CN-121995079-A - High-performance quartz vibrating beam accelerometer and preparation method thereof

CN121995079ACN 121995079 ACN121995079 ACN 121995079ACN-121995079-A

Abstract

The embodiment of the disclosure discloses a high-performance quartz vibrating beam accelerometer and a preparation method thereof, the high-performance quartz vibrating beam accelerometer comprises a stress amplifying unit and a resonance unit, the stress amplifying unit comprises a first vibrating beam mounting groove and a second vibrating beam mounting groove, the resonance unit comprises a vibrating beam, a first vibrating beam mounting arm, a second vibrating beam mounting arm, a first driving groove and a second driving groove, the first driving groove and the second driving groove are respectively arranged on the upper surface and the lower surface of the vibrating beam, the first vibrating beam mounting arm and the second vibrating beam mounting arm are respectively arranged at two ends of the vibrating beam, and the first vibrating beam mounting arm and the second vibrating beam mounting arm are respectively embedded in the first vibrating beam mounting groove and the second vibrating beam mounting groove, so that the resonance unit is fixedly assembled on the stress amplifying unit, the sensitivity of the quartz vibrating beam accelerometer can be improved, the distance between the positive electrode and the negative electrode can be shortened, and the electric field driving efficiency can be improved.

Inventors

ZHAI YINGBO
ZHANG FUQIANG

Assignees

云际芯光(珠海)微电子有限公司

Dates

Publication Date: 20260508
Application Date: 20260206

Claims (9)

1. The utility model provides a high performance quartz vibrating beam accelerometer, its characterized in that includes stress amplification unit and resonance unit, stress amplification unit includes first vibrating beam mounting groove and second vibrating beam mounting groove, resonance unit includes vibrating beam, first vibrating beam mounting arm, second vibrating beam mounting arm, first drive groove and second drive groove set up respectively in the upper and lower surface of vibrating beam, first vibrating beam mounting arm and second vibrating beam mounting arm set up in the vibrating beam both ends, first vibrating beam mounting arm with second vibrating beam mounting arm is embedded respectively in first vibrating beam mounting groove with in the second vibrating beam mounting groove, make resonance unit fixed assembly is in on the stress amplification unit.
2. The high performance quartz vibrating beam accelerometer of claim 1, wherein the stress amplifying unit further comprises a U-shaped mass load block, a first flexible support beam, a second flexible support beam, an isolation frame, a first connection, a second connection, a base, a first mounting frame, a second mounting frame.
3. The high-performance quartz vibrating beam accelerometer according to claim 2, wherein the first flexible supporting beam and the second flexible supporting beam symmetrically extend out of the top end of the base, the free ends of the first flexible supporting beam and the second flexible supporting beam are fixedly connected with a U-shaped mass load block, the opening of the U-shaped mass load block faces the opening of the base, the vibrating beam is suspended and erected between the U-shaped mass load block and the base, and two ends of the vibrating beam are respectively connected with the bottom end of the opening of the U-shaped mass load block and the bottom end of the opening of the base.
4. The high performance quartz vibrating beam accelerometer of claim 2, wherein the bottom end of the base is connected to the inner side of the isolation frame via the first connection portion, the outer side of the isolation frame is connected to the first mounting frame and the second mounting frame via the second connection portion, and the first mounting frame and the second mounting frame are symmetrically arranged.
5. The high performance quartz vibrating beam accelerometer of claim 1, wherein the first driving groove and the second driving groove are both provided with electrodes on the inner side and the outer side, the polarities of the first groove electrode and the second groove electrode are the same, and the polarities of the first groove electrode and the second groove electrode are opposite to the polarities of the first groove outer electrode and the second groove outer electrode.
6. A method for manufacturing a high-performance quartz vibrating beam accelerometer, which is applied to the high-performance quartz vibrating beam accelerometer according to any one of claims 1 to 5, and is characterized by comprising the following steps: Evaporating the two sides of a quartz wafer to obtain a first metal film, etching the first metal film to obtain the outline of the stress amplifying unit, removing the first metal films on the two sides of the first flexible supporting beam and the second flexible supporting beam, etching the first flexible supporting beam and the second flexible supporting beam by adopting a quartz wet etching process, thinning the first metal films on the surfaces of the first vibration beam mounting groove and the second vibration beam mounting groove, etching the first vibration beam mounting groove and the second vibration beam mounting groove by adopting a quartz wet etching process, and secondarily thinning the first flexible supporting beam and the second flexible supporting beam to obtain the stress amplifying unit; evaporating two sides of another quartz wafer to obtain a second metal film, etching the second metal film to obtain the outline of the resonance unit, removing the second metal films on two sides of the first driving groove and the second driving groove, and etching the first driving groove and the second driving groove by adopting a quartz wet etching process to obtain the resonance unit; Evaporating the surface of the stress amplifying unit and the surface of the resonance unit respectively to obtain a third metal film, uniformly spin-coating photoresist on the surface of the third metal film, forming a photoresist mask with the same size as the electrode on the surface of the stress amplifying unit based on an electrode mask plate, and etching the electrode on the surface of the stress amplifying unit and the surface of the resonance unit respectively by taking the photoresist mask as a masking layer; and bonding the stress amplifying unit and the resonance unit, and communicating the electrode on the stress amplifying unit with the electrode on the resonance unit by using a wire bonding mode, wherein epoxy resin glue added with quartz powder is adopted as a bonding material.
7. The high performance quartz beam accelerometer of claim 6, wherein the first metal film and the second metal film are each composed of a chromium layer and a gold layer, the chromium layer having a thickness of 500 angstroms and the gold layer having a thickness of 2000 angstroms, the chromium layer being disposed between a quartz wafer and the gold layer, the chromium layer being configured to adhere the quartz wafer to the gold layer.
8. The high performance quartz beam accelerometer of claim 6, wherein the thickness of the first flexible support beam and the second flexible support beam is no greater than 20% of the thickness of the U-shaped mass load block along the thickness of the quartz beam accelerometer.
9. The high performance quartz vibrating beam accelerometer of claim 6, wherein the first and second drive grooves have a depth of not less than 30% of the vibrating beam thickness along the thickness of the quartz vibrating beam accelerometer and a length of not less than 80% of the vibrating beam length along the length of the vibrating beam, and wherein the first and second drive grooves have a width of not less than 70% of the vibrating beam width.

Description

High-performance quartz vibrating beam accelerometer and preparation method thereof Technical Field The disclosure relates to the technical field of quartz vibrating beam accelerometer manufacturing, in particular to a high-performance quartz vibrating beam accelerometer and a preparation method thereof. Background The quartz vibrating beam accelerometer is used as a precise inertial sensor, and is widely applied to the field of high-precision inertial measurement by virtue of the advantages of high sensitivity, high stability, low power consumption, strong anti-interference capability and the like. In the prior art, quartz vibrating beam accelerometers are mainly divided into two main types, namely an integrated quartz vibrating beam accelerometer and a split type quartz vibrating beam accelerometer. However, the integrated quartz vibrating beam accelerometer needs to be subjected to deep etching treatment in the processing process, the processing mode easily causes larger surface roughness on the surface of the vibrating beam, and further causes the sensitivity and quality factor of the accelerometer to be reduced, and the quartz tuning fork adopted by the split quartz vibrating beam accelerometer is easy to cause the problems of insufficient sensitivity and poor driving efficiency of the accelerometer due to the inherent double-beam conjugated vibration mode and slotless structural design, and is difficult to meet the use requirement of high-precision inertial measurement. Disclosure of Invention The following is a summary of the subject matter of the detailed description of the present disclosure. This summary is not intended to limit the scope of the claims. The embodiment of the disclosure provides a high-performance quartz vibrating beam accelerometer and a preparation method thereof, which not only can improve the sensitivity of the quartz vibrating beam accelerometer and shorten the distance between the positive electrode and the negative electrode so as to improve the electric field driving efficiency, but also can effectively inhibit the surface roughness degradation of the quartz vibrating beam accelerometer in the preparation process so as to improve the performance stability of the quartz vibrating beam accelerometer. In a first aspect, an embodiment of the present disclosure provides a high performance quartz vibrating beam accelerometer, including stress amplification unit and resonance unit, the stress amplification unit includes first vibrating beam mounting groove and second vibrating beam mounting groove, resonance unit includes vibrating beam, first vibrating beam mounting arm, second vibrating beam mounting arm, first drive groove and second drive groove set up respectively in the upper and lower surface of vibrating beam, first vibrating beam mounting arm and second vibrating beam mounting arm set up in the vibrating beam both ends, first vibrating beam mounting arm with second vibrating beam mounting arm embed respectively in first vibrating beam mounting groove with in the second vibrating beam mounting groove, make resonance unit fixed mounting is in on the stress amplification unit. According to some embodiments of the first aspect of the present application, the stress amplifying unit further comprises a U-shaped mass load block, a first flexible support beam, a second flexible support beam, an isolation frame, a first connection portion, a second connection portion, a base portion, a first mounting frame, a second mounting frame. According to some embodiments of the first aspect of the present application, the top end of the base symmetrically extends out of the first flexible supporting beam and the second flexible supporting beam, the free ends of the first flexible supporting beam and the second flexible supporting beam are fixedly connected with the U-shaped mass loading block, the opening of the U-shaped mass loading block faces the opening of the base, the vibrating beam is suspended and erected between the U-shaped mass loading block and the base, and two ends of the vibrating beam are respectively connected with the bottom end of the opening of the U-shaped mass loading block and the bottom end of the opening of the base. According to some embodiments of the first aspect of the present application, the bottom end of the base is connected to the inner side of the isolation frame via the first connection portion, the outer side of the isolation frame is connected to the first mounting frame and the second mounting frame via the second connection portion, and the first mounting frame and the second mounting frame are symmetrically arranged. According to some embodiments of the first aspect of the present application, the inner and outer sides of the first driving groove and the second driving groove are respectively provided with an electrode, the polarities of the first in-groove electrode and the second in-groove electrode are the same, and the polarities of the first in-