CN-121995199-A - Internal heating test method, system, equipment and storage medium of memory chip

CN121995199ACN 121995199 ACN121995199 ACN 121995199ACN-121995199-A

Abstract

The application provides an internal heating test method, system, equipment and storage medium of a memory chip, and relates to the technical field of semiconductors, wherein the method comprises the steps of applying electric excitation signals to each storage body of a target memory chip one by one so as to enable each storage body to continuously perform characteristic heating in sequence; the temperature observation device is controlled to sequentially collect multi-view infrared thermal image atlas of each storage body and record collected information, image preprocessing and data extraction are carried out on the multi-view infrared thermal image atlas to obtain a temperature dataset, data association analysis is carried out according to the temperature dataset and the collected information to obtain a temperature coordinate association dataset, and three-dimensional surface fitting is carried out according to the temperature coordinate association dataset to obtain a temperature distribution model of a target memory chip. The application precisely controls the working state of each memory bank, obviously improves the accuracy of heat source positioning, effectively maintains the integrity of the chip structure while ensuring the test accuracy, and realizes the obvious improvement of the test efficiency.

Inventors

LI QIONG
ZHANG HENGJIA

Assignees

皇虎测试科技(深圳)有限公司

Dates

Publication Date: 20260508
Application Date: 20260408

Claims (10)

1. An internal heating test method for a memory chip is characterized by comprising the following steps: Applying an electric excitation signal to each memory bank of the target memory chip one by one so as to enable each memory bank to continuously perform characteristic heating in sequence; Controlling temperature observation equipment to sequentially acquire multi-view infrared thermal image sets of all the memory banks, and recording acquisition information; performing image preprocessing and data extraction on the multi-view infrared thermal image atlas to obtain a temperature dataset; carrying out data association analysis according to the temperature data set and the acquired information to obtain a temperature coordinate association data set; and performing three-dimensional surface fitting according to the temperature coordinate associated data set to obtain a temperature distribution model of the target memory chip.
2. The method of claim 1, wherein before applying the electrical stimulus signal to each bank of the target memory chip one by one, the method further comprises: and performing hierarchical independent activation on each stacked layer of the target memory chip based on the chip select pin signal.
3. The internal heat test method of claim 2, wherein the performing hierarchical independent activation of each stacked layer of the target memory chip based on the chip select pin signal comprises: before the electric excitation signal is applied, a chip selection pin signal of a target stacking layer of the target memory chip is controlled to be set to be high level, and the target stacking layer is activated; after all the memory banks of the target stack layer are activated, controlling a chip selection pin signal of the target stack layer of the target memory chip to be set to be low level, and closing the target stack layer; And traversing each stacking layer of the target memory chip until all the stacking layers are activated and closed.
4. The method for testing internal heat generation of a memory chip according to claim 1, wherein applying an electrical stimulus signal to each bank of a target memory chip one by one to sequentially continue each of the banks to perform characteristic heat generation, comprises: Setting a reference test voltage of the target memory chip, and controlling the target memory chip to run for a preset time period in a precharge power saving mode; Switching the target memory chip to a target test voltage, independently activating a target word line of a first target memory bank, and circularly executing activation precharge operation to a preset cycle number; Switching the target memory chip back to the reference test voltage, and controlling the target memory chip to operate in the precharge power saving mode for the preset time period again; Switching the target memory chip to a target test voltage, independently activating a target word line of a second target memory bank, and circularly executing an activation precharge operation to the preset cycle times; And repeatedly executing the voltage switching and the precharge power saving mode operation of the target memory chip, traversing and activating each memory bank and circularly executing the activation precharge operation until all the memory banks are activated.
5. The method for testing internal heat generation of a memory chip according to claim 4, wherein the controlling the temperature observation device sequentially collects multi-view infrared thermal image sets of the respective memory banks and records collected information, comprising: determining an angle adjusting range according to the size information of the target memory chip and the lens observing visual field range of the temperature observing device; Setting an angle adjustment interval according to the angle adjustment range, and determining a plurality of shooting points based on the angle adjustment interval; And controlling the temperature observation equipment to move to each shooting point position one by one to sequentially acquire images of the activated target storage body, obtaining the multi-view infrared thermal image atlas, and recording acquisition information of each image acquisition, wherein the acquisition information at least comprises a horizontal angle, a vertical angle and acquisition time.
6. The method for testing internal heat generation of a memory chip according to claim 1, wherein the performing image preprocessing and data extraction on the multi-view infrared thermal image atlas to obtain a temperature dataset comprises: carrying out noise reduction treatment on the infrared thermal image in the multi-view infrared thermal image set to obtain an initial infrared thermal image; Extracting temperature data of an effective area in the initial infrared thermal image to obtain an initial temperature data set; And verifying the consistency of the initial temperature data set according to the temperature distribution rule of the target memory chip to obtain the temperature data set.
7. The method for testing internal heat generation of a memory chip according to claim 6, wherein the performing data association analysis according to the temperature dataset and the acquired information to obtain a temperature coordinate association dataset comprises: constructing a three-dimensional rectangular coordinate system by taking the geometric center of the target memory chip as an origin; establishing a first mapping relation between temperature data of each horizontal angle under the same vertical angle and the three-dimensional rectangular coordinate system to obtain first normalized data; Establishing a second mapping relation between the temperature data of each vertical angle under the same horizontal angle and the three-dimensional rectangular coordinate system to obtain second normalized data; And integrating the first normalized data and the second normalized data to obtain the temperature coordinate correlation data set.
8. An internal heat generation test system for a memory chip, the system comprising: The chip test module is used for applying an electric excitation signal to each memory bank of the target memory chip one by one so as to enable each memory bank to continuously perform characteristic heating in sequence; the image acquisition module is used for controlling the temperature observation equipment to sequentially acquire multi-view infrared thermal image sets of the storage bodies and recording acquisition information; The data processing module is used for carrying out image preprocessing and data extraction on the multi-view infrared thermal image atlas to obtain a temperature data set; The data analysis module is used for carrying out data association analysis according to the temperature data set and the acquired information to obtain a temperature coordinate association data set; And the model generation module is used for carrying out three-dimensional surface fitting according to the temperature coordinate association data set to obtain a temperature distribution model of the target memory chip.
9. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein execution of the computer program by the processor implements the internal heat generation testing method of the memory chip of any one of claims 1-7.
10. A computer readable storage medium having stored thereon a computer program, which when executed by a processor implements the internal heat generation testing method of the memory chip of any of claims 1-7.

Description

Internal heating test method, system, equipment and storage medium of memory chip Technical Field The present application relates to the field of semiconductor technologies, and in particular, to a method, a system, an apparatus, and a storage medium for testing internal heating of a memory chip. Background With the continuous improvement of the performance of electronic devices, the integration level and the operating frequency of memory chips serving as data exchange and storage core components have a significant trend to increase, resulting in a rapid increase of the power consumption density. The thermal effects inside the chip directly affect the signal timing stability, the data retention characteristics and the leakage parameters, and in extreme cases, even thermal runaway may be induced. However, existing temperature monitoring techniques rely primarily on contact sensors or infrared thermal imaging systems on the chip surface. The traditional method has the problem of response lag, and can only acquire the average temperature value of the surface of the packaging shell or the chip, but cannot penetrate the multilayer structure to accurately measure the transient temperature fluctuation of the micro-scale area inside the chip, so that the traditional method is difficult to provide effective guidance for accurate thermal management design and dynamic power consumption control. Therefore, it is needed to solve the problem that the conventional temperature measurement method is difficult to accurately capture the temperature variation of the fine area inside the memory chip. Disclosure of Invention In view of the above-mentioned shortcomings of the prior art, the present application provides a method, a system, a device and a storage medium for testing internal heating of a memory chip, which effectively solve the problem that the conventional temperature measurement method is difficult to accurately capture the temperature change of a fine area inside the memory chip. In a first aspect, the present application provides a method for testing internal heat of a memory chip, the method comprising: Applying an electric excitation signal to each memory bank of the target memory chip one by one so as to enable each memory bank to continuously perform characteristic heating in sequence; Controlling temperature observation equipment to sequentially acquire multi-view infrared thermal image sets of all the memory banks, and recording acquisition information; performing image preprocessing and data extraction on the multi-view infrared thermal image atlas to obtain a temperature dataset; carrying out data association analysis according to the temperature data set and the acquired information to obtain a temperature coordinate association data set; and performing three-dimensional surface fitting according to the temperature coordinate associated data set to obtain a temperature distribution model of the target memory chip. In an alternative embodiment, before the applying the electrical excitation signal to each bank of the target memory chip, the method further includes: and performing hierarchical independent activation on each stacked layer of the target memory chip based on the chip select pin signal. In an alternative embodiment, the performing the hierarchical independent activation on each stacked layer of the target memory chip based on the chip select pin signal includes: before the electric excitation signal is applied, a chip selection pin signal of a target stacking layer of the target memory chip is controlled to be set to be high level, and the target stacking layer is activated; after all the memory banks of the target stack layer are activated, controlling a chip selection pin signal of the target stack layer of the target memory chip to be set to be low level, and closing the target stack layer; And traversing each stacking layer of the target memory chip until all the stacking layers are activated and closed. In an alternative embodiment, the applying an electrical excitation signal to each memory bank of the target memory chip one by one, so that each memory bank continuously generates characteristic heat sequentially includes: Setting a reference test voltage of the target memory chip, and controlling the target memory chip to run for a preset time period in a precharge power saving mode; Switching the target memory chip to a target test voltage, independently activating a target word line of a first target memory bank, and circularly executing activation precharge operation to a preset cycle number; Switching the target memory chip back to the reference test voltage, and controlling the target memory chip to operate in the precharge power saving mode for the preset time period again; Switching the target memory chip to a target test voltage, independently activating a target word line of a second target memory bank, and circularly executing an activation precharge operation to the preset cyc