CN-121995089-A - Probe structure and inspection device

Abstract

The invention provides a probe structure and an inspection device capable of obtaining the matching of characteristic impedance of a connection terminal serving as a relay point of a signal circuit. A probe structure for transmitting and receiving a high-frequency signal to and from an object to be inspected via a contact portion that is in electrical contact with an electrode of the object to be inspected, the probe structure comprising a main body portion, a substrate holding portion having a wiring substrate on one surface and the other surface fixed to the main body portion, a connector that is joined to the wiring substrate of the substrate holding member and connects the wiring of the wiring substrate and a coaxial cable via a connection terminal, and an impedance adjusting portion that adjusts a gap between the connector and the connection terminal to perform impedance matching.

Inventors

• Cheng Tiancong
• Koizawa Chong

Assignees

• 日本麦可罗尼克斯股份有限公司

Dates

Publication Date

20260508

Application Date

20251103

Priority Date

20241105

Claims (6)

1. 1. A probe structure for transmitting and receiving a high-frequency signal to and from an object to be inspected via a contact portion that is in electrical contact with an electrode of the object to be inspected, the probe structure comprising: A main body portion; a substrate holding member having a wiring substrate on one surface and the other surface fixed to the main body; A connector which is joined to the wiring board of the board holding member and connects the wiring of the wiring board and the coaxial cable via a connection terminal, and And an impedance adjusting unit for adjusting a gap between the connecting terminal and the impedance adjusting unit to perform impedance matching.
2. 2. The probe structure according to claim 1, wherein, The substrate holding member is provided with a space around the connection terminal, The main body portion has a through hole at a position corresponding to the space provided in the substrate holding member, The impedance adjusting section has a rod-shaped member that can be pushed and pulled through the through hole of the main body section, and adjusts a gap between the connection terminal and the rod-shaped member.
3. 3. The probe structure according to claim 1, wherein, The substrate holding member, the main body portion, the connector, and the impedance adjusting portion are all grounded.
4. 4. The probe structure according to claim 2, wherein, The tip end of the rod-shaped member of the impedance adjusting section is an end surface.
5. 5. The probe structure according to claim 1, wherein, The wiring substrate of the substrate holding member is a flexible substrate.
6. 6. An inspection apparatus for inspecting an electrical characteristic of an object to be inspected using a high-frequency signal, the inspection apparatus being characterized in that, Comprises a probe structure for electrically contacting the contact portion with the electrode of the object to be inspected, transmitting and receiving a high-frequency signal to and from the object to be inspected, The probe structure according to any one of claims 1 to 5.

Description

Probe structure and inspection device Technical Field The present invention relates to a probe structure and an inspection apparatus, and is applicable to, for example, a probe structure and an inspection apparatus used for inspecting electrical characteristics of a high-frequency device such as a semiconductor integrated circuit. Background For example, in inspecting electrical characteristics of semiconductor integrated circuits on a semiconductor wafer, a probe device for performing probe alignment is used. In particular, in order to examine the electrical characteristics of a high-frequency device, a high-frequency probe for transmitting and receiving a high-frequency signal to and from the high-frequency device is used. Fig. 2 is a schematic diagram of a probe structure used for inspecting a conventional high-frequency object. In fig. 2, a conventional probe structure 90 includes a lower side floor 91, a probe substrate 92, a mounting portion 93, a coaxial connector 95, and an upper side floor 99. The probe structure 90 is assembled by screwing the screw 96 into the mounting through hole 93a and the screw hole 91 a. When a coaxial cable connected to the coaxial connector 95 is in contact with a contact pad (also referred to as an "input/output signal terminal") 951, the coaxial cable is electrically connected. Prior art literature Patent literature [ Patent document 1] Japanese patent laid-open No. 2006-194765 Disclosure of Invention Problems to be solved by the invention However, when a member connected to the Ground (GND) is present near the input/output signal terminal, the characteristic impedance of the input/output signal terminal may be lowered, which may affect the high-frequency measurement. Accordingly, in view of the above-described problems, the present invention aims to provide a probe structure and an inspection apparatus that can obtain matching of characteristic impedance at a connection terminal serving as a relay point of a signal circuit. Technical means for solving the problems In order to solve the above-described problems, a first aspect of the present invention is a probe structure for transmitting and receiving a high-frequency signal to and from an object to be inspected via a contact portion that is in electrical contact with an electrode of the object to be inspected, comprising a main body portion, a substrate holding member having a wiring substrate on one surface and the other surface fixed to the main body portion, a connector that is joined to the wiring substrate of the substrate holding member and connects the wiring of the wiring substrate and a coaxial cable via a connection terminal, and an impedance adjustment portion that adjusts a gap between the wiring substrate and the connection terminal to perform impedance matching. A second aspect of the present invention is an inspection apparatus for inspecting an electrical characteristic of an object to be inspected using a high-frequency signal, comprising a probe structure for electrically contacting a contact portion with an electrode of the object to be inspected and transmitting and receiving the high-frequency signal to and from the object to be inspected, the probe structure according to the first aspect. ADVANTAGEOUS EFFECTS OF INVENTION According to the present invention, matching of characteristic impedance at the connection terminal as a relay point of the signal circuit can be obtained. Drawings Fig. 1 is a configuration diagram showing an external configuration of a probe structure according to an embodiment. Fig. 2 is a schematic diagram of a probe structure mounted on a conventional high-frequency probe device. FIG. 3 is an explanatory view illustrating a connection structure of a conventional probe structure. Fig. 4 is an overall configuration diagram showing the overall configuration of the semiconductor inspection apparatus according to the embodiment. Fig. 5 is an explanatory view illustrating a connection structure of the probe structure according to the embodiment. Fig. 6 is a diagram showing the impedance of a transmission path equivalent circuit and a conventional input/output signal terminal. Fig. 7 is a diagram showing the impedance of the input/output signal terminals before and after adjustment according to the embodiment. Fig. 8 is a diagram showing return loss waveforms before and after adjustment of impedance in the embodiment. Detailed Description (A) Description of the embodiments Embodiments of a probe structure and an inspection apparatus according to the present invention are described in detail below with reference to the drawings. In this embodiment, a case of being applied to a semiconductor inspection apparatus for inspecting electrical characteristics of a high-frequency device on a semiconductor wafer is described as an example of the inspection apparatus of the present invention. Further, as an example of the probe structure of the present invention, a case of being applied to a