CN-121995585-A - Optical module

CN121995585ACN 121995585 ACN121995585 ACN 121995585ACN-121995585-A

Abstract

The application discloses an optical module, which relates to the technical field of optical communication equipment packaging, and comprises a shell, a circuit board, a heat sink, an emitting end assembly and a first photoelectric chip, wherein the circuit board is provided with an upper surface and a lower surface which are opposite to each other and provided with through holes along the thickness direction of the circuit board, the heat sink is connected with the lower surface of the circuit board and at least partially covers the through holes, the emitting end assembly is arranged on the heat sink and at least partially positioned in the coverage area of the through holes, the first photoelectric chip is arranged on the heat sink or the lower surface of the circuit board and is electrically connected with the circuit board, light emitted by the emitting end assembly is incident into the first photoelectric chip and is emitted out of the first photoelectric chip after being processed by the first photoelectric chip, and the optical module improves the space utilization rate in the vertical direction of the optical module by arranging the through holes on the circuit board and adjusting the positions of the optical chips of the emitting end, further improves the element integration level and the heat dissipation performance, and simultaneously improves the signal transmission rate and the signal integrity.

Inventors

DING HAI
YAN ZHENG
YU DENGQUN
SUN YUZHOU

Assignees

苏州旭创科技有限公司
新加坡泰跃科技有限公司

Dates

Publication Date: 20260508
Application Date: 20241108

Claims (11)

1. An optical module, comprising: A housing having a mounting cavity formed therein; The circuit board is arranged in the mounting cavity and provided with an upper surface and a lower surface which are opposite to each other, and the circuit board is provided with a through hole along the thickness direction; the heat sink is arranged in the mounting cavity and connected with the lower surface of the circuit board, and at least part of the heat sink covers the through hole; The transmitting end assembly is arranged on the heat sink and at least partially positioned in the coverage range of the through hole; The first photoelectric chip is arranged on the heat sink or on the lower surface of the circuit board and is electrically connected with the circuit board, and the first photoelectric chip is at least partially positioned in the through hole or at least partially positioned in the coverage range of the through hole; The light emitted by the emitting end assembly is incident into the first photoelectric chip, is processed by the first photoelectric chip and then is emitted from the first photoelectric chip.
2. An optical module as claimed in claim 1, characterized in that, The first photoelectric chip is provided with an upper surface and a lower surface which are opposite to each other, the lower surface of the first photoelectric chip is fixedly connected with the heat sink, the first photoelectric chip is completely accommodated in the through hole, the lower surface of the first photoelectric chip is flush with the lower surface of the circuit board, and the lower surface of the first photoelectric chip is electrically connected with the circuit board.
3. An optical module as claimed in claim 2, characterized in that, The lower surface of the first photoelectric chip is electrically connected with the lower surface of the circuit board through a binding gold wire.
4. An optical module as claimed in claim 3, characterized in that, The heat sink is provided with a notch at the position corresponding to the binding gold wire, one part of the lower surface of the first photoelectric chip is positioned at the notch, the other part of the lower surface of the first photoelectric chip is fixedly bonded with the heat sink, and the position where the lower surface of the first photoelectric chip is electrically connected with the circuit board is positioned in the notch.
5. An optical module as claimed in claim 2, characterized in that, One end of the first photoelectric chip, which is electrically connected with the circuit board, is abutted against the hole wall of the through hole of the circuit board.
6. An optical module as claimed in claim 3, characterized in that, One end of the first photoelectric chip, which is electrically connected with the circuit board, is suspended outside the heat sink, an electrical connection point is arranged at the part of the first photoelectric chip, which is suspended outside the heat sink, and the electrical connection point is electrically connected with the circuit board through a gold wire.
7. An optical module as claimed in claim 1, characterized in that, The heat sink is provided with a width matched with the circuit board, at least one part of edge positions of the heat sink, which faces to one side surface of the circuit board, form an adhesive area and are adhered to the lower surface of the circuit board, and at least one part of central positions of the heat sink form an element area for placing the transmitting end assembly and the first photoelectric chip; the element region at least partially covers the through hole; the transmitting end assembly includes at least a laser, a lens, and an isolator.
8. The optical module of claim 7, wherein the optical module is configured to, And a bump and/or a groove is arranged on one side surface of the heat sink facing the circuit board, and the position corresponding to the transmitting end assembly is provided with a bump and/or a groove so as to adjust the height of each device in the transmitting end assembly, so that light emitted by the laser is coupled to the first photoelectric chip.
9. The optical module of claim 1, further comprising a digital processing chip, The two opposite ends of the shell in the longitudinal direction are an electric interface and an optical interface of the optical module, the digital processing chip is arranged on the lower surface of the circuit board, and the digital processing chip is arranged between the first photoelectric chip and the electric interface and is electrically connected with the circuit board.
10. The optical module of claim 9, wherein the heat sink is in thermally conductive connection with the housing and the digital processing chip is in thermally conductive connection with the housing.
11. An optical module as claimed in claim 1, characterized in that, The receiving end assembly is arranged on the upper surface of the circuit board and is at least partially positioned in the coverage area of the through hole; the receiving end component is electrically connected with the circuit board.

Description

Optical module Technical Field The invention relates to the technical field of optical communication equipment packaging, in particular to an optical module. Background In the current optical communication technical field, the adoption of a silicon optical chip to realize the photoelectric conversion function is a mainstream technical scheme adopted by a high-speed optical module. In some high-speed optical modules, a silicon optical chip is only applied to a transmitting end, while a receiving end still adopts a traditional Photodiode (PD) to perform photoelectric signal conversion, typically, the PD and a transimpedance amplifier (Trans-IMPEDANCE AMPLIFIER, TIA) are bonded on a circuit board, gold wire bonding is adopted between the PD and the transimpedance amplifier, a light receiving surface of the PD is parallel to a board surface of the circuit board, an optical signal of the receiving end is also parallel to the board surface of the circuit board when being emitted from an optical fiber array, and in order to couple the optical signal of the receiving end to the light receiving surface, an optical fiber array with an inclined end surface and a lens are required to be used, so that the inclined end surface is matched with the lens, and the turning and convergence of an optical path are performed. Because the space of the lengthwise direction in the casing of whole optical module is very limited, in conventional technical scheme, the light path of receiving terminal carries out light path turn and gathers above PD receipts plain noodles, and the adjustment degree of difficulty of light path height is great, needs to bond the cushion of a take-up altitude between the optic fibre array of receiving terminal and the circuit board for adjust the light path and turn the distance between department and the receipts plain noodles, this scheme is unfavorable for the coupling equipment between the device, has prevented the heat dissipation of device simultaneously to a certain extent by the circuit board. Disclosure of Invention The application provides an optical module, which aims to solve the problem of limited space of a high-speed optical module in the prior art. The application provides an optical module, which comprises a shell, a circuit board, a heat sink, an emitting end component and a first photoelectric chip, wherein an installation cavity is formed in the shell, the circuit board is arranged in the installation cavity and is provided with an upper surface and a lower surface which are opposite to each other, the circuit board is provided with a through hole along the thickness direction, the heat sink is arranged in the installation cavity and is connected with the lower surface of the circuit board, the heat sink at least partially covers the through hole, the emitting end component is arranged on the heat sink and is at least partially positioned in the coverage area of the through hole, the first photoelectric chip is arranged on the lower surface of the circuit board and is electrically connected with the circuit board, and at least partially positioned in the through hole or at least partially positioned in the coverage area of the through hole, and light emitted by the emitting end component is incident into the first photoelectric chip and is emitted from the first photoelectric chip after being processed by the first photoelectric chip. In some embodiments of the present application, further, the first optoelectronic chip has an upper surface and a lower surface that are opposite to each other, the lower surface is connected to the heat sink, the lower surface of the first optoelectronic chip is flush with the lower surface of the circuit board, and the lower surface of the first optoelectronic chip is electrically connected to the circuit board. Further, the lower surface of the first photoelectric chip is electrically connected with the lower surface of the circuit board through a binding gold wire. Furthermore, a notch is arranged at the position of the heat sink corresponding to the binding gold wire, one part of the lower surface of the first photoelectric chip is positioned at the notch, the other part of the lower surface of the first photoelectric chip is fixedly bonded with the heat sink, and the position where the lower surface of the first photoelectric chip is electrically connected with the circuit board is positioned in the notch. Further, one end of the first photoelectric chip, which is electrically connected with the circuit board, is abutted against the circuit board. Furthermore, one end of the first photoelectric chip, which is electrically connected with the circuit board, is suspended outside the heat sink, and an electrical connection point is arranged at a part of the first photoelectric chip, which is suspended outside the heat sink, and the electrical connection point is electrically connected with the circuit board through a gold wire. In some embodiments of the