe and the heat exchange holes to obtain the heat exchange metal layer. In one possible implementation, the step of filling metal particles into the pore gap between the heat pipe and the heat exchange hole to obtain a heat exchange metal layer includes: Filling first metal particles into the pipe hole gaps between the heat pipe and the heat exchange holes at least once, and drying to obtain a first filling layer, wherein the first metal particles are nickel and/or titanium, and the particle size of the first metal particles is 5-200 nm; performing first heat treatment on the first filling layer under a first vacuum condition to obtain a first curing layer; vacuumizing the first curing layer, and filling second metal particles into the first curing layer at least once to obtain a second filling layer, wherein the second metal particles are nickel and/or titanium, and the particle size of the second metal particles is 5-200 nm; and carrying out second heat treatment on the second filling layer under a second vacuum condition to obtain the heat exchange metal layer. The second aspect of the application