CN-121994871-A - Packaged product and detection method thereof

Abstract

The invention provides a packaged product and a detection method thereof, wherein the packaged product comprises a substrate, a component arranged on the substrate, a piezoelectric sensitive film arranged on the surface of the component, and a plastic package body for packaging the component and the piezoelectric sensitive film, an antenna assembly is etched on the surface of the piezoelectric sensitive film, the piezoelectric sensitive film is used for generating induction current related to defects of the plastic package body and sending the induction current to an external data processing module through the antenna assembly, and the data processing module is used for determining defect information of the plastic package body according to the induction current and preset parameters. The invention can realize high-precision online defect detection of the product without damaging the product.

Inventors

• CAO GUIMING

Assignees

• 歌尔微电子股份有限公司

Dates

Publication Date

20260508

Application Date

20251230

Claims (10)

1. 1. A packaged product is characterized by comprising a substrate, components arranged on the substrate, a piezoelectric sensitive film arranged on the surface of the components and a plastic package body for packaging the components and the piezoelectric sensitive film, An antenna component is etched on the surface of the piezoelectric sensitive film; The piezoelectric sensitive film is used for generating induction current related to the defect of the plastic package body and sending the induction current to an external data processing module through the antenna component; The data processing module is used for determining defect information of the plastic package body according to the induced current and preset parameters.
2. 2. The packaged product of claim 1 wherein, When at least two components are arranged, different identification information is arranged on the piezoelectric sensitive films corresponding to different components; And the data processing module determines defect information of the plastic package body based on the identification information and the induced current corresponding to the identification information.
3. 3. The packaged product of claim 2 wherein, The defect information includes crack size, stress level, and spatial coordinates.
4. 4. The packaged product of claim 1 wherein, The antenna assembly adopts array distributed spiral coils, and the center-to-center distance range of adjacent coils is 150-250 mu m.
5. 5. The packaged product of claim 1 wherein, The preset parameters are built in the data processing module, and The data processing module is in non-contact coupling with the antenna assembly through the NFC reader-writer so as to acquire the induction current.
6. 6. A method for real-time on-line inspection of a packaged product according to any one of claims 1 to 5, the method comprising: Acquiring induction current related to the defects of the packaged product through the piezoelectric sensitive film, and sending the induction current to an external data processing module through the antenna assembly; And the data processing module determines defect information of the plastic package body of the packaged product according to the induced current and preset parameters.
7. 7. The method of inspecting packaged products of claim 6, The data processing module determines defect information of the plastic package body according to the induced current and preset parameters, and comprises the following steps: Carrying out optimization processing on the induced current, and carrying out Fourier transformation on the optimized signal to obtain a frequency domain signal corresponding to the induced current; Filtering the frequency domain signal, and obtaining the impedance amplitude and the resonant frequency of the processed signal; And respectively acquiring the impedance amplitude and cosine similarity between the resonant frequency and the preset parameter, and determining the defect information.
8. 8. The method of claim 7, wherein the data processing module is coupled to the antenna assembly via an NFC reader/writer in a contactless manner to obtain the induced current, and wherein after determining the defect information, further comprises: And carrying out coordinate optimization on the defect information according to the coordinate information of the antenna assembly in the plastic package body and the mapping relation between the antenna assembly and the NFC reader.
9. 9. The packaged product testing method of claim 7, wherein optimizing said induced current comprises: And performing time domain truncation on the signals subjected to threshold denoising, and removing transitional interference signals at the head part and the tail part of the signals.
10. 10. The packaged product detection method of claim 8, wherein obtaining the induced current by the NFC reader/writer comprises: and acquiring a time domain current signal within a preset time period according to a preset sampling frequency, and taking the time domain current signal as the induced current.

Description

Packaged product and detection method thereof Technical Field The invention relates to the technical field of electronic product packaging detection, in particular to a packaged product and a detection method thereof. Background At present, in the SIP packaging process of electronic products, internal stress problems are usually highlighted due to high-density integration, and in particular, cracks or layering defects are easily generated at the interface of packaging materials, and the defects are core reasons for causing packaging failure, so that the quality and performance of the products are affected. The traditional nondestructive testing technology aiming at the defects mainly adopts X-ray testing or ultrasonic testing, wherein the X-frequency domain signal radiation testing has lower detection rate on micron-sized (< 10 mu m) cracks and is less than 40% of frequency domain signals, the ultrasonic testing is easily interfered by metal structures in the package to influence the testing precision, in addition, the two technologies can not realize the accurate positioning of the defect positions, the positioning error is more than 50 mu m, and the nondestructive testing is completed through destructive uncapping verification, and the package rejection rate frequency domain signals after uncapping are 100%, so that the high-quality online testing requirement of a mass production stage can not be met. Disclosure of Invention In view of the above problems, the present invention is directed to a packaged product and a testing method thereof, so as to solve the problem that the defect information of the product can be confirmed only by destructive cap verification of the existing packaged product, and the requirement of high quality on-line testing in the mass production stage can not be met. The invention provides a packaged product, which comprises a substrate, components arranged on the substrate, a piezoelectric sensitive film arranged on the surface of the components and a plastic package body for packaging the components and the piezoelectric sensitive film, wherein, An antenna component is etched on the surface of the piezoelectric sensitive film; The piezoelectric sensitive film is used for generating induction current related to the defect of the plastic package body and sending the induction current to an external data processing module through the antenna component; The data processing module is used for determining defect information of the plastic package body according to the induced current and preset parameters. In addition, the optional technical scheme is that when at least two components are arranged, different identification information is arranged on the piezoelectric sensitive films corresponding to different components; And the data processing module determines defect information of the plastic package body based on the identification information and the induced current corresponding to the identification information. Furthermore, an alternative solution is that the defect information includes crack size, stress level and spatial coordinates. In addition, the selectable technical scheme is that the antenna component adopts array distributed spiral coils, and the center-to-center distance range of adjacent coils is 150-250 μm. Furthermore, an alternative solution is that the preset parameters are built in the data processing module, and The data processing module is in non-contact coupling with the antenna assembly through the NFC reader-writer so as to acquire the induction current. On the other hand, the invention also provides a method for detecting the packaged product, which is used for carrying out real-time online detection on the packaged product, and comprises the following steps: Acquiring induction current related to the defects of the packaged product through the piezoelectric sensitive film, and sending the induction current to an external data processing module through the antenna assembly; And the data processing module determines defect information of the plastic package body of the packaged product according to the induced current and preset parameters. In addition, an optional technical solution is that the data processing module determines defect information of the plastic package body according to the induced current and a preset parameter, including: Carrying out optimization processing on the induced current, and carrying out Fourier transformation on the optimized signal to obtain a frequency domain signal corresponding to the induced current; Filtering the frequency domain signal, and obtaining the impedance amplitude and the resonant frequency of the processed signal; And respectively acquiring the impedance amplitude and cosine similarity between the resonant frequency and the preset parameter, and determining the defect information. In addition, the optional technical scheme is that the data processing module is in non-contact coupling with the antenna assembl