CN-121995187-A - Power supply device for semiconductor test based on electrical sensor

CN121995187ACN 121995187 ACN121995187 ACN 121995187ACN-121995187-A

Abstract

The application discloses a power supply device for semiconductor test based on an electrical sensor, and relates to the technical field of semiconductor test. The power supply device for the semiconductor test based on the electrical sensor comprises a power supply assembly and a test bin, wherein a cold air input pipe is arranged on the side face of the power supply assembly, a power supply element placing bin is arranged in the power supply assembly, a magnetic power supply element I is arranged in the power supply element placing bin, a penetrating hydraulic bin I is arranged on the side face of the power supply assembly, a hydraulic bin II communicated with the hydraulic bin I is arranged on the side face of the hydraulic bin I, one end of the hydraulic bin I is connected with a control rod in a sliding mode through a piston, and the other end of the hydraulic bin I is connected with a transmission rod I in a sliding mode through the piston. The application is used for solving the problem that when the voltage of the magnetic power supply element in the device is insufficient due to the detection of different semiconductors, a new power supply element is difficult to quickly increase.

Inventors

LI RONGJIA
XU CHANGCHENG
HOU JINGBO
LI FUCHUAN
YANG RUI

Assignees

上海骏森明电子科技有限公司

Dates

Publication Date: 20260508
Application Date: 20260204

Claims (9)

1. The power supply device for semiconductor test based on the electrical sensor comprises a power supply assembly and a test bin, and is characterized in that a cold air input pipe is arranged on the side surface of the power supply assembly, a power supply element placing bin is arranged in the power supply assembly, and a magnetic power supply element I is arranged in the power supply element placing bin; The side of power supply unit is equipped with the hydraulic pressure storehouse one that runs through, the side of hydraulic pressure storehouse one be equipped with hydraulic pressure storehouse two of hydraulic pressure storehouse one intercommunication, the one end of hydraulic pressure storehouse one is through setting up piston sliding connection's control rod, the other end of hydraulic pressure storehouse one has transfer line one through setting up piston sliding connection, the bottom of hydraulic pressure storehouse two is through setting up piston sliding connection's transfer line two, be equipped with the driving medium that is used for the transmission between control rod and transfer line one and the transfer line two, the inside of power supply unit is equipped with cooling module, the inside of power supply unit is equipped with supplementary pressing assembly.
2. The power supply device for semiconductor testing based on the electrical sensor of claim 1, wherein the transmission member comprises a blocking block rotatably connected in the first hydraulic bin, a first rotating rod with damping is fixedly connected to the top of the blocking block, a limiting block is fixedly connected to the side face of the first transmission rod, and a second magnetic power supply element is arranged at the bottom of the second transmission rod.
3. The power supply device for semiconductor testing based on the electrical sensor of claim 2, wherein the blocking member is in a state of blocking the second hydraulic chamber when the blocking member is not in use.
4. The power supply device for semiconductor testing based on the electrical sensor of claim 2, wherein the cooling assembly comprises a transmission rod III fixed on the two sides of the transmission rod, a wind wheel is rotationally connected to the side of the cold air input tube, a telescopic rod is fixedly connected to the bottom of the wind wheel, a bevel gear I is fixedly connected to the bottom of the telescopic rod, a torsion spring rod is rotationally connected to the top of the testing bin, a bevel gear II and a sprocket I are respectively and fixedly connected to the outer side of the torsion spring rod, a chain is assembled on the outer side of the sprocket I, a guide rod is rotationally connected to the inner side of the power supply assembly, a sprocket II is fixedly connected to the outer side of the guide rod, and a guide plate is fixedly connected to the side of the guide rod.
5. The power supply device for semiconductor testing based on the electrical sensor of claim 4, wherein the telescopic end of the telescopic rod is located at the side surface of the third transmission rod and is in a rotary connection state with the third transmission rod.
6. The power supply device for semiconductor testing based on an electrical sensor as claimed in claim 4, wherein the end of the chain, which is far away from the first sprocket, is mounted at an outer position of the second sprocket.
7. The power supply device for semiconductor testing based on the electrical sensor of claim 4, wherein the auxiliary pressing assembly comprises a third hydraulic bin assembled at the top of the testing bin, the top of the third hydraulic bin is slidably connected with a force rod through a piston, a first spring is assembled at the bottom of the force rod, a hydraulic hose communicated with the first spring is assembled on the side face of the third hydraulic bin, a fourth hydraulic bin is assembled on the side face of the first transmission rod, a moving block is slidably connected to the side face of the fourth hydraulic bin through the piston, a transmission plate is fixedly connected to the side face of the moving block, and a second spring is assembled between the transmission plate and the limiting block.
8. The power supply device for semiconductor testing based on the electrical sensor of claim 7, wherein one end of the spring I, which is far away from the stress rod, is assembled on the inner wall of the hydraulic bin III.
9. The power supply device for semiconductor testing based on the electrical sensor of claim 7, wherein the end, far away from the third hydraulic bin, of the hydraulic hose is assembled at the side surface of the fourth hydraulic bin and is communicated with the fourth hydraulic bin.

Description

Power supply device for semiconductor test based on electrical sensor Technical Field The invention belongs to the technical field of semiconductor testing, and particularly relates to a power supply device for semiconductor testing based on an electrical sensor. Background The semiconductor laser aging test is to supply power to the semiconductor laser with a preset power through a laser power supply, so that the semiconductor laser continuously works with a preset load, and in the process, whether the semiconductor laser has defects is judged by detecting the power output state of the semiconductor laser and the deviation state of the light-emitting wave band of the semiconductor laser. The Chinese patent CN111239581A published in 6/5 of 2020 discloses a single-tube semiconductor laser aging test device, which comprises a carrying platform, a power supply lap joint and a probe assembly, wherein the carrying platform is used for carrying a pre-tested single-tube semiconductor laser, the power supply lap joint is arranged on the carrying platform and connected with the probe assembly, and the power supply lap joint is used for extending to a preset position on the upper side of the pre-tested single-tube semiconductor laser so as to enable the end part of the probe assembly to be in contact with an electrode of the pre-tested single-tube semiconductor laser. In the above application document, the current is input to the detection probe to perform corresponding detection operation on the semiconductor in the detection bin, and when the device detects different semiconductors, the voltage of the magnetic power supply element inside the device is insufficient, so that it is difficult to quickly increase a new power supply element, thereby affecting the service efficiency of the device. Disclosure of Invention Aiming at the defects of the prior art, the invention provides a power supply device for semiconductor test based on an electrical sensor, which solves the problems in the prior art. The power supply device for semiconductor test based on the electrical sensor comprises a power supply assembly and a test bin, wherein a cold air input pipe is arranged on the side surface of the power supply assembly, a power supply element placing bin is arranged in the power supply assembly, and a magnetic power supply element I is arranged in the power supply element placing bin; The side of power supply unit is equipped with the hydraulic pressure storehouse one that runs through, the side of hydraulic pressure storehouse one be equipped with hydraulic pressure storehouse two of hydraulic pressure storehouse one intercommunication, the one end of hydraulic pressure storehouse one is through setting up piston sliding connection's control rod, the other end of hydraulic pressure storehouse one has transfer line one through setting up piston sliding connection, the bottom of hydraulic pressure storehouse two is through setting up piston sliding connection's transfer line two, be equipped with the driving medium that is used for the transmission between control rod and transfer line one and the transfer line two, the inside of power supply unit is equipped with cooling module, the inside of power supply unit is equipped with supplementary pressing assembly. Preferably, the transmission piece comprises a blocking piece rotationally connected in the first hydraulic bin, the top of the blocking piece is fixedly connected with a first rotating rod with damping, the side face of the first transmission rod is fixedly connected with a limiting block, and the bottom of the second transmission rod is provided with a second magnetic-attraction type power supply element. Through the setting of device, can open the power supply component earlier and place the storehouse, with magnetism again inhale power supply component two assembly in power supply component places the storehouse, improved the availability factor of device. Preferably, the blocking block is in a state of blocking the second hydraulic bin when not in use. Preferably, the cooling assembly comprises a transmission rod III fixed on the two sides of the transmission rod, the side face of the cold air input tube is rotationally connected with a wind wheel, the bottom of the wind wheel is fixedly connected with a telescopic rod, the bottom of the telescopic rod is fixedly connected with a bevel gear I, the top of the test bin is rotationally connected with a torsion spring rod, the outer sides of the torsion spring rod are respectively fixedly connected with a bevel gear II and a sprocket I, the outer sides of the sprocket I are provided with chains, the inner part of the power supply assembly is rotationally connected with a guide rod, the outer sides of the guide rod are fixedly connected with a sprocket II, and the sides of the guide rod are fixedly connected with guide plates. Through the setting of cooling module, can be after increasing the power supply component, with