CN-121995090-A - Manufacturing method of multi-carrier probe card and probe card

Abstract

The invention discloses a manufacturing method of a multi-carrier probe card, which comprises the steps of firstly carrying out reference positioning and horizontal correction on a PCB, then aligning and fixing a second carrier on the PCB, then transferring a component to a pin adjusting device, carrying out accurate calibration on the second carrier by taking a standard datum point fixed on an integrated glass mask of the device as a unified space datum, and finally carrying out step-by-step fine adjustment and fixing on a first carrier and a third carrier in sequence by taking the calibrated second carrier and the standard datum point as common datum, so that the pin position deviation of a needle point among the carriers is less than or equal to 10 mu m. According to the method, the multistage positioning flow of 'fixed intermediate carrier-high-precision reference calibration-step-by-step reference alignment' is established, so that error accumulation is effectively controlled, high-precision cooperative positioning among multiple carriers is realized, and the testing precision and the product yield of the probe card are improved.

Inventors

• LI HUASHENG
• LAO JIE
• Luo Yonggu

Assignees

• 上海道格特科技有限公司

Dates

Publication Date

20260508

Application Date

20260120

Claims (10)

1. 1. The manufacturing method of the multi-carrier probe card is characterized by comprising the following steps: S1, fixing a PCB (printed circuit board) on a jig, performing horizontal correction, and establishing an initial reference; s2, aligning and fixing a second carrier at a target position of the PCB; S3, transferring the jig fixed with the PCB and the second carrier to needle adjusting equipment, accurately calibrating the second carrier by using a standard datum point fixed on an integrated glass mask of the needle adjusting equipment, and adjusting the position of the jig through observation of an image acquisition module of the needle adjusting equipment so that the positions of a datum mark point of the PCB and an alignment mark of the second carrier are consistent with the standard datum point; and S4, sequentially aligning and fixing the first carrier and the third carrier on the PCB by taking the calibrated second carrier and the standard datum point as common datum, wherein the alignment of the first carrier and the third carrier meets the condition that the needle position deviation between the needle point of the first carrier and the needle point of the second carrier is less than or equal to 10 mu m, and the alignment mark of the first carrier and the third carrier is aligned with the standard datum point.
2. 2. The method of claim 1, wherein the integrated glass mask is made of sapphire, quartz or glass.
3. 3. The method of manufacturing a multi-carrier probe card according to claim 2, wherein the integrated glass mask has a mohs hardness of 5 or more, a transmittance of 85 or more, and a thickness of 380 μm or less.
4. 4. The method of manufacturing a multi-carrier probe card according to claim 1, wherein in the steps S2 and S4, the carrier is fixed to the PCB board by coating and curing the adhesive material, and the curing operation is performed after the alignment is completed.
5. 5. The method of manufacturing a multi-carrier probe card of claim 4, wherein the adhesive material is an ultraviolet light curable resin or a thermosetting resin.
6. 6. The method of manufacturing a multi-carrier probe card according to claim 1, wherein in step S1, the level correction is assisted by a projector capturing an image of a fiducial mark point on the PCB.
7. 7. The method of manufacturing a multi-carrier probe card according to claim 1, wherein in step S3, the needle adjusting apparatus is provided with a reference frame and a laser positioning system for fixing and positioning the integrated glass mask.
8. 8. The method according to claim 1, wherein in step S4, visual feedback is provided by the image acquisition module of the pin adjustment device to guide and use the fine adjustment mechanism of the pin adjustment device to fine adjust the positions of the first carrier and the third carrier.
9. 9. A multi-carrier probe card manufactured by the method of any one of claims 1 to 8.
10. 10. The multi-carrier probe card of claim 9, wherein in the probe card, a needle tip needle position deviation between the first carrier, the second carrier, and the third carrier is 10 μm or less.

Description

Manufacturing method of multi-carrier probe card and probe card Technical Field The invention relates to the technical field of semiconductor testing, in particular to a manufacturing method of a multi-carrier probe card for testing semiconductor chips such as display driving chips and the like and the probe card. Background In the manufacturing process of semiconductor chips, probe testing is a key element for ensuring chip performance and yield. With the continuous evolution of chip manufacturing process and the complicated structure, single-carrier probe cards have been difficult to meet the requirements of multi-area and high-density testing, so that probe cards adopting multi-carrier (i.e. a plurality of independent needle point group carriers) to cooperatively work have become a development trend. However, the introduction of multi-carrier systems presents new technical challenges in that the relative needle tip (i.e., probe) position (needle position) bias between different carriers is difficult to control accurately. In the prior positioning technology, because the carrier mounting errors are accumulated greatly, the needle point needle position deviation among a plurality of carriers is difficult to be controlled within 10 mu m required by the prior process, so that the probe and the chip bonding pad are misplaced during testing, and the problems of test signal distortion, product yield reduction and the like are caused. Prior art solutions have been aimed at improving the accuracy of needle position correction. For example, publication TW111110234a discloses a needle position correction sheet jig and a probe correction device, which support a needle position correction sheet by providing a rigid transparent substrate (such as glass, quartz or sapphire) on a hollowed window of a jig frame, so as to improve the flatness of the correction sheet, thereby improving the accuracy of single needle position correction. The scheme mainly solves the problem of warping and deformation of the correction sheet caused by suspension. However, it does not address the fundamental challenge of how to co-locate multiple individual carriers on a single probe card to achieve high precision control of the relative needle position between them. Therefore, how to realize accurate control (less than or equal to 10 μm) of needle point needle position deviation among multiple carriers becomes a technical problem to be solved in the field. Disclosure of Invention The invention aims to overcome the defects of the prior art and provides a manufacturing method of a multi-carrier probe card, which can stably control the needle point position deviation among a plurality of carriers within 10 mu m by establishing a set of multi-stage positioning calibration flow based on unified high-precision reference. In order to achieve the above purpose, the invention adopts the following technical scheme: In one aspect, the present invention provides a method for manufacturing a multi-carrier probe card, comprising the steps of: S1, PCB reference positioning and horizontal correction. The PCB is fixed on the jig, and the jig is arranged on a projector workbench. And acquiring a reference mark point on the PCB by the projector, adjusting the gesture of the jig, enabling the PCB to be in a horizontal state and fixed, ensuring that a reference surface of the PCB is parallel to an imaging surface of the projector, and establishing an initial assembly reference. S2, aligning and fixing the second carrier. And coating a bonding material at a preset position of the second carrier, and transferring the second carrier coated with the bonding material to a target assembly area on the PCB so as to be attached to the surface of the PCB. And acquiring the needle point distribution area on the second carrier and the reference mark point of the PCB in real time through the projector, and finely adjusting the position and the angle of the second carrier according to imaging information so as to align the needle point of the second carrier with a preset alignment mark on the PCB. After being adjusted in place, the bonding material is cured, thereby fixing the second carrier to the PCB. S3, accurate calibration based on the integrated glass mask. And transferring the jig fixed with the PCB and the second carrier to a working area of the needle adjusting device and fixing the jig. And the needle adjusting equipment positions the integrated glass mask through a laser positioning system of the needle adjusting equipment so as to ensure the position stability of the integrated glass mask. The standard datum point on the integrated glass mask is captured through the image acquisition module of the needle adjusting device, the standard datum point is used as a unified space datum, the position of the jig is adjusted, and the datum mark point of the PCB and the alignment mark of the second carrier are overlapped with the standard datum point on the integrated glass m